Copyright 2011 Philips Consumer Electronics B.V. Eindhoven, The Netherlands
All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or
transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise
without the prior permission of Philips.
Published by RY-HF1123 AVM Service Audio Printed in The Netherlands Subject to modification
Dolby Pro-logic Test Disc ....................................4822 395 10216
HANDLING CHIP COMPONENTS
1 - 5
GB
A
WARNING
1 - 6
ESD
WAARSCHUWING
NL
ll ICs and many other semi-conductors are
susceptible to electrostatic discharges (ESD).
Careless handling during repair can reduce life
drastically.
When repairing, make sure that you are
connected with the same potential as the mass
of the set via a wrist wrap with resistance.
Keep components and tools also at this
potential.
F
ATTENTION
Tous les IC et beaucoup d’autres
semi-conducteurs sont sensibles aux
décharges statiques (ESD).
Leur longévité pourrait être considérablement
écourtée par le fait qu’aucune précaution n’est
prise à leur manipulation.
Lors de réparations, s’assurer de bien être relié
au même potentiel que la masse de l’appareil et
enfiler le bracelet serti d’une résistance de
sécurité.
Veiller à ce que les composants ainsi que les
outils que l’on utilise soient également à ce
potentiel.
Alle ICs und viele andere Halbleiter sind
empfindlich gegenüber elektrostatischen
Entladungen (ESD).
Unsorgfältige Behandlung im Reparaturfall kan
die Lebensdauer drastisch reduzieren.
Veranlassen Sie, dass Sie im Reparaturfall über
ein Pulsarmband mit Widerstand verbunden
sind mit dem gleichen Potential wie die Masse
des Gerätes.
Bauteile und Hilfsmittel auch auf dieses gleiche
Potential halten.
ESD PROTECTION EQUIPMENT
Alle IC’s en vele andere halfgeleiders zijn
gevoelig voor electrostatische ontladingen
(ESD).
Onzorgvuldig behandelen tijdens reparatie kan
de levensduur drastisch doen verminderen.
Zorg ervoor dat u tijdens reparatie via een
polsband met weerstand verbonden bent met
hetzelfde potentiaal als de massa van het
apparaat.
Houd componenten en hulpmiddelen ook op
ditzelfde potentiaal.
I
AVVERTIMENTO
Tutti IC e parecchi semi-conduttori sono
sensibili alle scariche statiche (ESD).
La loro longevità potrebbe essere fortemente
ridatta in caso di non osservazione della più
grande cauzione alla loro manipolazione.
Durante le riparazioni occorre quindi essere
collegato allo stesso potenziale che quello della
massa dell’apparecchio tramite un braccialetto
a resistenza.
Assicurarsi che i componenti e anche gli utensili
con quali si lavora siano anche a questo
potenziale.
GB
Safety regulations require that the set be restored to its original
condition and that parts which are identical with those specified,
be used.
Safety components are marked by the symbol
!
.
CLASS 1
LASER PRODUCT
NL
Veiligheidsbepalingen vereisen, dat het apparaat bij reparatie in
zijn oorspronkelijke toestand wordt teruggebracht en dat onderdelen,
identiek aan de gespecificeerde, worden toegepast.
De Veiligheidsonderdelen zijn aangeduid met het symbol
!
.
3122 110 03420
F
Les normes de sécurité exigent que l’appareil soit remis à l’état
d’origine et que soient utiliséés les piéces de rechange identiques
à celles spécifiées.
Less composants de sécurité sont marqués
!
.
D
Bei jeder Reparatur sind die geltenden Sicherheitsvorschriften zu
beachten. Der Original zustand des Geräts darf nicht verändert werden;
für Reparaturen sind Original-Ersatzteile zu verwenden.
Sicherheitsbauteile sind durch das Symbol
!
markiert.
I
Le norme di sicurezza esigono che l’apparecchio venga rimesso
nelle condizioni originali e che siano utilizzati i pezzi di ricambio
identici a quelli specificati.
Componenty di sicurezza sono marcati con
!
.
GB
After servicing and before returning set to customer perform a leakage
current measurement test from all exposed metal parts to earth ground
to assure no shock hazard exist, The leakage current must not
exceed 0.5mA.
GB
Warning !
Invisible laser radiation when open.
Avoid direct exposure to beam.
S
Varning !
Osynlig laserstrålning när apparaten är öppnad och spärren
är urkopplad. Betrakta ej strålen.
Varoitus !
SF
Avatussa laitteessa ja suojalukituksen ohitettaessa olet alttiina
näkymättömälle laserisäteilylle. Älä katso säteeseen!
DK Advarse !
Usynlig laserstråling ved åbning når sikkerhedsafbrydere er
ude af funktion. Undgå udsaettelse for stråling.
F
"Pour votre sécurité, ces documents doivent être utilisés par
des spécialistes agréés, seuls habilités à réparer votre
appareil en panne".
Pb(Lead) Free Solder
When soldering , be sure to use the pb free solder.
INDENTIFICATION:
Regardless of special logo (not always indicated)
onemusttreatall sets from1 Jan 2005 onwards,according
next rules:
Important note: In fact also products of year 2004 must
be treated in this way as long as you avoid mixing solderalloys (leaded/ lead-free). So best to always use SAC305
and the higher temperatures belong to this.
Due to lead-free technology some rules have to be
respected by the workshop during a repair:
• Use only lead-free solder alloy Philips SAC305 with
order code 0622 149 00106. If lead-free solder-paste
is required, please contact the manufacturer of your
solder-equipment. In general use of solder-paste
within workshops should be avoided because paste is
not easy to store and to handle.
