1997 Dec 16 2
Philips Semiconductors Product specification
LCD controller/driver PCF2104x
CONTENTS
1 FEATURES
2 APPLICATIONS
3 GENERAL DESCRIPTION
3.1 Packages
3.2 Available types
4 ORDERING INFORMATION
5 BLOCK DIAGRAM
6 PINNING
7 PIN FUNCTIONS
7.1 RS: register select (parallel control)
7.2 R/W: read/write (parallel control)
7.3 E: data bus clock (parallel control)
7.4 DB0 to DB7: data bus (parallel control)
7.5 C1 to C60: column driver outputs
7.6 R1 to R32: row driver outputs
7.7 VLCD: LCD power supply
7.8 OSC: oscillator
7.9 SCL: serial clock line
7.10 SDA: serial data line
7.11 SA0: address pin
7.12 T1: test pad
8 FUNCTIONAL DESCRIPTION
8.1 LCD bias voltage generator
8.2 Oscillator
8.3 External clock
8.4 Power-on reset
8.5 Registers
8.6 Busy Flag
8.7 Address Counter (AC)
8.8 Display data RAM (DDRAM)
8.9 Character generator ROM (CGROM)
8.10 Character generator RAM (CGRAM)
8.11 Cursor control circuit
8.12 Timing generator
8.13 LCD row and column drivers
8.14 Programming of MUX 1 : 16 displays with
PCF2104x
8.15 Programming of MUX 1 : 32 displays with
PCF2104x
8.16 Reset function
9 INSTRUCTIONS
9.1 Clear display
9.2 Return home
9.3 Entry mode set
9.3.1 I/D
9.3.2 S
9.4 Display on/off control
9.4.1 D
9.4.2 C
9.4.3 B
9.5 Cursor/display shift
9.6 Function set
9.6.1 DL (parallel mode only)
9.6.2 N, M
9.7 Set CGRAM address
9.8 Set DDRAM address
9.9 Read busy flag and address
9.10 Write data to CGRAM or DDRAM
9.11 Read data from CGRAM or DDRAM
10 INTERFACE TO MICROCONTROLLER
(PARALLEL INTERFACE)
11 INTERFACE TO MICROCONTROLLER
(I2C-BUS INTERFACE)
11.1 Characteristics of the I2C-bus
11.2 Bit transfer
11.3 Start and stop conditions
11.4 System configuration
11.5 Acknowledge
11.6 I2C-bus protocol
12 LIMITING VALUES
13 HANDLING
14 DC CHARACTERISTICS
15 AC CHARACTERISTICS
16 TIMING DIAGRAMS
17 APPLICATION INFORMATION
17.1 8-bit operation, 2 × 12 display using internal
reset
17.2 4-bit operation, 2 × 12 display using internal
reset
17.3 8-bit operation, 2 × 24 display
17.4 I2C operation, 2 × 12 display
17.5 Initializing by instruction
18 BONDING PAD LOCATIONS
19 DEFINITIONS
20 LIFE SUPPORT APPLICATIONS
21 PURCHASE OF PHILIPS I2C COMPONENTS