Philips php101nq04t_phb101nq04t Datasheet

Page 1
1. Product profile

1.1 Description

1.2 Features

PHP/PHB101NQ04T
N-channel TrenchMOS™ standard level FET
Rev. 01 — 12 May 2004 Product data
N-channel enhancement mode field-effect powertransistorina plastic package using TrenchMOS™ technology.
■ Standard level threshold ■ Very low on-state resistance.
■ Motors, lamps, solenoids ■ Uninterruptible power supplies
■ DC-to-DC converters ■ General industrial applications.

1.4 Quick reference data

■ VDS≤ 40 V ■ ID≤ 75 A
■ P
≤ 157 W ■ R
tot
DSon
≤ 8mΩ.

2. Pinning information

Table 1: Pinning - SOT78 (TO-220AB) and SOT404 (D2-PAK), simplified outline and symbol
Pin Description Simplified outline Symbol
1 gate (g) 2 drain (d) 3 source (s) mb mounting base;
connected to drain (d)
[1] It is not possible to make connection to pin 2 of the SOT404 package.
[1]
12mb3
SOT78 (TO-220AB)
MBK106
mb
2
13
SOT404 (D
2
-PAK)
MBK116
g
mbb076
d
s
Page 2
Philips Semiconductors
PHP/PHB101NQ04T
N-channel TrenchMOS™ standard level FET

3. Ordering information

Table 2: Ordering information
Type number Package
Name Description Version
PHP101NQ04T TO-220AB Plastic single-ended package; heatsink mounted; 1 mounting hole; 3 leads SOT78
2
PHB101NQ04T D
-PAK Plastic single-ended surface mounted package; 3 leads (one lead cropped) SOT404

4. Limiting values

Table 3: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DS
V
DGR
V
GS
I
D
I
DM
P
tot
T
stg
T
j
Source-drain diode
I
S
I
SM
Avalanche ruggedness
E
DS(AL)S
drain-source voltage (DC) 25 °C ≤ Tj≤ 175 °C - 40 V drain-gate voltage (DC) 25 °C ≤ Tj≤ 175 °C; RGS=20kΩ -40V gate-source voltage (DC) - ±20 V drain current (DC) Tmb=25°C; VGS=10V;Figure 2 and 3 -75A
= 100 °C; VGS=10V;Figure 2 -71A
T
mb
peak drain current Tmb=25°C; pulsed; tp≤ 10 µs; Figure 3 - 240 A total power dissipation Tmb=25°C; Figure 1 - 157 W storage temperature −55 +175 °C junction temperature −55 +175 °C
source (diode forward) current (DC) Tmb=25°C - 75 A peak source (diode forward) current Tmb=25°C; pulsed; tp≤ 10 µs - 240 A
non-repetitive drain-source avalanche energy
unclamped inductive load; ID=45A;
= 0.17 ms; VDD≤ 55 V; RGS=50Ω;
t
p
= 10 V; starting at Tj=25°C
V
GS
- 200 mJ
9397 750 13167
Product data Rev. 01 — 12 May 2004 2 of 13
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Page 3
Philips Semiconductors
PHP/PHB101NQ04T
N-channel TrenchMOS™ standard level FET
120
P
der
(%)
80
40
0
0 50 100 150 200
P
tot
P
der
-----------------------
P
tot 25 C°()
100%×= I
03aa16
T
mb
(°C)
Fig 1. Normalized total power dissipation as a
function of mounting base temperature.
3
10
120
I
der
(%)
80
40
0
0 50 100 150 200
I
D
der
-------------------
I
D25C
()
100%×=
°
03aq90
Tmb (°C)
Fig 2. Normalized continuous drain current as a
function of mounting base temperature.
03aq92
I
D
(A)
10
10
1
Limit R
2
1 10 10
DSon
= V
DS
/ I
D
tp = 10 µs
100 µs
DC
1 ms
10 ms
100 ms
VDS (V)
Tmb=25°C; IDM is single pulse; VGS=10V.
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage.
2
9397 750 13167
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data Rev. 01 — 12 May 2004 3 of 13
Page 4
Philips Semiconductors
PHP/PHB101NQ04T
N-channel TrenchMOS™ standard level FET

5. Thermal characteristics

Table 4: Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-mb)
R
th(j-a)
thermal resistance from junction to mounting base Figure 4 - - 0.95 K/W thermal resistance from junction to ambient
SOT78 vertical in still air - 60 - K/W SOT404 mounted on a printed-circuit
- 50 - K/W board; vertical in still air; minimum footprint.

