Philips P83C652IFAA, P83C652IBAA, P83C652IBA, P83C652FFPN, P80C652IFA Datasheet

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80C652/83C652
CMOS single-chip 8-bit microcontrollers
Product specification 1996 Aug 15
INTEGRATED CIRCUITS
IC20 Data Handbook
Phlips Semiconductors Product specification
80C652/83C652CMOS single-chip 8-bit microcontrollers
2
1996 Aug 15
DESCRIPTION
The P80C652/83C652 Single-Chip 8-Bit Microcontroller is manufactured in an advanced CMOS process and is a derivative of the 80C51 microcontroller family. The 80C652/83C652 has the same instruction set as the 80C51. Three versions of the derivative exist:
83C652 — 8k bytes mask programmable
ROM 80C652 — ROMless version 87C652 — EPROM version (described in a
separate chapter) This device provides architectural
enhancements that make it applicable in a variety of applications for general control systems. The 8XC652 contains a non-volatile 8k × 8 read-only program memory, a volatile 256 × 8 read/write data memory, four 8-bit I/O ports, two 16-bit timer/event counters (identical to the timers of the 80C51), a multi-source, two-priority-level, nested interrupt structure, an I
2
C interface, UART and on-chip oscillator and timing circuits. For systems that require extra capability, the 8XC652 can be expanded using standard TTL compatible memories and logic.
The device also functions as an arithmetic processor having facilities for both binary and BCD arithmetic plus bit-handling capabilities. The instruction set consists of over 100 instructions: 49 one-byte, 45 two-byte and 17 three-byte. With a 16(24)MHz crystal, 58% of the instructions are executed in 0.75(0.5)µs and 40% in 1.5(1)µs. Multiply and divide instructions require 3(2)µs.
LOGIC SYMBOL
FEATURES
80C51 central processing unit
8k × 8 ROM expandable externally to
64k bytes
256 × 8 RAM, expandable externally to
64k bytes
Two standard 16-bit timer/counters
Four 8-bit I/O ports
I
2
C-bus serial I/O port with byte oriented
master and slave functions
Full-duplex UART facilities
Power control modes
Idle modePower-down mode
ROM code protection
Extended frequency range: 1.2 to 24 MHz
Three operating ambient temperature
ranges:
0 to +70°C –40 to +85°C –40 to +125°C
PIN CONFIGURATIONS
1 2 3
4 5
6
7
8
9 10 11 12 13
14 15 16 17 18 19 20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
P1.0 P1.1
P1.2
P1.3 P1.4
P1.5
SCL/P1.6
RST RxD/P3.0 TxD/P3.1
INT0
/P3.2
INT1
/P3.3 T0/P3.4 T1/P3.5
SDA/P1.7
RD
/P3.7
XTAL2 XTAL1
V
SS
P2.0/A8
P2.1/A9
P2.2/A10
P2.3/A11
P2.4/A12
P2.5/A13
P2.6/A14
P2.7/A15
PSEN
ALE
EA
P0.7/AD7
P0.6/AD6
P0.5/AD5
P0.4/AD4
P0.3/AD3
P0.2/AD2
P0.1/AD1
P0.0/AD0
V
DD
6 1 40
7
17
39
29
18 28
44
34
1
11
33
23
12 22
WR
/P3.6
PLASTIC
DUAL
IN-LINE
PACKAGE
PLASTIC
LEADED
CHIP
CARRIER
PLASTIC
QUAD
FLAT
PACK
Phlips Semiconductors Product specification
80C652/83C652CMOS single-chip 8-bit microcontrollers
1996 Aug 15
3
CERAMIC AND PLASTIC LEADED CHIP CARRIER PIN FUNCTIONS
6 1 40
7
17
39
29
18 28
CERAMIC
AND
PLASTIC
LEADED CHIP
CARRIER
Pin Function Pin Function
1 NC* 23 NC* 2 P1.0 24 P2.0/A8 3 P1.1 25 P2.1/A9 4 P1.2 26 P2.2/A10 5 P1.3 27 P2.3/A11 6 P1.4 28 P2.4/A12 7 P1.5 29 P2.5/A13 8 P1.6/SCL 30 P2.6/A14 9 P1.7/SDA 31 P2.7/A15
10 RST 32 PSEN
11 P3.0/RxD 33 ALE 12 NC* 34 NC* 13 P3.1/TxD 35 EA 14 P3.2/INT0 36 P0.7/AD7 15 P3.3/INT1 37 P0.6/AD6 16 P3.4/T0 38 P0.5/AD5 17 P3.5/T1 39 P0.4/AD4 18 P3.6/WR 40 P0.3/AD3 19 P3.7/RD 41 P0.2/AD2 20 XTAL2 42 P0.1/AD1 21 XTAL1 43 P0.0/AD0 22 V
SS
44 V
DD
*DO NOT CONNECT
PLASTIC QUAD FLAT PACK PIN FUNCTIONS
44 34
1
11
33
23
12 22
PLASTIC
QUAD
FLAT
PACK
Pin Function Pin Function
1 P1.5 23 P2.5/A13 2 P1.6/SCL 24 P2.6/A14 3 P1.7/SDA 25 P2.7/A15 4 RST 26 PSEN 5 P3.0/RxD 27 ALE 6 V
SS4
28 V
SS2
7 P3.1/TxD 29
EA
/V
PP
8 P3.2/INT0 30 P0.7/AD7
9 P3.3/INT1 31 P0.6/AD6 10 P3.4/T0 32 P0.5/AD5 11 P3.5/T1 33 P0.4/AD4 12 P3.6/WR 34 P0.3/AD3 13 P3.7/RD 35 P0.2/AD2 14 XTAL2 36 P0.1/AD1 15 XTAL1 37 P0.0/AD0 16 V
SS1
38 V
DD
17 NC* 39 V
SS3
18 P2.0/A8 40 P1.0 19 P2.1/A9 41 P1.1 20 P2.2/A10 42 P1.2 21 P2.3/A11 43 P1.3 22 P2.4/A12 44 P1.4
*DO NOT CONNECT
NOTES TO QFP ONLY:
1. Due to EMC improvements, all V
SS
pins
(6, 16, 28, 39) must be connected to V
SS
on the 80C652/83C652.
