Philips HTS-7111 Service Manual

Service
Service
3139 785 357903139 785 357903139 785 35790
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Soundbar Home Theater System
HTS7111
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Tfswjdf Tfswjdf
Service
Service Manual
TABLE OF CONTENTS
Location Of PCB Boards............................................ 1-2
Versions Variation ...................................................... 1-2
Specifications ............................................................ 1-3
Measurement Setup .................................................. 1-4
Service Aids .............................................................. 1-5
ESD & Safety Instruction .......................................... 1-6
Lead-free Soldering Information ................................ 1-7
Repair Instructions ........................................................ 2
Disassembly Instructions & Service Positions .............. 3
Quick Start Guide .......................................................... 4
Block & Wiring Diagram ................................................ 5
Main+HDMI+VFD+MP3+SPK Board ............................ 6
Touch Key Board .......................................................... 7
Power Board .................................................................. 8
Mechanical Exploded View............................................ 9
Revision List ................................................................ 10
Chapter
©
Copyright 2011 Philips Consumer Electronics B.V. Eindhoven, The Netherlands
All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips.
Version 1.0
3139 785 35790
GB
LOCATION OF PCB BOARDS
MP3 PCB
1 - 2
REPEAT PCB
TOUCH PCB
VERSION VARIATION:
Type/Versions
Features
Output Power - 300W
Voltage (
110-240V)
MAIN PCB
SPK PCB
VFD PCB
POWER PCB
HTS7111
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x
x
Music iLink
REPAIR SCENARIO MATRIX:
Type/Versions
Board in used
MAIN+HDMI+VFD+MP3+SPK Board
Touch Board
Power Board
*Bd = Board Level Replacement *C = Component Level Repair
x
HTS7111
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C
C
C
SPECIFICATIONS
Amplifier
Total output power:
Europe and Asia .....................................300W RMS (30%
Latin America ..............................................224W RMS (10% THD)
Frequency response ...................................... 20 Hz-20 kHz / ±3 dB
Signal-to-noise ratio ......................... > 65 dB (CCIR) /(A-weighted)
Input sensitivity:
AUX .................................................................................... 250 mV
Music iLink .............................................................................50 mV
Audio
S/PDIF Digital audio input:
Coaxial ................................................................... IEC 60958-3
Optical ....................................................................... TOSLINK
Main Unit
Power supply ................................................ 110-240 V~, 50-60 Hz
Power consumption ................................................................. 55 W
Standby power consumption ................................................. ≤ 1 W
Center speaker:
Speaker impedance ............................................................... 6 ohm
Speaker drivers ..................................... 2 x 64 mm (2.5”) full range
Frequency response: ...............................................150 Hz-20 kHz
Front/Rear speakers:
Speaker impedance ............................................................... 3 ohm
Speaker drivers ..................................... 4 x 64 mm (2.5”) full range
Frequency response .................................................150 Hz-20 kHz
Dimensions (WxHxD): ......................................945 x 108 x 86 mm
Weight ..................................................................................3.82 kg
THD)
1 - 3
Subwoofer
Output power ............................................... 80W RMS (30% THD)
Impedance ............................................................................. 6 ohm
Speaker drivers .............................................165 mm (6.5”) woofer
Frequency response ................................................. 20 Hz-150 Hz
Dimensions (WxHxD) .......................................192 x 447 x 253mm
Weight ....................................................................................4.4 kg
Cable length .............................................................................. 3 m
Wall Mount
Dimensions (WxHxD) .......................................80 x 80 x 15mm
Weight .................................................................. 0.08 kg/each
Remote control batteries
2 x AAA-R03-1.5 V
Speci cations subject to change without prior notice.
MEASUREMENT SETUP
Tuner FM
1 - 4
Bandpass
LF Voltmeter
e.g. PM2534
RF Generator
e.g. PM5326
DUT
250Hz-15kHz
e.g. 7122 707 48001
Ri=50
S/N and distortion meter
e.g. Sound Technology ST1700B
Use a bandpass filter to eliminate hum (50Hz, 100Hz) and disturbance from the pilottone (19kHz, 38kHz).
