Philips PBSS5320D Technical data
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MBD128
PBSS5320D
20 V low V
Product specification 2002 Jun 12
CEsat
PNP transistor
Philips Semiconductors Product specification
20 V low V
CEsat
PNP transistor
FEATURES
• Low collector-emitter saturation voltage
• High current capability
• Improved device reliability due to reduced heat
generation
APPLICATIONS
• Supply line switching circuits
• Battery management applications
• DC/DC converter applications
• Strobe flash units
• Heavydutybatterypoweredequipment(motorandlamp
drivers).
DESCRIPTION
PNP low V
transistor in a SOT457 (SC-74) plastic
CEsat
package.
PBSS5320D
QUICK REFERENCE DATA
SYMBOL PARAMETER MAX. UNIT
V
CEO
I
C
I
CM
R
CEsat
PINNING
PIN DESCRIPTION
1 collector
2 collector
3 base
4 emitter
5 collector
6 collector
collector-emitter voltage −20 V
collector current (DC) −3A
peak collector current −5A
equivalent on-resistance 133 mΩ
MARKING
TYPE NUMBER MARKING CODE
PBSS5320D 52
56
132
Top view
4
MAM466
1, 2, 5, 6
3
4
Fig.1 Simplified outline (SOT457; SC-74) and
symbol.
2002 Jun 12 2
Philips Semiconductors Product specification
20 V low V
PNP transistor
CEsat
PBSS5320D
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
B
P
tot
T
stg
T
j
T
amb
collector-base voltage open emitter −−20 V
collector-emitter voltage open base −−20 V
emitter-base voltage open collector −−5V
collector current (DC) −−3A
peak collector current −−5A
base current −−500 mA
total power dissipation T
≤ 25 °C; note 1 − 600 mW
amb
T
≤ 25 °C; note 2 − 750 mW
amb
storage temperature −65 +150 °C
junction temperature − 150 °C
operating ambient temperature −65 +150 °C
Notes
1. Device mounted on a printed-circuit board, single side copper, tinplated, mounting pad for collector 1 cm2.
2. Device mounted on a printed-circuit board, single side copper, tinplated, mounting pad for collector 6 cm2.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-a
thermal resistance from junction to
ambient
note 1 208 K/W
note 2 160 K/W
Notes
1. Device mounted on a printed-circuit board, single side copper, tinplated, mounting pad for collector 1 cm2.
2. Device mounted on a printed-circuit board, single side copper, tinplated, mounting pad for collector 6 cm2.
2002 Jun 12 3
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