Phlips Semiconductors Product specification
80C652/83C652CMOS single-chip 8-bit microcontrollers
1996 Aug 15
4
ORDER INFORMATION
PHILIPS
PART ORDER NUMBER
PART MARKING
PHILIPS NORTH AMERICA
PART ORDER NUMBER
TEMPERATURE
RANGE (°C)
FREQ
ROMless ROM
3
Drawing
Number
ROMless ROM AND PACKAGE MHz
1,2
P80C652FBP P83C652FBP/xxx SOT129-1 P80C652FBPN P83C652FBPN 0 to +70, Plastic Dual In-line Package 16
P80C652FBA P83C652FBA/xxx SOT187-2 P80C652FBAA P83C652FBAA 0 to +70, Plastic Leaded Chip Carrier 16
P80C652FBB P83C652FBB/xxx SOT307-24P80C652FBBB P83C652FBBB 0 to +70, Plastic Quad Flat Pack 16 P80C652FFP P83C652FFP/xxx SOT129-1 P80C652FFPN P83C652FFPN –40 to +85, Plastic Dual In-line Package 16
P80C652FFA P83C652FFA/xxx SOT187-2 P80C652FFAA P83C652FFAA –40 to +85, Plastic Leaded Chip Carrier 16 P80C652FFB P83C652FFB/xxx SOT307-24P80C652FFBB P83C652FFBB –40 to +85, Plastic Quad Flat Pack 16 P80C652FHP P83C652FHP/xxx SOT129-1 P80C652FHPN P83C652FHPN –40 to +125, Plastic Dual In-line Package 16 P80C652FHA P83C652FHA/xxx SOT187-2 P80C652FHAA P83C652FHAA –40 to +125, Plastic Leaded Chip Carrier 16 P80C652FHB P83C652FHB/xxx SOT307-24P80C652FHBB P83C652FHBB –40 to +125, Plastic Quad Flat Pack 16
P80C652IBP P83C652IBP/xxx SOT129-1 P80C652IBPN P83C652IBPN 0 to +70, Plastic Dual In-line Package 24 P80C652IBA P83C652IBA/xxx SOT187-2 P80C652IBAA P83C652IBAA 0 to +70, Plastic Leaded Chip Carrier 24 P80C652IBB P83C652IBB/xxx SOT307-24P80C652IBBB P83C652IBBB 0 to +70, Plastic Quad Flat Pack 24 P80C652IFP P83C652IFP/xxx SOT129-1 P80C652IFPN P83C652IFPN –40 to +85, Plastic Dual In-line Package 24 P80C652IFA P83C652IFA/xxx SOT187-2 P80C652IFAA P83C652IFAA –40 to +85, Plastic Leaded Chip Carrier 24 P80C652IFB P83C652IFB/xxx SOT307-24P80C652IFBB P83C652IFBB –40 to +85, Plastic Quad Flat Pack 24
NOTES:
1. 80C652 and 83C652 frequency range is 1.2MHz–16MHz or 1.2 to 24MHz.
2. For specification of the EPROM version, see the 87C652 data sheet.
3. xxx denotes the ROM code number.
4. SOT311 replaced by SOT307-2.
Phlips Semiconductors Product specification
80C652/83C652CMOS single-chip 8-bit microcontrollers
1996 Aug 15
5
TEMPERATURE
RANGE (°C)
FREQ
EPROM
2
Drawing Number
AND PACKAGE MHz
1,2
S87C652-4N40 SOT129-1 0 to +70, Plastic Dual In-line Package 16 S87C652-4F40 0590B
0 to +70, Ceramic Dual In-line
Package w/Window
16
S87C652-4A44 SOT187-2 0 to +70, Plastic Leaded Chip Carrier 16 S87C652-4K44 1472A
0 to +70, Ceramic Leaded Chip Carrier
w/Window
16
S87C652-4B44 SOT307-2 0 to +70, Plastic Quad Flat Pack 16 S87C652-5N40 SOT129-1 –40 to +85, Plastic Dual In-line Package 16
S87C652-5F40 0590B
–40 to +85, Ceramic Dual In-line Package
w/Window
16
S87C652-5A44 SOT187-2 –40 to +85, Plastic Leaded Chip Carrier 16 S87C652-5B44 SOT307-2 –40 to +85, Plastic Quad Flat Pack 16
S87C652-7N40 SOT129-1 0 to +70, Plastic Dual In-line Package 20 S87C652-7F40 0590B
0 to +70, Ceramic Dual In-line Package
w/Window
20 S87C652-7A44 SOT187-2 0 to +70, Plastic Leaded Chip Carrier 20 S87C652-7K44 1472A
0 to +70, Ceramic Leaded Chip Carrier
w/Window
20
S87C652-8N40 SOT129-1 –40 to +85, Plastic Dual In-line Package 20 S87C652-8F40 0590B
–40 to +85, Ceramic Dual In-line Package
w/Window
20
S87C652-8A44 SOT187-2 –40 to +85, Plastic Leaded Chip Carrier 20
Phlips Semiconductors Product specification
80C652/83C652CMOS single-chip 8-bit microcontrollers
1996 Aug 15
6
BLOCK DIAGRAM
64K BYTE BUS
EXPANSION
CONTRTOL
PROG SERIAL PORT FULL DUPLEX UART
SYNCHRONOUS SHIFT
PROGRAMMABLE I/O
CPU
OSCILLATOR
AND
TIMING
PROGRAM
MEMORY
DATA
MEMORY
(256 x 8 RAM)
TWO 16-BIT
TIMER/EVENT
COUNTERS
I
2
C SERIAL I/O
SDA
SCL
SHARED
WITH
PORT 1
T0 T1
COUNTERS
XTAL2 XTAL1
FREQUENCY REFERENCE
INTERNAL
INTERRUPTS
EXTERNAL
INTERRUPTS
CONTROL
PARALLEL PORTS,
ADDRESS/DATA BUS
AND I/O PINS
SERIAL IN SERIAL OUT
SHARED WITH
PORT 3
(8K x 8 ROM)
INT0
INT1
Phlips Semiconductors Product specification
80C652/83C652CMOS single-chip 8-bit microcontrollers
1996 Aug 15
7
PIN DESCRIPTIONS
PIN NUMBER
MNEMONIC
DIP PLCC QFP TYPE NAME AND FUNCTION
V
SS
20 22 6, 16,
28, 39
I Ground: 0V reference. With the QFP package all VSS pins (V
SS1
to V
SS4
) must be
connected.
V
DD
40 44 38 I Power Supply: This is the power supply voltage for normal, idle, and power-down
operation.
P0.0–0.7 39–32 43–36 37–30 I/O Port 0: Port 0 is an open-drain, bidirectional I/O port. Port 0 pins that have 1s written to
them float and can be used as high-impedance inputs. Port 0 is also the multiplexed low-order address and data bus during accesses to external program and data memory. In this application, it uses strong internal pull-ups when emitting 1s.
