Philips ph2369 Datasheet

Page 1
DATA SH EET
ook, halfpage
DISCRETE SEMICONDUCTORS
M3D186
PH2369
NPN switching transistor
Product data sheet Supersedes data of 1999 Apr 27
2004 Oct 11
Page 2
NXP Semiconductors Product data sheet
NPN switching transistor PH2369

FEATURES

• Low current (max. 200 mA)
• Low voltage (max. 15 V).

PINNING

PIN DESCRIPTION
1 emitter 2 base

APPLICATIONS

3 collector
• High-speed switching.

DESCRIPTION

NPN switching transistor in a TO-92; SOT54 plastic package.
handbook, halfpage
1
2
3
2
MAM182
Fig.1 Simplified outline (TO-92; SOT54) and
symbol.

ORDERING INFORMATION

PACKAGE
T YPE NUMBER
NAME DESCRIPTION VERSION
PH2369 SC-43A plastic single-ended leaded (throug h hole) package; 3 leads SOT54
3
1

LIMITING VALUES

In accordance with the Absolu te Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V V V I I I P T T T
CBO CEO
EBO C CM BM
tot
stg
j
amb
collector-base voltage open emitter − 40 V collector-emitter voltage open base − 15 V emitter-base voltage open collector − 4.5 V collector current (DC) − 200 mA peak collector current − 300 mA peak base current − 100 mA total power dissipation T
≤ 25 °C − 500 mW
amb
storage temperature −65 +150 °C junction temperature − 150 °C ambient temperature −65 +150 °C
2004 Oct 11 2
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NXP Semiconductors Product data sheet
NPN switching transistor PH2369

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th(j-a)
Note
1. Transistor mounted on an FR4 printed-circuit board.

CHARACTERISTICS

T
= 25 °C unless otherwise specified.
amb
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
I
CBO
I
EBO
h
FE
V
CEsat
V
BEsat
C
c
C
e
f
T
Switching times (between 10 % and 90 % levels)
t
on
t
d
t
r
t
off
t
s
t
f
t
on
t
off
thermal resistance from junction to ambient note 1 250 K/W
collector-base cut-off curren t VCB = 20 V; IE = 0 A − 400 nA
VCB = 20 V; IE = 0 A; Tj = 125 °C − 30 µA emitter-base cut-off current VEB = 4 V; IC = 0 A − 100 nA DC current gain VCE = 1 V; IC = 10 mA 40 120
VCE = 1 V; IC = 10 mA; T
= −55 °C 20 −
amb
VCE = 2 V; IC = 100 mA 20 − collector-emitter saturation voltage IC = 10 mA; IB = 1 mA − 250 mV base-emitter saturation vo ltage IC = 10 mA; IB = 1 mA 700 850 mV collector capacitance VCB = 5 V; IE = ie = 0 A; f = 1 MHz − 4 pF emitter capacitance VEB = 1 V; IC = ic = 0 A; f = 1 MHz − 4.5 pF transition frequency VCE = 10 V; IC = 10 mA; f = 100 MHz 500 − MHz
turn-on time I delay time − 4 ns
= 10 mA; I
Con
Fig.2 test conditions A
see
Bon
= 3 mA; I
= −1.5 mA;
Boff
− 10 ns
rise time − 6 ns turn-off time − 20 ns storage time − 10 ns fall time − 10 ns turn-on time I turn-off time − 35 ns
= 100 mA; I
Con
Fig.2 test conditions B
see
Bon
= 40 mA; I
= −20 mA;
Boff
− 13 ns
2004 Oct 11 3
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NXP Semiconductors Product data sheet
o
e
NPN switching transistor PH2369
scilloscope
V
I
Test conditions A.
Vi = 0.5 to 4.2 V; T = 500 µs; tp = 10 µs; tr = tf ≤ 3 ns. R1 = 56 Ω; R2 = 1 kΩ; RB = 1 kΩ; RC = 270 Ω. VBB = 0.2 V; VCC = 2.7 V. Oscilloscope: input impedance Zi = 50 Ω.
(probe)
450 Ω
R1
R2
V
R
B
BB
V
CC
R
C
V
o
(probe)
450 Ω
DUT
mlb826
Test conditions B.
Vi = 0.5 to 4.52 V; T = 200 µs; tp = 10 µs; tr = tf ≤ 3 ns. R1 = 100 Ω; R2 = 68 Ω; RB = 390 Ω; RC = 47 Ω. VBB = −3 V; VCC = 4.6 V. Oscilloscope: input impedance Zi = 50 Ω.
Fig.2 Test circuit for switching times.
oscilloscop
2004 Oct 11 4
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NXP Semiconductors Product data sheet
4
NPN switching transistor PH2369

PACKAGE OUTLINE

Plastic single-ended leaded (through hole) package; 3 leads SOT5
c
E
d
A L
1
D
2
3
b
1
0 2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
5.2
mm
5.0
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
OUTLINE VERSION
SOT54 TO-92 SC-43A
b
0.48
0.40
b
c
D
d
1
0.66
0.45
0.38
4.8
4.4
0.55
IEC JEDEC JEITA
E
1.7
4.2
1.4
3.6
REFERENCES
2.54
e
e
1
1.27
L
14.5
12.7
L
1
(1)
L
1
max.
2.5
EUROPEAN
PROJECTION
b
e
1
e
ISSUE DATE
04-06-28 04-11-16
2004 Oct 11 5
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NXP Semiconductors Product data sheet
NPN switching transistor PH2369

DATA SHEET STATUS

DOCUMENT
STATUS
Objective data sheet Development This document contains data from the objective specification for product
Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the prod uct specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this do cument was published and may differ in case of multiple devices. The latest product status information is available on the Internet at
http://www.nxp.com.
URL
DISCLAIMERS General ⎯ Information in this document is believed to be
accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.
Right to make changes ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be su itable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
Applications ⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modificati on .
(1)
PRODUCT STATUS
(2)
development.
DEFINITION
System of IEC the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.
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Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
60134) may cause permanent damage to
Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings
2004 Oct 11 6
Page 7
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: [email protected]
© NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this documen t d oes not form part of any quotation or contract, is believe d to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industri al or intellectual property rights.
Printed in The Netherlands R75/04/pp7 Date of release: 2004 Oct 11 Document order number: 9397 750 13616
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