Philips PCK2002MDB, PCK2002MPW Datasheet

INTEGRATED CIRCUITS

PCK2002M

0±300 MHz I2C 1:10 clock buffer

Product data

2001 Jul 19

File under Integrated Circuits ICL03

P s

on o s

Philips Semiconductors	Product data
0±300 MHz I2C 1:10 clock buffer	PCK2002M

FEATURES

•HIGH speed, LOW noise non-inverting 1:10 buffer

•Mobile (reduced pincount) version of PCK2002

•Typically used to support two SDRAM DIMMs

•28-pin SSOP and TSSOP packages

•See PCK2002 for 48-pin 1-18 buffer part supporting up to

4 SDRAM DIMMs

•Optimized for 66 MHz, 100 MHz and 133 MHz operation

•Multiple VDD and VSS pins for noise reduction

•Spread spectrum compliant

•175 ps skew outputs

•Individual clock output enable/disable via I2C

DESCRIPTION

The PCK2002M is a 1±10 fanout buffer used for 133/100 MHz CPU, 66/33 MHz PCI, 14.318 MHz REF, or 133/100/66 MHz SDRAM clock distribution. 10 outputs are typically used to support up to

2 SDRAM DIMMs commonly found in laptop or mobile applications. The PCK2002M has the same features and operating characteristics of the PCK2002 and is available in the SSOP 28 pin package.

All clock outputs meet Intel's drive, rise/fall time, accuracy, and skew requirements. An I2C interface is included to allow each output to be enabled/disabled individually. An output disabled via the I2C interface will be held in the LOW state. In addition, there is an OE input which 3-states all outputs.

QUICK REFERENCE DATA

	SYMBOL	PARAMETER	CONDITIONS	TYPICAL	UNIT
	tPLH	Propagation delay	VCC = 3.3 V, CL = 30 pF	2.7	ns
	tPHL	BUF_IN to BUF_OUTn		2.9
	tr	Rise time	VCC = 3.3 V, CL = 30 pF	1.1	ns
	tf	Fall time	VCC = 3.3 V, CL = 30 pF	1.0	ns
	ICC	Total supply current	VCC = 3.465 V	35	μA

ORDERING INFORMATION

PACKAGES	TEMPERATURE RANGE	ORDER CODE	DRAWING NUMBER
28-Pin Plastic SSOP	0 to +70 °C	PCK2002MDB	SOT341±1
28-Pin Plastic TSSOP	0 to +70 °C	PCK2002MPW	SOT361±1

PIN CONFIGURATION

	VDD0	1
	BUF_OUT0
		2
	BUF_OUT1	3
	VSS0
		4
	VDD1
		5	PCK2002M
	BUF_OUT2	6
	BUF_OUT3
		7
	VSS1
		8
	BUF_IN
		9
	VDD4
		10
	BUF_OUT16
		11
	VSS4
		12
	VDDI2C	13
	SDA	14

TOP VIEW

28 VDD9

27 BUF_OUT15

26 BUF_OUT14

25 VSS9

24 VDD8

23 BUF_OUT13

22 BUF_OUT12

21 VSS8

20 OE

19 VDD5

18 BUF_OUT17

17 VSS5

16 VSSI2C

15 SCL

SA00550

PIN DESCRIPTION

	PIN	I/O	SYMBOL	FUNCTION
	NUMBER	TYPE
	2, 3, 6, 7	Output	BUF_OUT	Buffered clock outputs
			(0±3)
	22, 23, 26,	Output	BUF_OUT	Buffered clock outputs
	27		(12±15)
	11, 18	Output	BUF_OUT	Buffered clock outputs
			(16±17)
	9	Input	BUF_IN	Buffered clock input
	20	Input	OE	Active high output
				enable
	14	I/O	SDA	I2C serial data
	15	Input	SCL	I2C serial clock
	1, 5, 10,	Input	VDD (0, 1, 4, 5, 8, 9)	3.3 V power supply
	19, 24, 28
	4, 8, 12,	Input	VSS (0, 1, 4, 5, 8, 9)	Ground
	17, 21, 25
	13	Input	V	3.3 V I2C power supply
			DDI2C
	16	Input	V	I2C ground
			DDI2C

Intel and Pentium are registered trademarks of Intel Corporation. I2C is a trademark of Philips Semiconductors Corporation.