P1.0–P1.7 1–8 2–9 40–44,
1–3
I/O Port 1: Port 1 is an 8-bit bidirectional I/O port with internal pull-ups, except P1.6 and P1.7
which are open drain. Port 1 pins that have 1s written to them are pulled high by the internal pull-ups and can be used as inputs. As inputs, port 1 pins that are externally pulled low will source current because of the internal pull-ups. (See DC Electrical Characteristics: I
IL
). Alternate functions include: P1.6 7 8 2 I/O SCL: I2C-bus serial port clock line. P1.7 8 9 3 I/O SDA: I2C-bus serial port data line.
P2.0–P2.7 21–28 24–31 18–25 I/O Port 2: Port 2 is an 8-bit bidirectional I/O port with internal pull-ups. Port 2 pins that have 1s
written to them are pulled high by the internal pull-ups and can be used as inputs. As inputs, port 2 pins that are externally being pulled low will source current because of the internal pull-ups. (See DC Electrical Characteristics: I
IL
). Port 2 emits the high-order address byte during fetches from external program memory and during accesses to external data memory that use 16-bit addresses (MOVX @DPTR). In this application, it uses strong internal pull-ups when emitting 1s. During accesses to external data memory that use 8-bit addresses (MOV @Ri), port 2 emits the contents of the P2 special function register.
P3.0–P3.7 10–17 11,
13–195,7–13
I/O Port 3: Port 3 is an 8-bit bidirectional I/O port with internal pull-ups. Port 3 pins that have 1s
written to them are pulled high by the internal pull-ups and can be used as inputs. As inputs, port 3 pins that are externally being pulled low will source current because of the pull-ups. (See DC Electrical Characteristics: I
IL
). Port 3 also serves the special features of
the 80C51 family, as listed below:
10 11 5 I RxD (P3.0): Serial input port 11 13 7 O TxD (P3.1): Serial output port 12 14 8 I INT0 (P3.2): External interrupt 13 15 9 I INT1 (P3.3): External interrupt 14 16 10 I T0 (P3.4): Timer 0 external input 15 17 11 I T1 (P3.5): Timer 1 external input 16 18 12 O WR (P3.6): External data memory write strobe 17 19 13 O RD (P3.7): External data memory read strobe
RST 9 10 4 I Reset: A high on this pin for two machine cycles while the oscillator is running, resets the
device. An internal diffused resistor to V
SS
permits a power-on reset using only an external
capacitor to V
DD
.
ALE 30 33 27 I/O Address Latch Enable: Output pulse for latching the low byte of the address during an
access to external memory. In normal operation, ALE is emitted at a constant rate of 1/6 the oscillator frequency. Note that one ALE pulse is skipped during each access to external data memory.
PSEN 29 32 26 O Program Store Enable: Read strobe to external program memory via Port 0 and Port 2. It
is activated twice each machine cycle during fetches from the external program memory. When executing out of external program memory two activations of PSEN
are skipped
during each access to external data memory. PSEN
is not activated (remains HIGH) during
no fetches from external program memory. PSEN
can sink/source 8 LSTTL inputs and can
drive CMOS inputs without external pull–ups.
EA 31 35 29 I External Access: If during a RESET, EA is held at TTL, level HIGH, the CPU executes out
of the internal program memory ROM provided the Program Counter is less than 8192. If during a RESET, EA
is held a TTL LOW level, the CPU executes out of external program
memory. EA
is not allowed to float.
XTAL1 19 21 15 I Crystal 1: Input to the inverting oscillator amplifier and input to the internal clock generator
circuits.
XTAL2 18 20 14 O Crystal 2: Output from the inverting oscillator amplifier.
NOTE:
To avoid “latch-up” effect at power-on, the voltage on any pin at any time must not be higher than V
DD
+ 0.5V or VSS – 0.5V, respectively.
Phlips Semiconductors Product specification
80C652/83C652CMOS single-chip 8-bit microcontrollers
1996 Aug 15
8
Table 1. 8XC652/654 Special Function Registers
SYMBOL DESCRIPTION
DIRECT
ADDRESS
BIT ADDRESS, SYMBOL, OR ALTERNATIVE PORT FUNCTION MSB LSB
RESET VALUE
ACC* Accumulator E0H E7 E6 E5 E4 E3 E2 E1 E0 00H B* B register F0H F7 F6 F5 F4 F3 F2 F1 F0 00H DPTR:
DPH DPL
Data pointer (2 bytes) Data pointer high Data pointer low
83H 82H
00H 00H
AF AE AD AC AB AA A9 A8
IE*# Interrupt enable A8H EA ES1 ES0 ET1 EX1 ET0 EX0 0x000000B
BF BE BD BC BB BA B9 B8
IP*# Interrupt priority B8H PS1 PS0 PT1 PX1 PT0 PX0 xx000000B
87 86 85 84 83 82 81 80
P0* Port 0 80H AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 FFH
97 96 95 94 93 92 91 90
P1*# Port 1 90H SDA SCL FFH
A7 A6 A5 A4 A3 A2 A1 A0
P2* Port 2 A0H A15 A14 A13 A12 A11 A10 A9 A8 FFH
B7 B6 B5 B4 B3 B2 B1 B0 P3* Port 3 B0H RD WR T1 T0 INT1 INT0 TXD RXD FFH PCON Power control 87H SMOD GF1 GF0 PD IDL 0xxx0000B
9F 9E 9D 9C 9B 9A 99 98 S0CON*# Serial 0 port control 98H SM0 SM1 SM2 REN TB8 RB8 TI RI 00H S0BUF# Serial 0 data buffer 99H xxxxxxxxB
D7 D6 D5 D4 D3 D2 D1 D0 PSW* Program status word D0H CY AC F0 RS1 RS0 OV F1 P 00H S1DAT# Serial 1 data DAH 00H SP Stack pointer 81H 07H S1ADR# Serial 1 address DBH
 SLAVE ADDRESS 
GC 00H
S1STA# Serial 1 status D9H SC4 SC3 SC2 SC1 SC0 0 0 0 F8H
DF DE DD DC DB DA D9 D8 S1CON*# Serial 1 control D8H CR2 ENS1 STA STO SI AA CR1 CR0 00000000B
8F 8E 8D 8C 8B 8A 89 88 TCON* Timer control 88H TF1 TR1 TF0 TR0 IE1 IT1 IE0 IT0 00H TH1 Timer high 1 8DH 00H TH0 Timer high 0 8CH 00H TL1 Timer low 1 8BH 00H TL0 Timer low 0 8AH 00H TMOD Timer mode 89H GATE C/T M1 M0 GATE C/T M1 M0 00H
* SFRs are bit addressable. # SFRs are modified from or added to the 80C51 SFRs.
