Philips pdta123t_ser Datasheet

PDTA123T series

PNP resistor-equipped transistors;
R1 = 2.2 kΩ, R2 = open

Rev. 02 — 3 September 2009 Product data sheet

1. Product profile

1.1 General description

PNP Resistor-Equipped Transistors (RET) family.

Table 1. Product overview

Type number Package NPN complement

PDTA123TE SOT416 SC-75 - PDTC123TE
PDTA123TK SOT346 SC-59A TO-236 PDTC123TK
PDTA123TM SOT883 SC-101 - PDTC123TM
PDTA123TS
PDTA123TT SOT23 - TO-236AB PDTC123TT
PDTA123TU SOT323 SC-70 - PDTC123TU

NXP JEITA JEDEC

[1]

SOT54 SC-43A TO-92 PDTC123TS

[1] Also available in SOT54A and SOT54 variant packages (see Section 2)

1.2 Features

n Built-in bias resistors n Reduces component count
n Simplifies circuit design n Reduces pick and place costs
n 100 mA output current capability

1.3 Applications

n Digital applications n Cost-savingalternative forBC857 series

in digital applications

n Controlling IC inputs n Switching loads

1.4 Quick reference data

Table 2. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

V

CEO

I

O

R1 bias resistor 1 (input) 1.54 2.2 2.86 kΩ

collector-emitter voltage open base - - −50 V
output current - - −100 mA

NXP Semiconductors

2. Pinning information

Table 3. Pinning

Pin Description Simplified outline Symbol

SOT54

1 input (base)
2 output (collector)
3 GND (emitter)

SOT54A

1 input (base)
2 output (collector)
3 GND (emitter)

PDTA123T series

PNP resistor-equipped transistors; R1 = 2.2 kΩ, R2 = open

2

R1

1

3

006aaa217

2

R1

1

3

006aaa217

001aab347

001aab348

1
2
3

1
2
3

SOT54 variant

1 input (base)
2 output (collector)
3 GND (emitter)

SOT23; SOT323; SOT346; SOT416

1 input (base)
2 GND (emitter)
3 output (collector)

SOT883

1 input (base)
2 GND (emitter)
3 output (collector)

1
2
3

001aab447

3

12

006aaa144

1
2

Transparent

top view

3

2

R1

1

3

006aaa217

3

R1

1

2

sym009

3

R1

1

2

sym009

PDTA123T_SER_2 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 02 — 3 September 2009 2 of 10

NXP Semiconductors

3. Ordering information

Table 4. Ordering information

Type number Package

PDTA123TE SC-75 plastic surface mounted package; 3 leads SOT416
PDTA123TK SC-59A plastic surface mounted package; 3 leads SOT346
PDTA123TM SC-101 leadless ultra small plastic package; 3 solder lands;

PDTA123TS

PDTA123TT - plastic surface mounted package; 3 leads SOT23
PDTA123TU SC-70 plastic surface mounted package; 3 leads SOT323

[1] Also available in SOT54A and SOT54 variant packages (see Section 2 and Section 9)

[1]

4. Marking

PDTA123T series

PNP resistor-equipped transistors; R1 = 2.2 kΩ, R2 = open

Name Description Version

SOT883

body 1.0 × 0.6 × 0.5 mm

SC-43A plastic single-ended leaded (through hole) package;

3 leads

SOT54

Table 5. Marking codes

Type number Marking code

PDTA123TE 2A
PDTA123TK GA
PDTA123TM FA
PDTA123TS TA123T
PDTA123TT ZL*
PDTA123TU *1S

[1] * = -: made in Hong Kong

* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China

[1]

PDTA123T_SER_2 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 02 — 3 September 2009 3 of 10

NXP Semiconductors

5. Limiting values

Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

V

CBO

V

CEO

V

EBO

I

O

I

CM

P

tot

T

stg

T

j

T

amb

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB with 60 µm copper strip line, standard footprint.