2001 Jul 19

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853-2268 26745

Philips Semiconductors	Product data
0±300 MHz I2C 1:10 clock buffer	PCK2002M

FUNCTION TABLE

OE	BUF_IN	I2CEN	BUF_OUTn
L	X	X	Z
H	L	X	L
H	H	H	H
H	H	L	L

ABSOLUTE MAXIMUM RATINGS1, 2

In accordance with the Absolute Maximum Rating System (IEC 134)

Voltages are referenced to VSS (VSS = 0 V)

SYMBOL	PARAMETER	CONDITION		LIMITS		UNIT
			MIN		MAX
VDD	DC 3.3 V supply voltage		±0.5		+4.6	V
IIK	DC input diode current	VI < 0	Ð		±50	mA
VI	DC input voltage	Note 2	±0.5		4.6	V
IOK	DC output diode current	VO > VDD or VO < 0	Ð		±50	mA
VO	DC output voltage	Note 2	±0.5		VCC + 0.5	V
IO	DC output source or sink current	VO ≥ 0 to VDD	Ð		±50	mA
Tstg	Storage temperature range		±65		+150	°C
PTOT	Power dissipation per package	For temperature range: 0 to +70 °C	Ð		850	mW
	plastic medium-shrink SO (SSOP)	above +55 °C derate linearly with 11.3 mW/K

NOTES:

1.Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under ªrecommended operating conditionsº is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

2.The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

RECOMMENDED OPERATING CONDITIONS

SYMBOL	PARAMETER	CONDITIONS		LIMITS		UNIT
			MIN		MAX
VDD	DC 3.3 V supply voltage		3.135		3.465	V
CL	Capacitive load		20		30	pF
VI	DC input voltage range		0		VDD	V
VO	DC output voltage range		0		VDD	V
Tamb	Operating ambient temperature range in free air		0		+70	°C

2001 Jul 19

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Philips Semiconductors	Product data
0±300 MHz I2C 1:10 clock buffer	PCK2002M

DC CHARACTERISTICS

			TEST CONDITIONS		LIMITS
SYMBOL	PARAMETER				Tamb = 0 to +70 °C		UNIT
		VDD (V)	OTHER		MIN	MAX
VIH	HIGH level input voltage	3.135 to 3.465			2.0	VDD + 0.3	V
VIL	LOW level input voltage	3.135 to 3.465			VSS ± 0.3	0.8	V
VOH	3.3 V output HIGH voltage	3.135 to 3.465	IOH = ±1 mA		VCC ± 0.1	Ð	V
		3.135	IOH = ±36 mA		2.4	Ð
VOL	3.3 V output LOW voltage	3.135 to 3.465	IOL= 1 mA		Ð	0.1	V
		3.135	IOL= 24 mA		Ð	0.4
IOH	Output HIGH current	3.135 to 3.465	VOUT = 2.0 V		±54	±126	mA
		3.135 to 3.465	VOUT = 3.135 V		±21	±46
IOL	Output LOW current	3.135 to 3.465	VOUT = 1.0 V		49	118	mA
		3.135 to 3.465	VOUT = 0.4 V		24	53
±II	Input leakage current	3.465			Ð	±5	μA
±IOZ	3-State output OFF-State	3.465	VOUT = VDD or GND	IO = 0	Ð	±10	μA
	current
ICC	Quiescent supply current	3.465	VI = VDD or GND	IO = 0	Ð	100	μA
ICC	Additional quiescent supply	3.135 to 3.465	VI = VDD± 0.6 V	IO = 0	Ð	500	μA
	current given per control pin

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