Phlips Semiconductors Product specification
80C652/83C652CMOS single-chip 8-bit microcontrollers
1996 Aug 15
9
ROM CODE PROTECTION (83C652)
The 8XC652 has an additional security feature. ROM code protection may be selected by setting a mask–programmable security bit (i.e., user dependent). This feature may be requested during ROM code submission. When selected, the ROM code is protected and cannot be read out at any time by any test mode or by any instruction in the external program memory space.
The MOVC instructions are the only instructions that have access to program code in the internal or external program memory. The EA
input is latched during RESET and is “don’t care” after RESET (also if the security bit is not set). This implementation prevents reading internal program code by switching from external program memory to internal program memory during a MOVC instruction or any other instruction that uses immediate data.
OSCILLATOR CHARACTERISTICS
XTAL1 and XTAL2 are the input and output, respectively, of an inverting amplifier. The pins can be configured for use as an on-chip oscillator, as shown in the Logic Symbol, page 2.
To drive the device from an external clock source, XTAL1 should be driven while XTAL2 is left unconnected. There are no requirements on the duty cycle of the external clock signal, because the input to the internal clock circuitry is through a divide-by-two flip-flop. However, minimum and maximum high and low times specified in the data sheet must be observed.
Reset
A reset is accomplished by holding the RST pin high for at least two machine cycles (24 oscillator periods), while the oscillator is running. To insure a good power-on reset, the RST pin must be high long enough to allow the oscillator time to start up (normally a few milliseconds) plus two machine cycles. At power-on, the voltage on V
DD
and RST must come up at the same time for a proper start-up.
Idle Mode
In the idle mode, the CPU puts itself to sleep while all of the on-chip peripherals stay active. The instruction to invoke the idle mode is the last instruction executed in the normal operating mode before the idle mode is activated. The CPU contents, the on-chip RAM, and all of the special function registers remain intact during this mode. The idle mode can be terminated either by any
enabled interrupt (at which time the process is picked up at the interrupt service routine and continued), or by a hardware reset which starts the processor in the same manner as a power-on reset.
Power-Down Mode
In the power-down mode, the oscillator is stopped and the instruction to invoke power-down is the last instruction executed. Only the contents of the on-chip RAM are preserved. A hardware reset is the only way to terminate the power-down mode. The control bits for the reduced power modes are in the special function register PCON. Table 2 shows the state of the I/O ports during low current operating modes.
I2C Serial Communication—SIO1
The I2C serial port is identical to the I2C serial port on the 8XC552. The operation of this subsystem is described in detail in the 8XC552 section of this manual.
Note that in both the 8XC652/4 and the 8XC552 the I
2
C pins are alternate functions to port pins P1.6 and P1.7. Because of this, P1.6 and P1.7 on these parts do not have a pull-up structure as found on the 80C51. Therefore P1.6 and P1.7 have open drain outputs on the 8XC652/4.
Table 2. External Pin Status During Idle and Power-Down Mode
MODE
PROGRAM
MEMORY
ALE PSEN PORT 0 PORT 1 PORT 2 PORT 3
Idle Internal 1 1 Data Data Data Data Idle External 1 1 Float Data Address Data Power-down Internal 0 0 Data Data Data Data Power-down External 0 0 Float Data Data Data
Serial Control Register (S1CON) – See Table 3
CR2 ENS1 STA STO SI AA CR1 CR0
S1CON (D8H)
Bits CR0, CR1 and CR2 determine the serial clock frequency that is generated in the master mode of operation.
Table 3. Serial Clock Rates
BIT FREQUENCY (kHz) AT f
OSC
CR2 CR1 CR0
6MHz 12MHz 16MHz 24MHz f
OSC
DIVIDED BY
0 0 0 23 47 62.5 94 256 0 0 1 27 54 71 107
1
224
0 1 0 31.25 62.5 83.3 125
1
192
0 1 1 37 75 100 150
1
160 1 0 0 6.25 12.5 17 25 960 1 0 1 50 100 133
1
200
1
120 1 1 0 100 200
1
267
1
400
1
60
1 1 1 0.24 < 62.5
0 to 255
0.49 < 62.5 0 to 254
0.65 < 55.6 0 to 253
0.98 < 50.0 0 to 251
96 × (256 – (reload value Timer 1))
reload value range Timer 1 (in mode 2)
NOTES:
1. These frequencies exceed the upper limit of 100kHz of the I
2
C-bus specification and cannot be used in an I2C-bus application.
Phlips Semiconductors Product specification
80C652/83C652CMOS single-chip 8-bit microcontrollers
1996 Aug 15
10
ABSOLUTE MAXIMUM RATINGS
1, 2, 3
PARAMETER RATING UNIT
Storage temperature range –65 to +150 °C Voltage on any other pin to V
SS
–0.5 to + 6.5 V
Input, output current on any single pin
±5
mA
Power dissipation (based on package heat transfer limitations, not device power consumption)
1 W
NOTES:
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in the AC and DC Electrical Characteristics section of this specification is not implied.
2. This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima.
3. Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
SS
unless otherwise noted.
DEVICE SPECIFICATIONS
TYPE
SUPPLY VOLTAGE
(V)
FREQUENCY
(MHz)
TEMPERATURE
RANGE
TYPE
MIN. MAX. MIN. MAX.