PDTA123T series

PNP resistor-equipped transistors; R1 = 2.2 kΩ, R2 = open

collector-base voltage open emitter - −50 V
collector-emitter voltage open base - −50 V
emitter-base voltage open collector - −5V
output current - −100 mA
peak collector current single pulse;

t

≤ 1ms

p

total power dissipation T

amb

≤ 25 °C
SOT416
SOT346
SOT883
SOT54
SOT23
SOT323

storage temperature −65 +150 °C
junction temperature - 150 °C
ambient temperature −65 +150 °C

- −100 mA

[1]

- 150 mW

[1]

- 250 mW

[2][3]

- 250 mW

[1]

- 500 mW

[1]

- 250 mW

[1]

- 200 mW

6. Thermal characteristics

Table 7. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

R

th(j-a)

thermal resistance from
junction to ambient

SOT416
SOT346
SOT883
SOT54
SOT23
SOT323

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB with 60 µm copper strip line, standard footprint.

PDTA123T_SER_2 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 02 — 3 September 2009 4 of 10

in free air

[1]

- - 833 K/W

[1]

- - 500 K/W

[2][3]

- - 500 K/W

[1]

- - 250 K/W

[1]

- - 500 K/W

[1]

- - 625 K/W

NXP Semiconductors

7. Characteristics

Table 8. Characteristics

T

amb

Symbol Parameter Conditions Min Typ Max Unit

I

CBO

I

CEO

I

EBO

h

FE

V

CEsat

R1 bias resistor 1 (input) 1.54 2.2 2.86 kΩ
C

c

PDTA123T series

PNP resistor-equipped transistors; R1 = 2.2 kΩ, R2 = open

=25°C unless otherwise specified

collector-base cut-off
current

collector-emitter cut-off
current

emitter-base cut-off
current

DC current gain VCE= −5 V; IC= −20 mA 30 - ­collector-emitter

saturation voltage

collector capacitance VCB= −10 V; IE=ie=0A;

VCB= −50 V; IE=0A - - −100 nA

VCE= −30 V; IB=0A - - −1 µA

= −30 V; IB=0A;

V

CE

T

= 150 °C

j

--−50 µA

VEB= −5 V; IC=0A - - −100 nA

IC= −10 mA; IB= −0.5 mA - - −150 mV

--3pF

f=1MHz

500

h

FE

400

300

200

100

0

−10

−1

(1)

(2)

(3)

006aaa691

2

−10−1
IC (mA)

−10

VCE= −5V
(1) T
(2) T
(3) T

amb
amb
amb

= 100 °C
=25°C
= −40 °C

Fig 1. DC current gain as a function of collector

current; typical values

006aaa692

−10−1
IC (mA)

−10

V

−10

−10

CEsat

(V)

−1

−1

−2

−10

(1)
(2)
(3)

−1

IC/IB=20
(1) T
(2) T
(3) T

amb
amb
amb

= 100 °C
=25°C
= −40 °C

Fig 2. Collector-emitter saturation voltage as a

function of collector current; typical values

2

PDTA123T_SER_2 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 02 — 3 September 2009 5 of 10

NXP Semiconductors

8. Package outline

PDTA123T series

PNP resistor-equipped transistors; R1 = 2.2 kΩ, R2 = open

1.3

1.0

0.26

0.10

04-11-11Dimensions in mm

1.75

1.45

1.8

1.4

3

0.9

0.7

12

0.30

1

0.15

0.45

0.15

0.95

0.60

0.25

0.10

3.1

2.7

3

3.0

1.7

2.5

1.3

12

1.9

04-11-04Dimensions in mm

0.50

0.35

0.6

0.2

Fig 3. Package outline SOT416 (SC-75) Fig 4. Package outline SOT346 (SC-59A/TO-236)

0.62

0.30

0.22

0.30

0.22

21

0.55

0.55

0.47

3

0.65

0.50

0.46

1.02

0.95

4.2

3.6

4.8

4.4

0.45

0.38

0.48

0.40

1
2

1.27

3

2.54

0.20

0.12

0.35
03-04-03Dimensions in mm

5.2

5.0

14.5

12.7
04-11-16Dimensions in mm

Fig 5. Package outline SOT883 (SC-101) Fig 6. Package outline SOT54 (SC-43A/TO-92)

0.45

0.38

1.27

0.48

0.40

1
2
3

1.27

2.54

05-01-10Dimensions in mm

4.2

3.6

4.8

4.4

5.2

5.0

3 max

14.5

12.7

0.45

0.38

0.48

0.40

1

2

3

5.08

2.54

04-06-28Dimensions in mm

4.2

3.6

4.8

4.4

5.2

5.0

2.5

max

14.5

12.7

Fig 7. Package outline SOT54A Fig 8. Package outline SOT54 variant

PDTA123T_SER_2 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 02 — 3 September 2009 6 of 10

