Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged.
All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety
precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of
the user. It must never be thrown out with the general or domestic waste.
1998 Feb 162
Philips SemiconductorsProduct specification
NPN microwave power transistorsLBE2003S; LBE2009S
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
CBO
V
CER
V
CEO
V
EBO
I
C
P
tot
T
stg
T
j
T
sld
collector-base voltageopen emitter40V
collector-emitter voltage
LBE2003SR
LBE2009SR
= 220 Ω−35V
BE
= 100 Ω−35V
BE
collector-emitter voltageopen base−16V
emitter-base voltageopen collector−3V
collector current (DC)
LBE2003S−90mA
LBE2009S−250mA
total power dissipationTmb≤ 75 °C
LBE2003S−1.4W
LBE2009S−3.5W
storage temperature−65+150°C
operating junction temperature−200°C
soldering temperatureat 0.3 mm from case; t = 10 s −235°C
2
10
handbook, halfpage
I
C
(mA)
(2)
(1)
10
1
10
1520
Tmb≤ 75°C.
(1) Region of permissible DC operation.
(2) Permissible extension provided RBE≤ 220 Ω.
(3) Second breakdown limit (independent of temperature).
(3)
4060100
30
Fig.2 DC SOAR; LBE2003S.
MGD996
VCE (V)
handbook, halfpage
2
P
tot
(W)
1.5
1
0.5
0
−500200
50100150
MGD989
Tmb (oC)
Fig.3Power dissipation derating as a function of
mounting-base temperature; LBE2003S.
1998 Feb 163
Philips SemiconductorsProduct specification
NPN microwave power transistorsLBE2003S; LBE2009S
3
10
handbook, halfpage
I
C
(mA)
2
10
(1)
10
1
102040
Tmb≤ 75 °C.
(1) Region of permissible DC operation.
(2) Permissible extension provided RBE≤ 100 Ω.
(3) Second breakdown limit (independant of temperature).
(3)
(2)
VCE (V)
Fig.4DC SOAR; LBE2009S.
MGD990
handbook, halfpage
2
10
4
P
tot
(W)
3
2
1
0
−500
50100150
MGD991
Tmb (
200
o
C)
Fig.5Power dissipation derating as a function of
mounting-base temperature; LBE2009S.
THERMAL CHARACTERISTICS
SYMBOLPARAMETERCONDITIONSMAX.UNIT
R
th j-mb
thermal resistance from junction to mounting-baseTj=75°C
LBE2003S65K/W
LBE2009S36K/W
R
th mb-h
thermal resistance from mounting-base to heatsinkTj=75°C1.5K/W