RANGE
(°C)
P8XC652FBx 4.0 6.0 1.2 16 0 to +70 P8XC652FFx 4.0 6.0 1.2 16 –40 to +85 P8XC652FHx 4.5 5.5 1.2 16 –40 to +125
P8XC652IBx 4.5 5.5 1.2 24 0 to +70
P83X652IFx 4.5 5.5 1.2 24 –40 to +85
Phlips Semiconductors Product specification
80C652/83C652CMOS single-chip 8-bit microcontrollers
1996 Aug 15
11
DC ELECTRICAL CHARACTERISTICS
VSS = 0V
TEST LIMITS
SYMBOL PARAMETER PART TYPE CONDITIONS MIN. MAX. UNIT
V
IL
Input low voltage, except EA, P1.6/SCL, P1.7/SDA 0 to +70°C –0.5 0.2VDD–0.1 V
–40 to +85°C –0.5 0.2VDD–0.15 V
–40 to +125°C –0.5 0.2VDD–0.25 V
V
IL1
Input low voltage to EA 0 to +70°C –0.5 0.2VDD–0.3 V
–40 to +85°C –0.5 0.2VDD–0.35 V
–40 to +125°C –0.5 0.2VDD–0.45 V
V
IL2
Input low voltage to P1.6/SCL, P1.7/SDA
6
–0.5 0.3V
DD
V
V
IH
Input high voltage, except XTAL1, RST, P1.6/SCL, P1.7/SDA
0 to +70°C 0.2VDD+0.9 VDD+0.5 V
–40 to +85°C 0.2VDD+1.0 VDD+0.5 V
–40 to +125°C 0.2VDD+1.0 VDD+0.5 V
V
IH1
Input high voltage, XTAL1, RST 0 to +70°C 0.7V
DD
VDD+0.5 V
–40 to +85°C 0.7VDD+0.1 VDD+0.5 V
–40 to +125°C 0.7VDD+0.1 VDD+0.5 V
V
IH2
Input high voltage, P1.6/SCL, P1.7/SDA
6
0.7V
DD
6.0 V
V
OL
Output low voltage, ports 1, 2, 3, except P1.6/SCL, P1.7/SDA
IOL = 1.6mA
8, 9
0.45 V
V
OL1
Output low voltage, port 0, ALE, PSEN IOL = 3.2mA
8, 9
0.45 V
V
OL2
Output low voltage, P1.6/SCL, P1.7/SDA IOL = 3.0mA 0.4 V
V
OH
Output high voltage, ports 1, 2, 3, ALE, PSEN
10
IOH = –60µA 2.4 V IOH = –25µA 0.75V
DD
V
IOH = –10µA 0.9V
DD
V
V
OH1
Output high voltage; port 0 in external bus mode IOH = –800µA 2.4 V
IOH = –300µA 0.75V
DD
V
IOH = –80µA 0.9V
DD
V
I
IL
Logical 0 input current, ports 1, 2, 3, except P1.6/SCL, P1.7/SDA
0 to +70°C VIN = 0.45V –50 µA
–40 to +85°C –75 µA
–40 to +125°C –75 µA
I
TL
Logical 1-to-0 transition current, ports 1, 2, 3, except P1.6/SCL, P1.7/SDA
0 to +70°C See note 7 –650 µA
–40 to +85°C –750 µA
–40 to +125°C –750 µA
I
L1
Input leakage current, port 0, EA 0.45V < V
I
< V
DD
±10 µA
I
L2
Input leakage current, P1.6/SCL, P1.7/SDA 0V < V
I
< 6.0V
0V < V
DD
< 6.0V
±10 µA
µA
I
DD
Power supply current: See note 1
Active mode @ 16MHz
2, 11
VDD=6.0V 26.5 mA
Active mode @ 24MHz
2, 11
VDD=5.5V 33.8 mA
Idle mode @ 16MHz
3, 11
6 mA
Idle mode @ 24MHz
3, 11
7 mA
Power down mode
4, 5
50 µA
Power down mode
4, 5
–40 to +125°C 100 µA
R
RST
Internal reset pull-down resistor 50 150 k
C
IO
Pin capacitance Freq.=1MHz 10 pF
NOTES ON NEXT PAGE.
Phlips Semiconductors Product specification
80C652/83C652CMOS single-chip 8-bit microcontrollers
1996 Aug 15
12
NOTES FOR DC ELECTRICAL CHARACTERISTICS:
1. See Figures 9 through 11 for I
DD
test conditions.
2. The operating supply current is measured with all output pins disconnected; XTAL1 driven with t
r
= tf = 5ns;
V
IL
= VSS + 0.5V; VIH = V
DD
–0.5V; XTAL2 not connected; EA = RST = Port 0 = P1.6 = P1.7 = VDD. See Figure 9.
3. The idle mode supply current is measured with all output pins disconnected; XTAL1 driven with t
r
= tf = 5ns; VIL = VSS + 0.5V;
V
IH
= V
DD
–0.5V; XTAL2 not connected; Port 0 = P1.6 = P1.7 = VDD; EA = RST = VSS. See Figure 10.
4. The power-down current is measured with all output pins disconnected; XTAL2 not connected; Port 0 = P1.6 = P1.7 = V
DD
;
EA
= RST = VSS. See Figure 11.
5. 2V
V
PD
VDDmax.
6. The input threshold voltage of P1.6 and P1.7 (SIO1) meets the I
2
C specification, so an input voltage below 0.3VDD will be recognized as a
logic 0 while an input voltage above 0.7V
DD
will be recognized as a logic 1.
7. Pins of ports 1 , 2, and 3 source a transition current when they are being externally driven from 1 to 0. The transition current reaches its maximum value when V
IN
is approximately 2V.
8. Capacitive loading on ports 0 and 2 may cause spurious noise to be superimposed on the V
OL
s of ALE and ports 1 and 3. The noise is due to external bus capacitance discharging into the port 0 and port 2 pins when these pins make 1-to-0 transitions during bus operations. In the worst cases (capacitive loading > 100pF), the noise pulse on the ALE pin may exceed 0.8V . In such cases, it may be desirable to qualify ALE with a Schmitt Trigger, or use an address latch with a Schmitt Trigger STROBE input.
9. Under steady state (non-transient) conditions, I
OL
must be externally limited as follows: Maximum IOL = 10mA per port pin; Maximum
I
OL
= 26mA total for Port 0; Maximum IOL = 15mA total for Ports 1, 2, and 3; Maximum IOL = 71mA total for all output pins. If IOL exceeds the
test conditions, V
OL
may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test conditions.
10.Capacitive loading on ports 0 and 2 may cause the V
OH
on ALE and PSEN to momentarily fall below the 0.9VDD specification when the
address bits are stabilizing.
11.I
DDMAX
for other frequencies can be derived from Figure 1, where FREQ is the external oscillator frequency in MHz. I
DDMAX
is given in mA.
40
30
20
10
0
0 4 8 12 16
(1) MAXIMUM OPERATING MODE: V
DD
= V
DDmax
(2) MAXIMUM IDLE MODE: VDD = V
DDmax
f
XTAL1
(MHz)
I
DD
(mA)
Figure 1. IDD vs. Frequency
40
30
20
10
0
0
4
8 12 16
(2)
(1)
24
50
I
DD
(mA)
f
XTAL1
(MHz)
These values are valid within the specified frequency range.
(1) MAXIMUM OPERATING MODE: V
DD
= V
DDmax
(2) MAXIMUM IDLE MODE: VDD = V
DDmax
These values are valid within the specified frequency range.