• Use only adequate solder tools applicable for lead-
free solder alloy. The solder tool must be able
– To reach at least a solder-temperature of 400@C,
– To stabilize the adjusted temperature at the solder-
tip
– To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature around
360@C – 380@C is reached and stabilized at the solder
joint. Heating-time of the solder-joint should not exceed
~ 4 sec. Avoid temperatures above 400@C otherwise
wear-out of tips will rise drastically and flux-fluid will
be destroyed. To avoid wear-out of tips switch off unused equipment, or reduce heat.
• Mix of lead-free solder alloy / parts with leaded solder
alloy / parts is possible but PHILIPS recommends
strongly to avoid mixed solder alloy types (leaded and
lead-free).
If one cannot avoid or does not know whether product
is lead-free, clean carefully the solder-joint from old
solder alloy and re-solder with new solder alloy
(SAC305).
• Use only original spare-parts listed in the Service-
Manuals. Not listed standard-material (commodities)
has to be purchased at external companies.
• Special information for BGA-ICs:
– Always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for desoldering always use the lead-free temperature profile,
in case of doubt)
– Lead free BGA-ICs will be delivered in so-called ‘dry-
packaging’ (sealed pack including a silica gel pack) to
protect the IC against moisture. After opening,
1 - 7
dependent of MSL-level seen on indicator-label in the
bag, the BGA-IC possibly still has to be baked dry.
(MSL=Moisture Sensitivity Level). This will be
communicated via AYS-website.
Do not re-use BGAs at all.
•For sets produced before 1.1.2005 (except products
of 2004), containing leaded solder-alloy and
components, all needed spare-parts will be available
till the end of the service-period. For repair of such
sets nothing changes.
• On our website www.atyourservice.ce.Philips.com
you find more information to:
• BGA-de-/soldering (+ baking instructions)
• Heating-profiles of BGAs and other ICs used in
Philips-sets
You will find this and more technical information
within the “magazine”, chapter “workshop news”.
For additional questions please contact your local
repair-helpdesk.
REPAIR INSTRUCTIONS
2 - 12 - 1
All functions
are not working
Check all cables of
system are loose or bad
insert
Standby led of panel
whether is light
Check IC101 of main board
and their conjoint parts
Re-insert and fix
the cable
check output of
BK5V on the top
of power board
All functions
are not working
All functions
have no sound
check pin1~pin5 of
CN501(on the top of main
pcb) whether are +26.5V
R5001 whether is+12V
check pin1of C609 (on
the top of main pcb)
whether is +3.3V
check IC502, IC503 of
MAIN PCB and their
conjoint parts whether
are OK
All functions
have no sound
Aux In has
no sound
Check switch power and
the conjoint parts
check IC501 of main pcb
and their conjoint parts
whether are ok
MP3 In has
no sound
coaxial /optical
input has no sound
check pin3 and pin13 of
IC301(on the top of main
pcb) output whether are ok
check 3 and pin4 of
IC303(on the top of main
pcb)output whether are 5V
and 3.3V
check IC303 of main pcb
and their conjoint parts
whether are OK
IPOD In have
no sound
Aux In has
no sound
HDMI Repeater In/out
has no Video or sound
check pin7and pin16 of IC301
(on the top of main pcb) output
whether is +/-5V and their
conjoint parts whether are OK
check IC303 and FB102
of main pcb whether are
OK
MP3 In has
no sound
check MP3 music output is ok
check mp3 jack connect is ok
check mp3 jack cable and
CN301 connect of mian pcb
is ok
check pin2 and pin15 of IC301
on the top of main pcb whether
have music input
check IC301 of main pcb is OK
Keep CN301 of main board has
Music input
check from CN301 to IC301
conjoint parts
coaxial /optical
input has no sound
check C330 is ok
check R332 is 3.3V,
check C331 is ok
check pin3 /9/ 22 of IC302
(on the top of main pcb) output
whether are all 3.3V
check IC302 of main pcb
and their conjoint parts
check their conjoint parts of
JK304and JK303
check their conjoints part of L302
L303
IPOD In have
no sound
Check Ipod Dock output
signal is ok Check Ipod
jack connect is ok
Check Pin1/7of IC304
(on the topof main pcb )
have music output.
Check IC301 of main
pcb is OK
Please keep having music
input signal, Check JK305
is OK
check JK305 to IC304
and their conjoint parts
whether are ok
HDMI Repeater In/out
has no Video or sound
Check Pin2 of IC603 is1.8V
Pin2 of IC604 IS 3.3V of
Repeater pcb
Check IC601 of Repeater pcb
and conjoint part FB106 FB604
FB605 FB608 FB609 whether
is 1.8V FB607 whether is 3.3V
Check Pin1/3 of CN601
Repeater PCB is BK5V/+5V
and their conjoint part whether is OK
Check IC601 of Repeater pcb
whether is OK
3 - 13 - 1
DISASSEMBLY INSTRUCTIONS
Dismantling of the Rear Cover
1) Loosen 13 screws “A” to move the Rear Cover as shown in gure 1.
A
Figure 1
Dismantling of the SPK Board
1) Loosen 2 screws “B” to remove the SPK Board as shown in gure 2.
Dismantling of the HDMI Repeat Board
1) Loosen 4 screws “D” to remove the HDMI Repeat Board as shown in gure 4.
D
Figure 4
Dismantling of the Main Board
1) Loosen 3 screws “E” at the bracket as shown in gure 5.
2) Loosen 7 screws “F” on the top of Main Board as shown in gure 6.
Figure 2
Dismantling of the Power Board
1) Loosen 4 screws “C” to remove the Power Board as shown in gure 3.
c
B
E
Figure 5
F
Figure 3
Figure 6
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