NXP Semiconductors

PDTA123T series

PNP resistor-equipped transistors; R1 = 2.2 kΩ, R2 = open

2.5

2.1

3.0

2.8

3

0.45

0.15

1.4

1.2

12

0.48

1.9

0.38

1.1

0.9

0.15

0.09

2.2

1.8

0.4

0.3

0.45

0.15

3

2.2

1.35

2.0

1.15

12

1.3

04-11-04Dimensions in mm

Fig 9. Package outline SOT23 (TO-236AB) Fig 10. Package outline SOT323 (SC-70)

9. Packing information

Table 9. Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.

Type number Package Description Packing quantity

PDTA123TE SOT416 4 mm pitch, 8 mm tape and reel -115 - -135
PDTA123TK SOT346 4 mm pitch, 8 mm tape and reel -115 - -135
PDTA123TM SOT883 2 mm pitch, 8 mm tape and reel - - -315
PDTA123TS SOT54 bulk, straight leads - -412 -

SOT54A tape and reel, wide pitch - - -116

tape ammopack, wide pitch - - -126

SOT54 variant bulk, delta pinning - -112 ­PDTA123TT SOT23 4 mm pitch, 8 mm tape and reel -215 -235
PDTA123TU SOT323 4 mm pitch, 8 mm tape and reel -115 -135

[1]

3000 5000 10000

1.1

0.8

0.25

0.10

04-11-04Dimensions in mm

[1] For further information and the availability of packing methods, seeSection 12.

PDTA123T_SER_2 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 02 — 3 September 2009 7 of 10

NXP Semiconductors

PNP resistor-equipped transistors; R1 = 2.2 kΩ, R2 = open

PDTA123T series

10. Revision history

Table 10. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PDTA123T_SER_2 20090903 Product data sheet - PDTA123T_SER_1
Modifications:

PDTA123T_SER_1 20060307 Product data sheet - -

• This data sheet was changed to reflect the new company name NXP Semiconductors,

including new legal definitions and disclaimers. No changes were made to the technical
content.

PDTA123T_SER_2 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 02 — 3 September 2009 8 of 10

NXP Semiconductors

11. Legal information

11.1 Data sheet status

PDTA123T series

PNP resistor-equipped transistors; R1 = 2.2 kΩ, R2 = open

Document status

Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s)described inthis document may have changed since thisdocument waspublished and may differin case ofmultiple devices.The latestproduct status

information is available on the Internet at URL

[1][2]

Product status

11.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information includedherein and shallhave no liabilityfor the consequencesof
use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet
with thesame product typenumber(s) and title.A short data sheet isintended
for quickreference only and shouldnot be relied upon tocontain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.

11.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXPSemiconductors does not giveany representations or
warranties, expressed or implied, as tothe accuracy or completenessof such
information and shall have no liability for the consequences of use of such
information.

Right to make changes — NXP Semiconductors reserves the right tomake
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. Thisdocument supersedes and replaces all informationsupplied prior
to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental

[3]

http://www.nxp.com.

Definition

damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.

Limiting values — Stress above one or more limiting values (as defined in
the Absolute MaximumRatings System of IEC 60134)may cause permanent
damage tothe device. Limitingvalues are stress ratingsonly and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions ofcommercial sale, as published
at

http://www.nxp.com/profile/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of anylicense under any copyrights, patents
or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.

Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.

11.4 Trademarks

Notice: Allreferenced brands,product names, servicenames and trademarks
are the property of their respective owners.

12. Contact information

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]

PDTA123T_SER_2 © NXP B.V. 2009. All rights reserved.

Product data sheet Rev. 02 — 3 September 2009 9 of 10

NXP Semiconductors

PNP resistor-equipped transistors; R1 = 2.2 kΩ, R2 = open

13. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 3

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6

9 Packing information. . . . . . . . . . . . . . . . . . . . . . 7

10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8

11 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9

11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9

11.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

11.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

11.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

12 Contact information. . . . . . . . . . . . . . . . . . . . . . 9

13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

PDTA123T series

Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.

© NXP B.V. 2009. All rights reserved.

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]

Date of release: 3 September 2009

Document identifier: PDTA123T_SER_2