(1)
(2)
Phlips Semiconductors Product specification
80C652/83C652CMOS single-chip 8-bit microcontrollers
1996 Aug 15
13
AC ELECTRICAL CHARACTERISTICS
1, 2
(16 MHz type)
16MHz CLOCK VARIABLE CLOCK
SYMBOL FIGURE PARAMETER MIN MAX MIN MAX UNIT
1/t
CLCL
2 Oscillator frequency 1.2 16 MHz
t
LHLL
2 ALE pulse width 85 2t
CLCL
–40 ns
t
AVLL
2 Address valid to ALE low 8 t
CLCL
–55 ns
t
LLAX
2 Address hold after ALE low 28 t
CLCL
–35 ns
t
LLIV
2 ALE low to valid instruction in 150 4t
CLCL
–100 ns
t
LLPL
2 ALE low to PSEN low 23 t
CLCL
–40 ns
t
PLPH
2 PSEN pulse width 143 3t
CLCL
–45 ns
t
PLIV
2 PSEN low to valid instruction in 83 3t
CLCL
–105 ns
t
PXIX
2 Input instruction hold after PSEN 0 0 ns
t
PXIZ
2 Input instruction float after PSEN 38 t
CLCL
–25 ns
t
AVIV
2 Address to valid instruction in 208 5t
CLCL
–105 ns
t
PLAZ
2 PSEN low to address float 10 10 ns
Data Memory
t
RLRH
3, 4 RD pulse width 275 6t
CLCL
–100 ns
t
WLWH
3, 4 WR pulse width 275 6t
CLCL
–100 ns
t
RLDV
3, 4 RD low to valid data in 148 5t
CLCL
–165 ns
t
RHDX
3, 4 Data hold after RD 0 0 ns
t
RHDZ
3, 4 Data float after RD 55 2t
CLCL
–70 ns
t
LLDV
3, 4 ALE low to valid data in 350 8t
CLCL
–150 ns
t
AVDV
3, 4 Address to valid data in 398 9t
CLCL
–165 ns
t
LLWL
3, 4 ALE low to RD or WR low 138 238 3t
CLCL
–50 3t
CLCL
+50 ns
t
AVWL
3, 4 Address valid to WR low or RD low 120 4t
CLCL
–130 ns
t
QVWX
3, 4 Data valid to WR transition 3 t
CLCL
–60 ns
t
DW
3, 4 Data setup time before WR 288 7t
CLCL
–150 ns
t
WHQX
3, 4 Data hold after WR 13 t
CLCL
–50 ns
t
RLAZ
3, 4 RD low to address float 0 0 ns
t
WHLH
3, 4 RD or WR high to ALE high 23 103 t
CLCL
–40 t
CLCL
+40 ns
Shift Register
t
XLXL
5 Serial port clock cycle time
3
0.75 12t
CLCL
µs
t
QVXH
5 Output data setup to clock rising edge
3
492 10t
CLCL
–133 ns
t
XHQX
5 Output data hold after clock rising edge
3
80 2t
CLCL
–117 ns
t
XHDX
5 Input data hold after clock rising edge
3
0 0 ns
t
XHDV
5 Clock rising edge to input data valid
3
492 10t
CLCL
–133 ns
External Clock
t
CHCX
6 High time
3
20 20 t
CLCL –
t
CLCX
ns
t
CLCX
6 Low time
3
20 20 t
CLCL –
t
CHCX
ns
t
CLCH
6 Rise time
3
20 20 ns
t
CHCL
6 Fall time
3
20 20 ns
NOTES:
1. Parameters are valid over operating temperature range unless otherwise specified.
2. Load capacitance for port 0, ALE, and PSEN
= 100pF, load capacitance for all other outputs = 80pF.
3. These values are characterized but not 100% production tested.
Phlips Semiconductors Product specification
80C652/83C652CMOS single-chip 8-bit microcontrollers
1996 Aug 15
14
AC ELECTRICAL CHARACTERISTICS
1, 2
(24 MHz type)
24MHz CLOCK VARIABLE CLOCK
SYMBOL FIGURE PARAMETER MIN MAX MIN MAX UNIT
1/t
CLCL
2 Oscillator frequency 1.2 24 MHz
t
LHLL
2 ALE pulse width 43 2t
CLCL
–40 ns
t
AVLL
2 Address valid to ALE low 17 t
CLCL
–25 ns
t
LLAX
2 Address hold after ALE low 17 t
CLCL
–25 ns
t
LLIV
2 ALE low to valid instruction in 102 4t
CLCL
–65 ns
t
LLPL
2 ALE low to PSEN low 17 t
CLCL
–25 ns
t
PLPH
2 PSEN pulse width 80 3t
CLCL
–45 ns
t
PLIV
2 PSEN low to valid instruction in 65 3t
CLCL
–60 ns
t
PXIX
2 Input instruction hold after PSEN 0 0 ns
t
PXIZ
2 Input instruction float after PSEN 17 t
CLCL
–25 ns
t
AVIV
2 Address to valid instruction in 128 5t
CLCL
–80 ns
t
PLAZ
2 PSEN low to address float 10 10 ns
Data Memory
t
RLRH
3, 4 RD pulse width 150 6t
CLCL
–100 ns
t
WLWH
3, 4 WR pulse width 150 6t
CLCL
–100 ns
t
RLDV
3, 4 RD low to valid data in 118 5t
CLCL
–90 ns
t
RHDX
3, 4 Data hold after RD 0 0 ns
t
RHDZ
3, 4 Data float after RD 55 2t
CLCL
–28 ns
t
LLDV
3, 4 ALE low to valid data in 180 8t
CLCL
–150 ns
t
AVDV
3, 4 Address to valid data in 210 9t
CLCL
–165 ns
t
LLWL
3, 4 ALE low to RD or WR low 75 175 3t
CLCL
–50 3t
CLCL
+50 ns
t
AVWL
3, 4 Address valid to WR low or RD low 92 4t
CLCL
–75 ns
t
QVWX
3, 4 Data valid to WR transition 12 t
CLCL
–30 ns
t
DW
3, 4 Data setup time before WR 162 7t
CLCL
–130 ns
t
WHQX
3, 4 Data hold after WR 17 t
CLCL
–25 ns
t
RLAZ
3, 4 RD low to address float 0 0 ns
t
WHLH
3, 4 RD or WR high to ALE high 17 67 t
CLCL
–25 t
CLCL
+25 ns
Shift Register
t
XLXL
5 Serial port clock cycle time
3
0.5 12t
CLCL
µs
t
QVXH
5 Output data setup to clock rising edge
3
283 10t
CLCL
–133 ns
t
XHQX
5 Output data hold after clock rising edge
3
23 2t
CLCL
–60 ns
t
XHDX
5 Input data hold after clock rising edge
3
0 0 ns
t
XHDV
5 Clock rising edge to input data valid
3
283 10t
CLCL
–133 ns
External Clock
t
CHCX
6 High time
3
17 17 t
CLCL –
t
CLCX
ns
t
CLCX
6 Low time
3
17 17 t
CLCL –
t
CHCX
ns
t
CLCH
6 Rise time
3
5 5 ns
t
CHCL
6 Fall time
3
5 5 ns
NOTES:
1. Parameters are valid over operating temperature range unless otherwise specified.
2. Load capacitance for port 0, ALE, and PSEN
= 100pF, load capacitance for all other outputs = 80pF.
