CK98R (100/133MHz) RCC spread
spectrum system clock generator
Product specification1999 Oct 19
Philips SemiconductorsProduct specification
CK98R (100/133MHz) RCC spread spectrum
system clock generator
FEA TURES
•Mixed 2.5 V and 3.3 V operation
•Four CPU clocks at 2.5 V
•Eight PCI clocks at 3.3 V, one free-running
(synchronous with CPU clocks)
•Four 3.3 V fixed clocks @ 66 MHz
•Two 2.5 V CPUDIV2 clocks @ ½ CPU clock frequency
•Three 2.5 V IOAPIC clocks @ 16.67 MHz
•One 3.3 V 48 MHz USB clock
•Two 3.3 V reference clocks @ 14.318 MHz
•Reference 14.31818 MHz Xtal oscillator input
•133 MHz or 100 MHz operation
•Power management control input pins
•CPU clock jitter ≤ 250 ps cycle-cycle
•CPU clock skew ≤ 175 ps pin-pin
•0.0ns – 1.5 ns CPU - 3V66 delay
•1.5ns – 3.5 ns 3V66 - PCI delay
•1.5ns – 4.0 ns CPU - IOAPIC delay
•1.5ns – 4.0 ns CPU - PCI delay
•Available in 56-pin SSOP package
•±0.5% center spread spectrum capability via select pins
•–0.5% down spread spectrum capability via select pins
DESCRIPTION
The PCK2010R is a clock generator (frequency synthesizer) chip for
a Pentium II and other similar processors.
The PCK2010R has four CPU clock outputs at 2.5 V, two CPUDIV2
clock outputs running at ½ CPU clock frequency (66 MHz or 50 MHz
depending on the state of SEL133/100) and four 3V66 clocks
running at 66MHz. There are eight PCI clock outputs running at
33 MHz. One of the PCI clock outputs is free-running. Additionally,
the part has three 2.5 V IOAPIC clock outputs at 16.67 MHz and two
3.3 V reference clock outputs at 14.318 MHz. All clock outputs meet
Intel’s drive strength, rise/fall time, jitter , accuracy, and skew
requirements.
The part possesses dedicated power-down, CPUSTOP
PCISTOP
input pins for power management control. These inputs
are synchronized on-chip and ensure glitch-free output transitions.
When the CPUSTOP input is asserted, the CPU clock outputs and
3V66 clock outputs are driven LOW. When the PCISTOP
asserted, the PCI clock outputs are driven LOW.
, and
input is
Finally, when the PWRDWN input pin is asserted, the internal
reference oscillator and PLLs are shut down, and all outputs are
driven LOW.
PIN CONFIGURATION
REF0
REF1
V
DD
XTAL_IN
XTAL_OUT
V
PCICLK_F
PCICLK1
V
DD
PCICLK2
PCICLK3
PCICLK4
PCICLK5
VDD3V
PCICLK6
PCICLK7
V
3V66_0
3V66_1
VDD3V
V
3V66_0
3V66_1
VDD3V
1
SS
2
3
4
3V
5
6
7
SS
8
9
10
3V
11
1245
13
SS
14
15
16
17
1839
1938V
SS
20
SS
21
22
23
24
SS
2532
2631
2730
2829SEl133/100
PCK2010R
56V
V
25V
DD
55
APIC2
54
APIC1
APIC0
53
52
V
SS
51
25V
V
DD
50
CPUDIV2_1
CPUDIV2_0
49
48
V
SS
VDD25V
47
CPUCLK3
46
CPUCLK2
V
44V
SS
VDD25V
43
CPUCLK1
42
CPUCLK0
41
V
40
SS
3V
V
DD
V
SS
PCISTOP
37
CPUSTOP
36
35
PWRDWN
SPREAD
34
SEL1
33
SEL0
VDD3V
48MHz_USB
V
SS
SW00504
ORDERING INFORMA TION
PACKAGESTEMPERATURE RANGEORDER CODEDRAWING NUMBER
56-Pin plastic SSOP0°C to +70°CPCK2010R DLSOT371-1
Intel and Pentium are registered trademarks of Intel Corporation.
1. LOW means outputs held static LOW as per latency requirement below
2. ON means active.
3. PWRDWN
4. All 3V66 clocks as well as CPU clocks should stop cleanly when CPUSTOP is pulled LOW.
5. CPUDIV2, IOAPIC, REF, 48 MHz signals are not controlled by the CPUSTOP functionality and are enabled all in all conditions except when
PWRDWN
pulled LOW, impacts all outputs including REF and 48 MHz outputs.
is LOW.
POWER MANAGEMENT REQUIREMENTS
LATENCY
NO. OF RISING EDGES OF FREE RUNNING PCICLK
CPUSTOP
PCISTOP
PWRDWN
NOTES:
1. Clock ON/OFF latency is defined as the number of rising edges of free running PCICLKs between the clock disable goes HIGH/LOW to the
first valid clock that comes out of the device.
2. Power up latency is when PWRDWN
goes inactive (HIGH) to when the first valid clocks are driven from the device.
0 (DISABLED)1
1 (ENABLED)1
0 (DISABLED)1
1 (ENABLED)1
1 (NORMAL OPERATION)3 ms
0 (POWER DOWN)2 MAX
1999 Oct 19
5
Philips SemiconductorsProduct specification
SYMBOL
PARAMETER
CONDITION
UNIT
SYMBOL
PARAMETER
CONDITIONS
UNIT
C
CK98R (100/133MHz) RCC spread spectrum
PCK2010R
system clock generator
ABSOLUTE MAXIMUM RATINGS
In accordance with the Absolute Maximum Rating System (IEC 134)
Voltages are referenced to VSS (VSS = 0 V)
V
DD3
V
DDQ3
V
DDQ2
I
IK
V
I
OK
V
O
I
O
T
STG
P
TOT
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
DC 3.3 V core supply voltage–0.5+4.6V
DC 3.3 V I/O supply voltage–0.5+4.6V
DC 2.5 V I/O supply voltage–0.5+3.6V
DC input diode currentVI < 0–50mA
DC input voltageNote 2–0.55.5V
I
DC output diode currentVO > VCC or VO < 0±50mA
DC output voltageNote 2–0.5VCC + 0.5V
DC output source or sink currentVO = 0 to V
Storage temperature range–65+150°C
Power dissipation per package
plastic medium-shrink (SSOP)
1, 2
CC
For temperature range: –40 to +125°C
above +55°C derate linearly with 11.3mW/K
LIMITS
MINMAX
±50mA
850mW
RECOMMENDED OPERATING CONDITIONS
V
DD3V
V
DD25V
V
f
REF
T
V
amb
DC 3.3 V core supply voltage3.1353.465V
DC 2.5 V I/O supply voltage2.3752.625V
Capacitive load on: