Philips P82B96 User Guide

INTEGRATED CIRCUITS
P82B96
Dual bi-directional bus buffer
Product data Supersedes data of 2003 Apr 02
 
2004 Mar 29
P82B96Dual bi-directional bus buffer
PIN CONFIGURATIONS 8-pin dual in-line, SO, TSSOP

FEATURES

Bi-directional data transfer of I
2
C-bus signals
Isolates capacitance allowing 400 pF on Sx/Sy side and
4000 pF on Tx/Ty side
Tx/Ty outputs have 60 mA sink capability for driving
low impedance or high capacitive buses
400 kHz operation over at least 20 meters of wire (see
Supply voltage range of 2 V to 15 V with I
side independent of supply voltage
Splits I
2
C signal into pairs of forward/reverse Tx/Rx, Ty/Ry signals
for interface with opto-electrical isolators and similar devices that need uni-directional input and output signal paths.
2
C logic levels on Sx/Sy
AN10148
Low power supply current
ESD protection exceeds 3500 V HBM per JESD22-A114,
250 V DIP package / 400 V SO package MM per JESD22-A115, and 1000 V CDM per JESD22-C101
Latch-up free (bipolar process with no latching structures)
Packages offered: DIP, SO, and TSSOP

TYPICAL APPLICATIONS

Interface between I
(e.g., 5 V and 3 V or 15 V)
Interface between I
Simple conversion of I
differential bus hardware, e.g., via compatible PCA82C250.
2
C buses operating at different logic levels
2
C and SMB (350 µA) bus standard.
2
C SDA or SCL signals to multi-drop
Interfaces with Opto-couplers to provide Opto isolation between
2
C-bus nodes up to 400 kHz.
I

DESCRIPTION

The P82B96 is a bipolar IC that creates a non-latching, bi-directional, logic interface between the normal I range of other bus configurations. It can interface I signals to similar buses having different voltage and current levels.
For example it can interface to the 350 µA SMB bus, to 3.3 V logic devices, and to 15 V levels and/or low impedance lines to improve noise immunity on longer bus lengths.
It achieves this interface without any restrictions on the normal I protocols or clock speed. The IC adds minimal loading to the I node, and loadings of the new bus or remote I transmitted or transformed to the local node. Restrictions on the number of I between them, are virtually eliminated. Transmitting SDA/SCL signals via balanced transmission lines (twisted pairs) or with galvanic isolation (opto-coupling) is simple because separate directional Tx and Rx signals are provided. The Tx and Rx signals may be directly connected, without causing latching, to provide an alternative bi-directional signal line with I
2
C devices in a system, or the physical separation
2
2
C-bus and a
2
C-bus logic
2
C nodes are not
C properties.
2
2
C
1
2
Rx
3
Tx
45
GND Ty
)
C

PINNING

SYMBOL
Sx Rx Tx
GND
Ty Ry Sy
V
CC
SPECIAL NOTE:
Two or more Sx or Sy I/Os must not be interconnected. The P82B96 design does not support this configuration. Bi-directional I do not allow any direction control pin so, instead, slightly different logic low voltage levels are used at Sx/Sy to avoid latching of this buffer . A “regular I propagated to Sx/Sy as a “buffered low” with a slightly higher voltage level. If this special “buffered low” is applied to the Sx/Sy of another P82B96 that second P82B96 will not recognize it as a “regular I The Sx/Sy side of P82B96 may not be connected to similar buffers that rely on special logic thresholds for their operation, for example PCA9511, PCA9515, or PCA9518. The Sx/Sy side is only intended for, and compatible with, the normal I2C logic voltage levels of I2C master and slave chips—or even Tx/Rx signals of a second P82B96 if required. The Tx/Rx and Ty/Ry I/O pins use the standard I voltage levels of all I interconnection of the Tx/Rx and Ty/Ry I/O pins to other P82B96s, for example in a star or multi-point configuration with the Tx/Rx and Ty/Ry I/O pins on the common bus and the Sx/Sy side connected to the line card slave devices. For more details see
Note AN255
2
C-bus low” and will not propagate it to its Tx/Ty output.
.
PIN
1
I2C-bus (SDA or SCL)
2
Receive signal
3
Transmit signal
4
Negative Supply
5
Transmit signal
6
Receive signal
7
I2C-bus (SDA or SCL)
8
Positive supply
2
C low” applied at the Rx/Ry of a P82B96 will be
2
C parts. There are NO restrictions on the
8Sx
V
CC
7
Sy
6
Ry
SU01011
DESCRIPTION
Application
2
C signals
2
C logic
2004 Mar 29
2
Philips Semiconductors Product data
P82B96Dual bi-directional bus buffer

ORDERING INFORMATION

PACKAGES TEMPERATURE RANGE ORDER CODE TOPSIDE MARK DRAWING NUMBER
8-pin plastic dual In-line package –40 °C to +85 °C P82B96PN P82B96PN SOT97-1 8-pin plastic small outline package –40 °C to +85 °C P82B96TD P82B96T SOT96-1 8-pin plastic thin shrink small outline package –40 °C to +85 °C P82B96DP 82B96 SOT505-1
NOTE:
1. Standard packing quantities and other packaging data are available at www.philipslogic.com/packaging.

BLOCK DIAGRAM

+V
(2–15 V)
CC
8
Sx (SDA)
Sy (SCL)
1
7
P82B96
GND

FUNCTIONAL DESCRIPTION

The P82B96 has two identical buffers allowing buffering of both of
2
the I
C (SDA and SCL) signals. Each buffer is made up of two logic signal paths, a forward path from the I the buffered bus, and a reverse signal path from the buffered bus input to drive the I
2
C-bus interface.
Thus these paths are:
1. Sense the voltage state of the I
this state to the pin Tx (Ty resp.), and
2. Sense the state of the pin Rx (Ry) and pull the I
whenever Rx (Ry) is LOW.
The rest of this discussion will address only the “x” side of the buffer: the “y” side is identical.
2
The I
C pin (Sx) is designed to interface with a normal I2C-bus.
The logic threshold voltage levels on the I2C-bus are independent of the IC supply V
The maximum I2C-bus supply voltage is 15 V and
CC
the guaranteed static sink current is 3 mA. The logic level of Rx is determined from the power supply voltage
V
of the chip. Logic LOW is below 42 % of VCC, and logic HIGH is
CC
above 58 % of V
: with a typical switching threshold of half V
CC
2
C interface pin which drives
2
C pin Sx (or Sy) and transmit
2
C pin LOW
CC.
3
Tx (TxD, SDA)
2
Rx (RxD, SDA)
5
Ty (TxD, SCL)
6
Ry (RxD, SCL)
4
SU01012
Tx is an open collector output without ESD protection diodes to VCC. It may be connected via a pull-up resistor to a supply voltage in excess of V larger current sinking capability than a normal I
as long as the 15 V rating is not exceeded. It has a
CC,
2
C device, being able to sink a static current of greater than 30 mA, and typical 100 mA dynamic pull-down capability as well.
A logic LOW is only transmitted to Tx when the voltage at the I pin (Sx) is below 0.6 V. A logic LOW at Rx will cause the I (Sx) to be pulled to a logic LOW level in accordance with I requirements (max. 1.5 V in 5 V applications) but not low enough to be looped back to the Tx output and cause the buffer to latch LOW.
The minimum LOW level this chip can achieve on the I LOW at Rx is typically 0.8 V.
If the supply voltage V
fails, then neither the I2C nor the Tx output
CC
will be held LOW. Their open collector configuration allows them to be pulled up to the rated maximum of 15 V even without V present. The input configuration on Sx and Rx also present no loading of external signals even when V
is not present.
CC
The effective input capacitance of any signal pin, measured by its effect on bus rise times, is less than 7 pF for all bus voltages and supply voltages including V
CC
= 0 V.
2
C-bus
2
C
2
C-bus by a
CC
2
C
2004 Mar 29
3
Philips Semiconductors Product data
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P82B96Dual bi-directional bus buffer

MAXIMUM RATINGS

In accordance with the Absolute Maximum Rating System (IEC 134). Voltages with respect to pin GND (pin 4).
SYMBOL
VCC to GND V
bus
V
Tx
V
Rx
I R
tot
T
stg
T
amb
Supply voltage range V
CC
Voltage range on I2C Bus, SDA or SCL Voltage range on buffered output Voltage range on receive input DC current (any pin) Power dissipation Storage temperature range Operating ambient temperature range