3. These values are characterized but not 100% production tested.
Phlips Semiconductors Product specification
80C652/83C652CMOS single-chip 8-bit microcontrollers
1996 Aug 15
15
AC ELECTRICAL CHARACTERISTICS – I2C INTERFACE
SYMBOL PARAMETER INPUT OUTPUT
SCL TIMING CHARACTERISTICS
t
HD;STA
START condition hold time 14 t
CLCL
> 4.0µs
1
t
LOW
SCL LOW time 16 t
CLCL
> 4.7µs
1
t
HIGH
SCL HIGH time 14 t
CLCL
> 4.0µs
1
t
RC
SCL rise time 1µs
2
t
FC
SCL fall time 0.3µs < 0.3µs
3
SDA TIMING CHARACTERISTICS
t
SU;DAT1
Data set-up time 250ns > 20 t
CLCL
– t
RD
t
SU;DAT2
SDA set-up time (before rep. START cond.) 250ns > 1µs
1
t
SU;DAT3
SDA set-up time (before STOP cond.) 250ns > 8 t
CLCL
t
HD;DAT
Data hold time 0ns > 8 t
CLCL
– t
FC
t
SU;STA
Repeated START set-up time 14 t
CLCL
> 4.7µs
1
t
SU;STO
STOP condition set-up time 14 t
CLCL
> 4.0µs
1
t
BUF
Bus free time 14 t
CLCL
> 4.7µs
1
t
RD
SDA rise time 1µs
2
t
FD
SDA fall time 0.3µs < 0.3µs
3
NOTES:
1. At 100 kbit/s. At other bit rates this value is inversely proportional to the bit-rate of 100 kbit/s.
2. Determined by the external bus-line capacitance and the external bus-line pull-resistor, this must be < 1µs.
3. Spikes on the SDA and SCL lines with a duration of less than 3 t
CLCL
will be filtered out. Maximum capacitance on bus-lines SDA and
SCL = 400pF.
4. t
CLCL
= 1/f
OSC
= one oscillator clock period at pin XTAL1. For 63ns (42ns) < t
CLCL
< 285ns (16MHz (24MHz) > f
OSC
> 3.5MHz) the SI01
interface meets the I
2
C-bus specification for bit-rates up to 100 kbit/s.
TIMING SIO1 (I2C) INTERFACE
t
RD
t
SU;STA
t
BUF
t
SU; STO
0.7 V
DD
0.3 V
DD
0.7 V
DD
0.3 V
DD
t
FDtRC
t
FC
t
HIGH
t
LOW
t
HD;STA
t
SU;DAT1
t
HD;DAT
t
SU;DAT2
t
SU;DAT3
START condition
repeated START condition
SDA
(INPUT/OUTPUT)
SCL
(INPUT/OUTPUT)
STOP condition
START or repeated START condition
Phlips Semiconductors Product specification
80C652/83C652CMOS single-chip 8-bit microcontrollers
1996 Aug 15
16
EXPLANATION OF THE AC SYMBOLS
Each timing symbol has five characters. The first character is always ‘t’ (= time). The other characters, depending on their positions, indicate the name of a signal or the logical status of that signal. The designations are: A – Address C – Clock D – Input data H – Logic level high I – Instruction (program memory contents) L – Logic level low, or ALE P – PSEN
Q – Output data R – RD
signal t – Time V – Valid W – WR
signal X – No longer a valid logic level Z – Float Examples: t
AVLL
= Time for address valid
to ALE low.
t
LLPL
= Time for ALE low
to PSEN
low.
t
PXIZ
Figure 2. External Program Memory Read Cycle
ALE
PSEN
PORT 0
PORT 2
A8–A15 A8–A15
A0–A7 A0–A7
t
AVLL
t
PXIX
t
LLAX
INSTR IN
t
PLIV
t
LHLL
t
PLPH
t
LLIV
t
PLAZ
t
LLPL
t
AVIV
ALE
PSEN
PORT 0
PORT 2
Figure 3. External Data Memory Read Cycle
RD
A0–A7
FROM RI OR DPL
DATA IN A0–A7 FROM PCL INSTR IN
P2.0–P2.7 OR A8–A15 FROM DPH A8–A15 FROM PCH
t
WHLH
t
LLDV
t
LLWL
t
RLRH
t
LLAX
t
RLAZ
t
AVLL
t
RHDX
t
RHDZ
t
AVWL
t
AVDV
t
RLDV
Phlips Semiconductors Product specification
80C652/83C652CMOS single-chip 8-bit microcontrollers
1996 Aug 15
17
t
LLAX
ALE
PSEN
PORT 0
PORT 2
Figure 4. External Data Memory Write Cycle
WR
A0–A7
FROM RI OR DPL
DATA OUT A0–A7 FROM PCL INSTR IN
P2.0–P2.7 OR A8–A15 FROM DPH A8–A15 FROM PCH
t
WHLH
t
LLWL
t
WLWH
t
AVLL
t
AVWL
t
QVWX
t
WHQX
t
DW
0 1 2 3 4 5 6 7 8
INSTRUCTION
ALE
CLOCK
OUTPUT DATA
WRITE TO SBUF
INPUT DATA
CLEAR RI
VALID VALID VALID VALID VALID VALID VALID VALID
SET TI
SET RI
t
XLXL
t
QVXH
t
XHQX
t
XHDX
t
XHDV
Figure 5. Shift Register Mode Timing
Phlips Semiconductors Product specification
80C652/83C652CMOS single-chip 8-bit microcontrollers
1996 Aug 15
18
V
IH1
0.8V
t
CHCL
t
CLCL
t
CLCH
t
CLCX
t
CHCX
Figure 6. External Clock Drive at XTAL1
VDD–0.5
0.45V
0.2VDD+0.9
0.2V
DD
–0.1
NOTE:
AC INPUTS DURING TESTING ARE DRIVEN AT V
DD
–0.5 FOR A LOGIC ‘1’ AND
0.45V FOR A LOGIC ‘0’. TIMING MEASUREMENTS ARE MADE AT V
IH
MIN FOR A
LOGIC ‘1’ AND V
IL
MAX FOR A LOGIC ‘0’.
