Philips PCK2002MDB, PCK2002MPW Datasheet

INTEGRATED CIRCUITS

PCK2002M

2

0–300 MHz I

Product data
File under Integrated Circuits ICL03

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C 1:10 clock buffer

2001 Jul 19

Philips Semiconductors Product data

PCK2002M0–300 MHz I2C 1:10 clock buffer

FEA TURES

•HIGH speed, LOW noise non-inverting 1:10 buffer

•Mobile (reduced pincount) version of PCK2002

•Typically used to support two SDRAM DIMMs

•28-pin SSOP and TSSOP packages

•See PCK2002 for 48-pin 1-18 buffer part supporting up to

4 SDRAM DIMMs

•Optimized for 66 MHz, 100 MHz and 133 MHz operation

•Multiple V

and VSS pins for noise reduction

DD

DESCRIPTION

The PCK2002M is a 1–10 fanout buffer used for 133/100 MHz CPU,
66/33 MHz PCI, 14.318 MHz REF, or 133/100/66 MHz SDRAM
clock distribution. 10 outputs are typically used to support up to
2 SDRAM DIMMs commonly found in laptop or mobile applications.
The PCK2002M has the same features and operating characteristics
of the PCK2002 and is available in the SSOP 28 pin package.

All clock outputs meet Intel’s drive, rise/fall time, accuracy , and skew
requirements. An I
enabled/disabled individually. An output disabled via the I
interface will be held in the LOW state. In addition, there is an OE
input which 3-states all outputs.

2

C interface is included to allow each output to be

•Spread spectrum compliant

•175 ps skew outputs

•Individual clock output enable/disable via I

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS TYPICAL UNIT

t

PLH

t

PHL

t

r

t

f

I

CC

ORDERING INFORMATION

28-Pin Plastic SSOP 0 to +70 °C PCK2002MDB SOT341–1

28-Pin Plastic TSSOP 0 to +70 °C PCK2002MPW SOT361–1

Propagation delay
BUF_IN to BUF_OUT

Rise time VCC = 3.3 V, CL = 30 pF 1.1 ns
Fall time VCC = 3.3 V, CL = 30 pF 1.0 ns
Total supply current VCC = 3.465 V 35 µA

PACKAGES TEMPERATURE RANGE ORDER CODE DRAWING NUMBER

2

C

n

VCC = 3.3 V, CL = 30 pF

2.7

2.9

2

C

ns

PIN CONFIGURATION

V

1

V

DD0

BUF_OUT0 BUF_OUT15

BUF_OUT1

BUF_OUT2
BUF_OUT3

BUF_OUT16 BUF_OUT17

Intel and Pentium are registered trademarks of Intel Corporation.

2

I

C is a trademark of Philips Semiconductors Corporation.

227
3
4

V

SS0

5

V

DD1

6
7
8

V

SS1

9

BUF_IN

10

V

DD4

11
12 17

V

SS4

13 16V

DDI2C

14 15SDA

TOP VIEW

28

DD9

BUF_OUT14

26

V

25

SS9

24

V

DD8

23

BUF_OUT13

22

BUF_OUT12

21

V

SS8

20
19
18

OE
V

DD5

V

SS5

V

SSI2C

SCL

SA00550

PCK2002M

PIN DESCRIPTION

PIN

NUMBER

2, 3, 6, 7 Output

22, 23, 26,

27

11, 18 Output

9 Input BUF_IN Buffered clock input
20 Input OE
14 I/O SDA I2C serial data

15 Input SCL I2C serial clock

1, 5, 10,

19, 24, 28

4, 8, 12,

17, 21, 25

13 Input V
16 Input V

I/O

TYPE

Output

Input V

Input V

SYMBOL FUNCTION

BUF_OUT

(0–3)

BUF_OUT

(12–15)

BUF_OUT

(16–17)

Buffered clock outputs

Buffered clock outputs

Buffered clock outputs

Active high output
enable

DD (0,1,4,5,8,9)

SS (0,1,4,5,8,9)

DDI2C
DDI2C

3.3 V power supply

Ground

3.3 V I2C power supply
I2C ground

2001 Jul 19 853-2268 26745

2

Philips Semiconductors Product data

SYMBOL

PARAMETER

CONDITION

UNIT

SYMBOL

PARAMETER

CONDITIONS

UNIT

2

0–300 MHz I

C 1:10 clock buffer

PCK2002M

FUNCTION TABLE

OE BUF_IN I2CEN BUF_OUTn

L X X Z
H L X L
H H H H
H H L L

ABSOLUTE MAXIMUM RA TINGS

In accordance with the Absolute Maximum Rating System (IEC 134)
Voltages are referenced to V

V

DD

I

IK

V

I

I

OK

V

O

I

O

T

stg

P

TOT

NOTES:

1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .

2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

DC 3.3 V supply voltage –0.5 +4.6 V

DC input diode current VI < 0 — –50 mA

DC output diode current VO > VDD or VO < 0 — ±50 mA

DC output source or sink current VO ≥ 0 to V

Storage temperature range –65 +150 °C

Power dissipation per package

plastic medium-shrink SO (SSOP)

(VSS = 0 V)

SS

DC input voltage Note 2 –0.5 4.6 V

DC output voltage Note 2 –0.5 VCC + 0.5 V

1, 2

DD

For temperature range: 0 to +70 °C

above +55 °C derate linearly with 11.3 mW/K

LIMITS

MIN MAX

— ±50 mA

— 850 mW

RECOMMENDED OPERATING CONDITIONS

LIMITS

MIN MAX

V

T

C

V

V

amb

DD

L

I

O

Operating ambient temperature range in free air 0 +70 °C

DC 3.3 V supply voltage 3.135 3.465 V

Capacitive load 20 30 pF

DC input voltage range 0 V

DC output voltage range 0 V

DD
DD

V
V

2001 Jul 19

3

Philips Semiconductors Product data

TEST CONDITIONS

VOH3.3 V output HIGH voltage

V

VOL3.3 V output LOW voltage

V

IOHOutput HIGH current

mA

IOLOutput LOW current

mA

2

0–300 MHz I

C 1:10 clock buffer

PCK2002M

DC CHARACTERISTICS

LIMITS

T

SYMBOL PARAMETER

V

IH

V

IL

HIGH level input voltage 3.135 to 3.465 2.0 VDD + 0.3 V

LOW level input voltage 3.135 to 3.465 VSS – 0.3 0.8 V

p

p

p

p

±I

I

±I

OZ

I

CC

∆I

CC

Input leakage current 3.465 — ±5 µA

3-State output OFF-State

current

Quiescent supply current 3.465 VI = VDD or GND IO = 0 — 100 µA

Additional quiescent supply

current given per control pin

VDD(V) OTHER MIN MAX

3.135 to 3.465 IOH = –1 mA VCC – 0.1 —

3.135 IOH = –36 mA 2.4 —

3.135 to 3.465 IOL= 1 mA — 0.1

3.135 IOL= 24 mA — 0.4

3.135 to 3.465 V

3.135 to 3.465 V

3.135 to 3.465 V

3.135 to 3.465 V

3.465 V

3.135 to 3.465 V

= 2.0 V –54 –126

OUT

= 3.135 V –21 –46

OUT

= 1.0 V 49 118

OUT

= 0.4 V 24 53

OUT

= VDD or GND IO = 0 — ±10 µA

OUT

= VDD– 0.6 V IO = 0 — 500 µA

I

= 0 to +70 °C UNIT

amb

2001 Jul 19

4