Product specification
Supersedes data of 1989 Nov 17
IC15 Data Handbook
1999 Jan 08
Philips SemiconductorsProduct specification
74F1763Intelligent DRAM controller (IDC)
FEA TURES
•DRAM signal timing generator
•Automatic refresh circuitry
•Selectable row address hold and RAS precharge times
•Facilitates page mode accesses
•Controls 1 MBit DRAMs
•Intelligent burst-mode refresh after page-mode access cycles
ability to select the RAS
to fit the particular DRAMs being used. DTACK
from previous family parts to become a negative true, tri-stated
output. The options for latched or unlatched address are contained
on a single device by the addition of an Address Latch Enable (ALE
input. Finally , a burst refresh monitor has been added to ensure
complete refreshing after length page-mode access cycles. With a
maximum clock frequency of 100 MHz, the F1763 is capable of
controlling DRAM arrays with access times down to 40 nsec.
precharge time and Row-Address Hold time
has been modified
)
PRODUCT DESCRIPTION
The Philips Semiconductors Intelligent Dynamic RAM Controller is a
1 MBit, single-port version of the 74F1764 Dual Port Dynamic RAM
Controller. It contains automatic signal timing, address multiplexing
and refresh control required for interfacing with dynamic RAMs.
Additional features have been added to this device to take
advantage of technological advances in Dynamic RAMs. A
Page-Mode access pin allows the user to assert RAS
access cycle rather than the pre-defined four-clock-cycle pulse width
used for normal random access cycles. In addition, the user has the
INPUT AND OUTPUT LOADING FAN-OUT TABLE
PINS
REQDRAM Request Input1.0/1.0
CPClock Input1.0/1.0
PAGEPage Mode Select Input1.0/1.0
PRECHRGRAS Precharge Select Input1.0/1.0
HLDROWRow Hold Select Input1.0/1.0
DTACKData Transfer Ack. Output50/8035 mA/60 mA
GNTAccess Grant Output50/8035 mA/60 mA
RCPRefresh Clock Input1.0/1.0
RA0–9Row Address Inputs1.0/1.0
CA0–9Column Address Inputs1.0/1.0
ALEAddress Latch Enable Input1.0/1.0
RASRow Address Strobe OutputNA35 mA/60 mA
CASColumn Address Strobe OutputNA35 mA/60 mA
MA0–9DRAM Address OutputsNA35 mA/60 mA
NOTES:
One (1.0) FAST Unit Load is defined as 20 A in the HIGH state and 0.6 mA in the LOW state.
FAST Unit Loads do not correspond to DRAM Input Loads. See Functional Description for details.
DESCRIPTION74F (U.L.) HIGH/LOWLOAD VALUE HIGH/LOW
for the entire
NO TAG
TYPE
74F1763100 MHz150 mA
ORDERING INFORMATION
PACKAGES
48-pin Plastic DIPN74F1763NSOT240-1
f
MAX
COMMERCIAL RANGE
TYPICAL SUPPL Y CURRENT
VCC = 5V 10%;
= 0C TO 70C
T
A
(TOTAL)
20 A/0.6 mA
20 A/0.6 mA
20 A/0.6 mA
20 A/0.6 mA
20 A/0.6 mA
20 A/0.6 mA
20 A/0.6 mA
20 A/0.6 mA
20 A/0.6 mA
PKG DWG #
1999 Jan 08853–1406 20619
2
Philips SemiconductorsProduct specification
74F1763Intelligent DRAM controller (IDC)
BLOCK DIAGRAM
RAS
PAGE
CP
PRECHRG
HLDROW
DTACK
RAS, CAS, MUX, DTACK
TIMING
CAS
REQ
GNT
RCP
RA0–9
CA0–9
ALE
DIP PIN CONFIGURATION
GNT
1
HLDROW
PRECHRG
2
3
4
RAS
5
CAS
6
DTACK
7
MA0
8
MA1
9
MA2
10
MA3
11
GND
1237
GND
13
GND
14
GND
15
MA4
16
MA5
17
MA6
1831
MA7
1930
MA8
20
MA9
21
ALE
22
CA9
23
RA9
2425
CA8
BURST REFRESH MONITOR
REFRESH ADDRESS COUNTER
ROW ADDRESS LATCH
COLUMN ADDR. LATCH
REQ
48
47
PAGE
46
CP
45
RCP
44
RA0
43
CA0
42
RA1
CA1
41
40
RA2
39
CA2
38
V
CC
V
CC
36
V
CC
RA3
35
34
CA3
RA4
33
32
CA4
RA5
CA5
29
RA6
28
CA6
27
RA7
26
CA7
RA8
REFRESH
ARBITRATION
MULTIPLEXER
PLCC PIN CONFIGURA TION
DTACK
6
7
MA0
8
MA1
9
MA2
10
MA3
11
GND
12
GND
13
MA4
MA5
14
MA6
15
16
MA7
17
MA8
18 19 20 21 2224 25 26 27 28
MA9
MA0–9
SF01400
CAS
RAS
PRECHRG
HLDROW
5 4 32 144 43 42 41 40
ALE
CA9
RA9
CA8
PAGECPRCP
GNT
REQ
23
RA8
CA7
RA7
CA6
RA6
RA0
CA5
39
CA0
38
RA1
37
CA1
36
RA2
35
CA2
34
V
CC
33
RA3
32
CA3
31
RA4
30
CA4
29
RA5
1999 Jan 08
SF01401
SF01402
3
Philips SemiconductorsProduct specification
SYMBOL
TYPE
NAME AND FUNCTION
74F1763Intelligent DRAM controller (IDC)
PIN DESCRIPTION
PINS
DIP
REQ48Input
GNT1Output
PAGE47Input
HLDROW2Input
PRECHRG3Input
CP46InputClock input. Used by the Controller for all timing and arbitration functions.
RCP45InputRefresh Clock input. Divided internally by 64 to produce an internal Refresh Request.
DTACK6Output
44, 42, 40,
RA0–9
CA0–9
RAS4Output
CAS5Output
MA0–9
ALE21Input
V
CC
GND11–14Ground
35, 33, 31,
29, 27, 25,
23
43, 41, 39,
34, 32, 30,
28, 26, 24,
22
7–10,
15–20
36–38+5V 10% Supply voltage.
InputsRow Address inputs.
Inputs
Output
Active Low Memory Access Request input, must be asserted for the entire DRAM access cycle.
REQ is sampled on the rising edge of the CP clock.
Active High Grant output. When High indicates that a DRAM access (inactive during refresh)
cycle has begun. Asserted from the rising edge of the CP clock.
Active Low Page-Mode Access input. Forces the IDC to keep RAS asserted for as long as the
PAGE input is Low and REQ is asserted Low.
Row Address Hold input. If Low will configure the IDC to maintain the row addresses for a full
CP clock cycle after RAS is asserted. If High will program the IDC to maintain row addresses for
a 1/2 CP clock cycle after RAS
RAS Precharge input. A Low will program the IDC to guarantee a minimum of 4 CP clock cycles
of precharge. A High will guarantee 3 clock cycles of precharge.
Active Low, 3-state Data T ransfer Acknowledge output. Enabled by the REQ input and asserted
four clock cycles after the assertion of RAS, 3-stated when REQ goes High.
Column Address inputs. Propagated to the MA0–9 outputs 1 CP clock cycle after RAS is
asserted, if HLDROW = 0 or 1/2 clock cycle later if HLDROW is 1.
Active Low Row Address Strobe. Asserted for four clock cycles during each refresh cycle
regardless of the PAGE input. Also asserted for four clock cycles during processor access if the
PAGE
input is High. If PAGE is Low, RAS is negated upon negation of PAGE or REQ, whichever
occurs first.
Active Low Column Address Strobe. Always asserted 1.5 CP clock cycles after the assertion of
RAS. Negated upon negation of REQ. HLDROW input pin does not affect RAS to CAS timing.
DRAM multiplexed address outputs. Row and column addresses asserted on these pins during
an access cycle. Refresh counter addresses presented on these outputs during refresh cycles.
Active Low Address Latch Enable input. A Low on this pin will cause the address latches to be
transparent. A High level will latch the RA0–9 and CA0–9 inputs.
is asserted.
1999 Jan 08
4
Philips SemiconductorsProduct specification
74F1763Intelligent DRAM controller (IDC)
FUNCTIONAL DESCRIPTION
The 74F1763 1 Megabit Intelligent DRAM Controller (IDC) is a
synchronous device with most signal timing being a function of the
CP input clock.
Arbitration
Once the DRAM’s RAS precharge time has been satisfied, the REQ
input is sampled on each rising edge of the CP clock and an
internally generated refresh request is sampled on each falling edge
of the same clock. When only one of these requests is sampled as
active the appropriate memory cycle will begin immediately. For a
memory access cycle this will be indicated by GNT and RAS
both being asserted and for a refresh cycle by multiplexing refresh
address to the MA0–9 outputs and subsequent assertion of RAS
after 1/2CP clock cycle. If both memory access and refresh requests
are active at a given time the request sampled first will begin
immediately and the other request (if still asserted) will be serviced
upon completion of the current cycle and it’s associated RAS
precharge time.
outputs
Memory access
The row (RA0–9) and column (CA0–9) address inputs are latched
when ALE
propagate directly to the outputs. When GNT and RAS
after a REQ
already propagated to the MA0–9 outputs for the row address. One
or one-half CP clock cycles later (depending on the state of the
HLDROW input) the column address (CA0–9) inputs are propagated
to the MA0–9 outputs. CAS
clock cycles after RAS
will be negated approximately four CP clock cycles after its initial
assertion. At this time the DTACK
the completion of a memory access cycle. The IDC will maintain the
state of all its outputs until the REQ
waveforms).
input is High. When ALE is Low the input addresses
are asserted,
has been sampled the RA0–9 address inputs will have
is always asserted one and one-half CP
is asserted. If the PAGE input is High, RAS
output becomes valid indicating
input is negated ( see timing
Row address hold times
If the HLDROW input of the IDC is High the row address outputs will
remain valid 1/2 CP clock cycle after RAS
HLDROW input is Low the row address outputs will remain valid one
CP clock cycle after RAS
is asserted.
is asserted. If the
RAS precharge timing
In order to meet the RAS precharge requirement of dynamic RAMs,
the controller will hold-off a subsequent RAS
a processor access request or a refresh cycle for four or three full
CP clock cycles from the previous negation of RAS
the state of the PRECHRG input. If the PRECHRG input is Low,
RAS
remains High for at least 4 CP clock cycles. If the PRECHRG
input is High RAS
remains High for at least 3 CP clock cycles.
signal assertion due to
, depending on
Refresh timing
The refresh address counter wakes-up in an all 1’s state and is an
up counter. The refresh clock (RCP) is internally divided down by 64
to produce an internal refresh request. This refresh request is
recognized either immediately or at the end of a running memory
access cycle. Due to the possibility that page mode access cycles
may be lengthy, the controller keeps track of how many refresh
requests have been missed by logging them internally (up to 128)
and servicing any pending refresh requests at the end of the
memory access cycle. The controller performs RAS
cycles until all pending refresh requests are depleted.
-only refresh
Page-mode access
Fast accesses to consecutive locations of DRAM can be realized by
asserting the PAGE
mode, the controller does not automatically negate RAS
CP clock cycles, but keeps it asserted throughout the access cycle.
By using external gates, the CAS
while changing the column address inputs to the controller, which
will propagate to the MA
column address. This is only useful if the ALE
the user to charge addresses. This mode can be used with DRAMs
that support page or nibble mode addressing.
input as shown in the timing waveforms. In this
after four
output can be gated on and off
–MA9 address outputs and provide a new
0
input is Low, enabling
Output driving characteristics
Considering the transmission line characteristic of the DRAM arrays,
the outputs of the IDC have been designed to provide incident-edge
switching (in Dual-Inline-Packaged memory arrays), needed in high
performance systems. For more information on the driving
characteristics, please refer to Philips Semiconductors application
note AN218. The driving characteristics of the 74F1763 are the
same as those of the 74F765 shown in the application note.
1999 Jan 08
5
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