Figure 7. AC Testing Input/Output
V
LOAD
V
LOAD
+0.1V
V
LOAD
–0.1V
V
OH
–0.1V
V
OL
+0.1V
NOTE:
FOR TIMING PURPOSES, A PORT IS NO LONGER FLOATING WHEN A 100MV CHANGE FROM LOAD VOLTAGE OCCURS, AND BEGINS TO FLOAT WHEN A
100mV CHANGE FROM THE LOADED V
OH/VOL
LEVEL OCCURS. IOH/IOL > +
20mA.
Figure 8. Float Waveform
TIMING
REFERENCE
POINTS
Phlips Semiconductors Product specification
80C652/83C652CMOS single-chip 8-bit microcontrollers
1996 Aug 15
19
V
DD
P0
EA
RST
XTAL1
XTAL2
V
SS
V
DD
V
DD
V
DD
I
DD
(NC)
CLOCK SIGNAL
Figure 9. IDD Test Condition, Active Mode
All other pins are disconnected
V
DD
P0
RST
XTAL1
XTAL2
V
SS
V
DD
V
DD
I
DD
(NC)
CLOCK SIGNAL
P1.6 P1.7
P1.6 P1.7
EA
* *
* *
Figure 10. I
DD
Test Condition, Idle Mode
All other pins are disconnected
V
DD
P0
RST
XTAL1
XTAL2
V
SS
V
DD
V
DD
I
DD
(NC)
Figure 11. IDD Test Condition, Power Down Mode
All other pins are disconnected. V
DD
= 2V to 5.5V
P1.6 P1.7
EA
* *
NOTE:
* Ports 1.6 and 1.7 should be connected to V
CC
through resistors of sufficiently high value such that the sink current into these pins does not
exceed the I
OL1
specification.
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I
2
C system provided the system conforms to the
I
2
C specifications defined by Philips. This specification can be ordered using the
code 9398 393 40011.
Phlips Semiconductors Product specification
80C652/83C652CMOS single-chip 8-bit microcontrollers
1996 Aug 15
20
DIP40: plastic dual in-line package; 40 leads (600 mil) SOT129-1
Phlips Semiconductors Product specification
80C652/83C652CMOS single-chip 8-bit microcontrollers
1996 Aug 15
21
PLCC44: plastic leaded chip carrier; 44 leads SOT187-2
Phlips Semiconductors Product specification
80C652/83C652CMOS single-chip 8-bit microcontrollers
1996 Aug 15
22
QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2
Phlips Semiconductors Product specification
80C652/83C652CMOS single-chip 8-bit microcontrollers
1996 Aug 15
23
0590B 40-PIN (600 mils wide) CERAMIC DUAL IN-LINE (F) PACKAGE (WITH WINDOW (FA) PACKAGE)
NOTES:
1. Controlling dimension: Inches. Millimeters are
2. Dimension and tolerancing per ANSI Y14. 5M-1982.
3. “T”, “D”, and “E” are reference datums on the body
4. These dimensions measured with the leads
5. Pin numbers start with Pin #1 and continue
6. Denotes window location for EPROM products.
and include allowance for glass overrun and meniscus
on the seal line, and lid to base mismatch.
constrained to be perpendicular to plane T.
counterclockwise to Pin #40 when viewed
shown in parentheses.
from the top.
– D –
PIN # 1
– E –
0.225 (5.72) MAX.
0.010 (0.254)T E D
0.023 (0.58)
0.015 (0.38)
0.165 (4.19)
0.125 (3.18)
0.070 (1.78)
0.050 (1.27)
– T –
SEATING
PLANE
0.620 (15.75)
0.590 (14.99)
(NOTE 4)
0.598 (15.19)
0.571 (14.50)
BSC
0.600 (15.24)
0.695 (17.65)
0.600 (15.24)
(NOTE 4)
0.015 (0.38)
0.010 (0.25)
0.175 (4.45)
0.145 (3.68)
0.055 (1.40)
0.020 (0.51)
0.100 (2.54) BSC
2.087 (53.01)
2.038 (51.77)
0.098 (2.49)
0.040 (1.02)
0.098 (2.49)
0.040 (1.02)
SEE NOTE 6
853–0590B 06688
Phlips Semiconductors Product specification
80C652/83C652CMOS single-chip 8-bit microcontrollers
1996 Aug 15
24
1472A 44-PIN CERQUAD J-BEND (K) PACKAGE
NOTES:
1. All dimensions and tolerances to conform
2. UV window is optional.
3. Dimensions do not include glass protrusion.
Glass protrusion to be 0.005 inches maximum
4. Controlling dimension millimeters.
5. All dimensions and tolerances include
lead trim offset and lead plating finish.
6. Backside solder relief is optional and
dimensions are for reference only.
1.02 (0.040) X 45°
16.89 (0.665)
16.00 (0.630)
17.65 (0.695)
17.40 (0.685)
CHAMFER
45
16.89 (0.665)
16.00 (0.630)
17.65 (0.695)
17.40 (0.685)
on each side.
to ANSI Y14.5–1982.
2
3
3 X 0.63 (0.025) R MIN.
3.05 (0.120)
2.29 (0.090)
4.83 (0.190)
3.94 (0.155)
SEATING
PLANE
0.38 (0.015)
0.51 (0.02) X 45°
6
6
17.65 (0.656)
17.40 (0.685)
1.27 (0.050)
12.7 (0.500)
8.13 (0.320)
7.37 (0.290)
40X
4.83 (0.190)
3.94 (0.155)
SEATING
PLANE
0.15 (0.006) MIN.
0.25 (0.010) R MIN.
0.508 (0.020) R MIN.
0.25 (0.010)
0.15 (0.006)
90 + 5
–10
° °
°
0.076 (0.003) MIN.
DETAIL B
mm/(inch)
SEE DETAIL B
SEE DETAIL A
DETAIL A
TYP. ALL SIDES
mm/(inch)
1.52 (0.060) REF.
0.482 (0.019 + 0.002)
SEATING
PLANE
1.02 + 0.25 (0.040 + 0.010)
BASE PLANE
45 TYP.
4 PLACES
°
0.73 + 0.08 (0.029 + 0.003)
1.27 (0.050) TYP.
NOMINAL
8.13 (0.320)
7.37 (0.290)
3
853-1472A 05854
Philips Semiconductors Product specification
80C652/83C652CMOS single-chip 8-bit microcontrollers
 
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381
DEFINITIONS
Data Sheet Identification Product Status Definition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product.
Philips Semiconductors and Philips Electronics North America Corporation
register eligible circuits under the Semiconductor Chip Protection Act.
Copyright Philips Electronics North America Corporation 1996
All rights reserved. Printed in U.S.A.
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