5.1 Transient thermal impedance

03aq91
δ =
t
p
T
Z
th(j-mb) (K/W)
1
10
10
= 0.5
δ
0.2
0.1
0.05
0.02
-1 single pulse
P
-2
-4
10
-3
10
-2
10
-1
10
tp (s)
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration.
t
p
T
t
1
9397 750 13167
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data Rev. 01 — 12 May 2004 4 of 13
Page 5
Philips Semiconductors
PHP/PHB101NQ04T
N-channel TrenchMOS™ standard level FET

6. Characteristics

Table 5: Characteristics
Tj=25°C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
(BR)DSS
V
GS(th)
I
DSS
I
GSS
R
DSon
Dynamic characteristics
Q
g(tot)
Q
gs
Q
gd
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Source-drain diode
V
SD
t
rr
Q
r
drain-source breakdown voltage ID= 250 µA; VGS=0V
=25°C 40--V
T
j
= −55 °C 36--V
T
j
gate-source threshold voltage ID= 1 mA; VDS=VGS; Figure 9 and 10
=25°C 234V
T
j
= 175 °C 1--V
T
j
= −55 °C - - 4.4 V
T
j
drain-source leakage current VDS= 40 V; VGS=0V
=25°C --1µA
T
j
= 175 °C - - 500 µA
T
j
gate-source leakage current VGS= ±20 V; VDS= 0 V - 2 100 nA drain-source on-state resistance VGS=10V; ID=25A;Figure 7 and 8
=25°C - 6.6 8 mΩ
T
j
= 175 °C - 15.2 mΩ
T
j
total gate charge ID= 25 A; VDD=32V; VGS=10V; gate-source charge - 9.8 - nC
Figure 13
- 36.6 - nC
gate-drain (Miller) charge - 12.6 - nC input capacitance VGS=0V; VDS= 25 V; f = 1 MHz; output capacitance - 485 - pF
Figure 11
-2020-pF
reverse transfer capacitance - 215 - pF turn-on delay time VDD= 30 V; RL= 1.2 Ω;
=10V;RG=10Ω
V
rise time -51-ns
GS
-20-ns
turn-off delay time - 51 - ns fall time -33-ns
source-drain (diode forward) voltage IS= 25 A; VGS=0V;Figure 12 - 0.85 1.2 V reverse recovery time IS= 20 A; dIS/dt = −100 A/µs; VGS= 0 V - 53 - ns recovered charge - 44 - nC
9397 750 13167
Product data Rev. 01 — 12 May 2004 5 of 13
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Page 6
Philips Semiconductors
PHP/PHB101NQ04T
N-channel TrenchMOS™ standard level FET
V
GS
VDS (V)
03aq93
8 V
7 V
6 V
= 5 V
240
Tj = 25 °C
I
D
(A)
160
80
0
01234
10 V 9 V
Tj=25°CT
Fig 5. Output characteristics: drain current as a
function of drain-source voltage; typical values.
03aq94
9 V
10 V
R
(mΩ)
15
DSon
10
VGS = 7 VTj = 25 °C
8 V
80
VDS > ID x R
I
D
(A)
60
40
20
0
02468
=25°C and 175 °C; VDS> IDxR
j
DSon
Tj = 175 °C 25 °C
Fig 6. Transfer characteristics: drain current as a
function of gate-source voltage; typical values.
2
a
1.5
1
03aq95
VGS (V)
DSon
03aa27
5
0.5
0
0 80 160 240
ID (A)
Tj=25°C
Fig 7. Drain-source on-state resistance as a function
of drain current; typical values.
9397 750 13167
Fig 8. Normalized drain-source on-state resistance
0
-60 0 60 120 180
R
DSon
=
a
---------------------------- -
R
DSon 25 C°()
T
(°C)
j
factor as a function of junction temperature.
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data Rev. 01 — 12 May 2004 6 of 13
Page 7
Philips Semiconductors
PHP/PHB101NQ04T
N-channel TrenchMOS™ standard level FET
03aa32
V
5
GS(th)
(V)
4
3
2
max
typ
min
1
0
-60 0 60 120 180
ID= 1 mA; VDS=V
GS
T
(°C)
j
Fig 9. Gate-source threshold voltage as a function of
junction temperature.
4
10
-1
10
I
D
03aa35
(A)
-2
10
-3
10
-4
10
-5
10
-6
10
0246
maxtypmin
V
(V)
GS
Tj=25°C; VDS=5V
Fig 10. Sub-threshold drain current as a function of
gate-source voltage.
03aq97
C
(pF)
C
iss
3
10
C
oss
C
rss
2
10
-1
10
1 10 10
VDS (V)
2
VGS= 0 V; f = 1 MHz
Fig 11. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values.
9397 750 13167
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data Rev. 01 — 12 May 2004 7 of 13
Page 8
Philips Semiconductors
PHP/PHB101NQ04T
N-channel TrenchMOS™ standard level FET
80
VGS = 0 V
I
S
(A)
60
40
20
175 °C
0
0 0.3 0.6 0.9 1.2
Tj = 25 °C
03aq96
VSD (V)
10
V
ID = 25 A
GS
(V)
T
= 25 °C
j
8
6
4
2
0
0 10203040
Tj=25°C and 175 °C; VGS=0V ID= 25 A; VDD= 14 V and 32 V
Fig 12. Source (diode forward) current as a function of
source-drain (diode forward) voltage; typical
Fig 13. Gate-source voltage as a function of gate
charge; typical values.
values.
14 V
03aq98
VDD = 32 V
QG (nC)
9397 750 13167
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data Rev. 01 — 12 May 2004 8 of 13
Page 9
Philips Semiconductors
PHP/PHB101NQ04T
N-channel TrenchMOS™ standard level FET

7. Package outline

Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78
AE
p
A
1
q
D
1
D
(1)
L
1
b
L
1
L
2
mounting
base
Q
123
b
e
e
0 5 10 mm
scale
c
DIMENSIONS (mm are the original dimensions)
L
(1)
b
A
4.5
4.1
A
1.39
1.27
1
UNIT
mm
Note
1. Terminals in this zone are not tinned.
OUTLINE
VERSION
SOT78 SC-463-lead TO-220AB
b
c
1
1.3
1.0
0.7
0.4
0.9
0.7
IEC JEDEC EIAJ
D
D
15.8
6.4
15.2
5.9
REFERENCES
e
E
1
10.3
9.7
2.54
L
15.0
13.5
L
3.30
2.79
2
1
max.
3.0
qQ
p
3.8
3.0
3.6
2.7
EUROPEAN
PROJECTION
2.6
2.2
ISSUE DATE
00-09-07 01-02-16
Fig 14. SOT78 (TO-220AB).
9397 750 13167
Product data Rev. 01 — 12 May 2004 9 of 13
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Page 10
Philips Semiconductors
PHP/PHB101NQ04T
N-channel TrenchMOS™ standard level FET
Plastic single-ended surface mounted package (Philips version of D2-PAK); 3 leads (one lead cropped)
A
E
D
1
D
H
D
mounting
base
2
A
1
SOT404
13
e e
DIMENSIONS (mm are the original dimensions)
0.64
0.46
D
max.
11
UNIT
mm
A
4.50
4.10
OUTLINE VERSION
SOT404
A
1.40
1.27
b
1
0.85
0.60
IEC JEDEC EIAJ
D
1
1.60
10.30
1.20
9.70
REFERENCES
b
0 2.5 5 mm
scale
E
eLpH
2.90
2.54
2.10
D
15.80
14.80
Qc
2.60
2.20
L
p
c
Q
EUROPEAN
PROJECTION
ISSUE DATE
99-06-25 01-02-12
Fig 15. SOT404 (D2-PAK)
9397 750 13167
Product data Rev. 01 — 12 May 2004 10 of 13
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Page 11
Philips Semiconductors

8. Revision history

Table 6: Revision history
Rev Date CPCN Description
01 20040512 - Product data (9397 750 13167).
PHP/PHB101NQ04T
N-channel TrenchMOS™ standard level FET
9397 750 13167
Product data Rev. 01 — 12 May 2004 11 of 13
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Page 12
Philips Semiconductors
Philips Semiconductors

9. Data sheet status

PHP/PHB101NQ04T
PHP/PHB101NQ04T
N-channel TrenchMOS™ standard level FET
N-channel TrenchMOS™ standard level FET
Level Data sheet status
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
II Preliminary data Qualification This data sheetcontainsdata from the preliminary specification. Supplementary data will be published
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
[1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
[1]
Product status
10. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
[2][3]
Definition
Semiconductors reserves the right to change the specification in any manner without notice.
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product.
right to make changes at any time in order to improve the design, manufacturing and supply.Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, andmakes no representations or warrantiesthat these products are free from patent, copyright,or mask work right infringement, unless otherwise specified.

12. Trademarks

11. Disclaimers

TrenchMOS —is a trademark of Koninklijke Philips Electronics N.V.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors
Contact information
For additional information, please visit http://www.semiconductors.philips.com. For sales office addresses, send e-mail to: [email protected]. Fax: +31 40 27 24825
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 13167
9397 750 13167
Product data Rev. 01 — 12 May 2004 12 of 13
Product data Rev. 01 — 12 May 2004 12 of 13
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Page 13
Philips Semiconductors
Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
5.1 Transient thermal impedance . . . . . . . . . . . . . . 4
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11
9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 12
10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
11 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
12 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
PHP/PHB101NQ04T
N-channel TrenchMOS™ standard level FET
© Koninklijke Philips Electronics N.V. 2004. Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Date of release: 12 May 2004 Document order number: 9397 750 13167
Loading...