CHARACTERISTICS

At T
= 25 °C; Voltages are specified with respect to GND with VCC = 5 V unless otherwise stated.
amb
SYMBOL
Power Supply
V
CC
I
CC
I
CC
I
CC
Supply voltage (operating) Supply current, buses HIGH Supply current at VCC = 15 V, buses HIGH Additional supply current per Tx or Ty LOW
Bus pull-up (load) voltages and currents
VSx, V
Sy
ÁÁÁ
ISx, I
Sy
ISx, I
Sy
ÁÁÁ
ISx, I
Sy
ISx, I
Sy
ÁÁÁ
VTx, V
Ty
ITx, I
Ty
ITx, I
Ty
ÁÁÁ
ITx, I
Ty
Maximum input/output voltage level
БББББББББ
Static output loading on I2C-bus (Note 1)
Dynamic output sink capability on I2C-bus
БББББББББ
Leakage current on I2C-bus
Leakage current on I2C-bus
БББББББББ
Maximum output voltage level Static output loading on buffered bus
Dynamic output sink capability, buf fered bus
БББББББББ
Leakage current on buffered bus
Input Currents
ISx, I
Sy
ÁÁÁ
IRx, I
Ry
IRx, I
Ry
Input current from I2C-bus
БББББББББ
Input current from buffered bus
Leakage current on buffered bus input
Output Logic LOW Levels
VSx, V
Sy
VSx, V
Sy
ÁÁÁ
dVSx/dT, dV
/dT
Sy
Output logic level LOW, on normal I2C bus (Note 2)
Output logic level LOW, on normal I2C bus
БББББББББ
(Note 2) Temperature coefficient of output LOW
levels (Note 2)
PARAMETER
PARAMETER
CONDITIONS
Open collector;
2
I
C-bus and VRx, VRy = HIGH
ББББББББ
VSx, VSy = 1.0 V; V
, VRy = LOW
Rx
VSx, VSy > 2 V;
, VRy = LOW
V
ББББББББ
Rx
VSx, VSy = 5 V; V
, VRy = HIGH
Rx
VSx, VSy = 15 V; V
, VRy = HIGH
ББББББББ
Rx
Open collector VTx, V
V
= 0.4 V;
Ty
, VSy = LOW on I2C-bus = 0.4 V
Sx
VTx, VTy > 1 V V
, VSy = LOW on I2C-bus = 0.4 V
Sx
ББББББББ
VTx, VTy = VCC = 15 V; V
, VSy = HIGH
Sx
bus LOW V
ББББББББ
, V
= HIGH
Rx
Ry
bus LOW
, VRy = 0.4 V
V
Rx
VRx, V
= V
Ry
CC
ISx, ISy = 3 mA
ISx, ISy = 0.2 mA
ББББББББ
ISx, ISy = 0.2 mA
MIN.
–0.3 –0.3 –0.3 –0.3
— –55 –40
MIN.
2.0 — — —
ÁÁ
0.2
7
ÁÁ
ÁÁ
— —
60
ÁÁ
ÁÁ
0.8
670
ÁÁ
TYP.
0.9
1.1
1.7
Á
18
Á
1
Á
— —
100
Á
1
–1
Á
–1
1
0.88
730
Á
–1.8
MAX.
+18 +18 +18 +18 250 300
+125
+85
MAX.
15
1.8
2.5
3.5
15
Á
3
Á
1
Á
15 30
Á
Á
1.0
790
Á
UNIT
V V V V
mA
mW
°C °C
UNIT
V mA mA mA
V
ÁÁ
mA
mA
ÁÁ
µA
µA
ÁÁ
V mA
mA
ÁÁ
µA
µA
ÁÁ
µA
µA
V
mV
ÁÁ
mV/K
2004 Mar 29
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P82B96Dual bi-directional bus buffer
SYMBOL
PARAMETER
CONDITIONS
Input logic switching threshold voltages
VSx, V
Sy
VSx, V
Sy
dVSx/dT, dV
/dT
ÁÁÁ
Sy
VRx, V
Ry
VRx, V
Ry
VRx, V
Ry
Input logic voltage LOW (Note 3) Input logic level HIGH threshold (Note 3) Temperature coefficient of input thresholds
БББББББББ
Input logic HIGH level Input threshold Input logic LOW level
On normal I2C-bus On normal I2C-bus
ББББББББÁÁÁ
Fraction of applied V Fraction of applied V Fraction of applied V
CC CC CC
Logic level threshold difference
VSx, V
Sy
ÁÁÁ
Input/Output logic level difference (Note 1)
БББББББББ
VSX output LOW at 0.2 mA – V
input HIGH max
ББББББББ
SX
NOTES:
1. The minimum value requirement for pull-up current, 200 µA, guarantees that the minimum value for V minimum V the tolerances on absolute levels allow a small probability the LOW from one S
has no consequences for normal applications. In any design the S
would be very susceptible to induced noise and would not support all I
2. The output logic LOW depends on the sink current. For scaling, see
input HIGH level to eliminate any possibility of latching. The specified difference is guaranteed by design within any IC. While
SX
pins of different ICs should never be linked because the resulting system
X
2
C operating modes.
Application Note AN255
output is recognized by an SX input of another P82B96 this
X
.
3. The input logic threshold is independent of the supply voltage.
CHARACTERISTICS
At T
= 25 °C; Voltages are specified with respect to GND with V
amb
SYMBOL
PARAMETER
Bus Release on VCC Failure
VSx, VSy, V
, V
ÁÁÁ
Tx
Ty
dV/dT
V
voltage at which all buses are
CC
guaranteed to be released
ББББББББББ
Temperature coefficient of guaranteed release voltage
Buffer response time
T
fall delay
VSx to V
ÁÁÁ
VSy to V T
rise delay
ÁÁÁ
VSx to V VSy to V
ÁÁÁ
T
fall delay
ÁÁÁ
VRx to V VRy to V
ÁÁÁ
T
rise delay
VRx to V
ÁÁÁ
VRy to V
Buffer time delay on F ALLING input between V
= input switching threshold,
Tx Ty
Tx Ty
Sx Sy
ББББББББББ
Sx
and V
output falling 50%.
Tx
Buffer time delay on RISING input between
ББББББББББ
V
= input switching threshold,
Sx
and V
output reaching 50% V
Tx
ББББББББББ
Buffer time delay on F ALLING input between
ББББББББББ
V
= input switching threshold,
Rx
and V
output falling 50%.
Sx
ББББББББББ
Buffer time delay on RISING input between V
Sx Sy
= input switching threshold,
Rx
ББББББББББ
and V
output reaching 50% V
Sx
Input capacitance
C
in
Effective input capacitance of any signal pin measured by incremental bus rise times
NOTES ON RESPONSE TIME
The fall-time of V The fall-time of V The rise-time of V The rise-time of V
from 5 V to 2.5 V in the test is approximately 15 ns.
TX
from 5 V to 2.5 V in the test is approximately 50 ns.
SX
from 0 V to 2.5 V in the test is approximately 20 ns.
TX
from 0.9 V to 2.5 V in the test is approximately 70 ns.
SX
CC
CC
= 5 V unless otherwise stated.
CC
CONDITIONS
ББББББÁÁÁ
MIN.
RTx pull-up = 160 Ω, no capacitive load, V
ББББББ
RTx pull-up = 160 Ω,
ББББББ
no capacitive load, V
ББББББ
RSx pull-up = 1500 , no
ББББББ
capacitive load, V
ББББББ
CC
CC
CC
= 5 V
= 5 V
= 5 V
ÁÁ
ÁÁ
ÁÁ
ÁÁ
ÁÁ
RSx pull-up = 1500 Ω, no capacitive load, V
ББББББ
CC
= 5 V
ÁÁ
–2
Á
85
Á
MAX.
600
— —
Á
— —
0.42
Á
MAX.
1
Á
Á
Á
Á
Á
Á
Á
7
MIN.
700
TYP.
640 650
0.58 —
0.5
50
ÁÁ
output LOW will always exceed the
SX
TYP.
ÁÁ
–4
70
ÁÁ
90
ÁÁ
ÁÁ
250
ÁÁ
ÁÁ
270
ÁÁ
UNIT
mV mV
mV/K
ÁÁ
V V V
mV
ÁÁ
UNIT
V
ÁÁ
mV/K
ns
ÁÁ
ns
ÁÁ
ÁÁ
ns
ÁÁ
ÁÁ
ns
ÁÁ
pF
2004 Mar 29
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