CD
Use Audio Signal Disc (replaces test disc 3)
DUT
SBC429 4822 397 30184
L
R
S/N and distortion meter
e.g. Sound Technology ST1700B
LEVEL METER
e.g. Sennheiser UPM550
with FF-filter
SERVICE AIDS
Service Tools:
Universal Torx driver holder .................................4822 395 91019
Torx bit T10 150mm ...........................................4822 395 50456
Torx driver set T6-T20 .........................................4822 395 50145
Torx driver T10 extended .....................................4822 395 50423
Compact Disc:
SBC426/426A Test disc 5 + 5A ...........................4822 397 30096
SBC442 Audio Burn-in test disc 1kHz .................4822 397 30155
SBC429 Audio Signals disc .................................4822 397 30184
Dolby Pro-logic Test Disc ....................................4822 395 10216
HANDLING CHIP COMPONENTS
1 - 5
GB
A
WARNING
1 - 6
ESD
WAARSCHUWING
NL
ll ICs and many other semi-conductors are susceptible to electrostatic discharges (ESD). Careless handling during repair can reduce life drastically. When repairing, make sure that you are connected with the same potential as the mass of the set via a wrist wrap with resistance. Keep components and tools also at this potential.
F
ATTENTION
Tous les IC et beaucoup d’autres semi-conducteurs sont sensibles aux décharges statiques (ESD). Leur longévité pourrait être considérablement écourtée par le fait qu’aucune précaution n’est prise à leur manipulation. Lors de réparations, s’assurer de bien être relié au même potentiel que la masse de l’appareil et enfiler le bracelet serti d’une résistance de sécurité. Veiller à ce que les composants ainsi que les outils que l’on utilise soient également à ce potentiel.
GB
Complete Kit ESD3 (small tablemat, wristband,
connection box, estention cable and earth cable ....... 4822 310 10671
Wristband tester ................................................................. 4822 344 13999
D
WARNUNG
Alle ICs und viele andere Halbleiter sind empfindlich gegenüber elektrostatischen Entladungen (ESD). Unsorgfältige Behandlung im Reparaturfall kan die Lebensdauer drastisch reduzieren. Veranlassen Sie, dass Sie im Reparaturfall über ein Pulsarmband mit Widerstand verbunden sind mit dem gleichen Potential wie die Masse des Gerätes. Bauteile und Hilfsmittel auch auf dieses gleiche Potential halten.
ESD PROTECTION EQUIPMENT
Alle IC’s en vele andere halfgeleiders zijn gevoelig voor electrostatische ontladingen (ESD). Onzorgvuldig behandelen tijdens reparatie kan de levensduur drastisch doen verminderen. Zorg ervoor dat u tijdens reparatie via een polsband met weerstand verbonden bent met hetzelfde potentiaal als de massa van het apparaat. Houd componenten en hulpmiddelen ook op ditzelfde potentiaal.
I
AVVERTIMENTO
Tutti IC e parecchi semi-conduttori sono sensibili alle scariche statiche (ESD). La loro longevità potrebbe essere fortemente ridatta in caso di non osservazione della più grande cauzione alla loro manipolazione. Durante le riparazioni occorre quindi essere collegato allo stesso potenziale che quello della massa dell’apparecchio tramite un braccialetto a resistenza. Assicurarsi che i componenti e anche gli utensili con quali si lavora siano anche a questo potenziale.
GB
Safety regulations require that the set be restored to its original condition and that parts which are identical with those specified, be used.
Safety components are marked by the symbol
!
.
CLASS 1
LASER PRODUCT
NL
Veiligheidsbepalingen vereisen, dat het apparaat bij reparatie in zijn oorspronkelijke toestand wordt teruggebracht en dat onderdelen, identiek aan de gespecificeerde, worden toegepast.
De Veiligheidsonderdelen zijn aangeduid met het symbol
!
.
3122 110 03420
F
Les normes de sécurité exigent que l’appareil soit remis à l’état d’origine et que soient utiliséés les piéces de rechange identiques à celles spécifiées.
Less composants de sécurité sont marqués
!
.
D
Bei jeder Reparatur sind die geltenden Sicherheitsvorschriften zu beachten. Der Original zustand des Geräts darf nicht verändert werden; für Reparaturen sind Original-Ersatzteile zu verwenden.
Sicherheitsbauteile sind durch das Symbol
!
markiert.
I
Le norme di sicurezza esigono che l’apparecchio venga rimesso nelle condizioni originali e che siano utilizzati i pezzi di ricambio identici a quelli specificati.
Componenty di sicurezza sono marcati con
!
.
GB
After servicing and before returning set to customer perform a leakage current measurement test from all exposed metal parts to earth ground to assure no shock hazard exist, The leakage current must not exceed 0.5mA.
GB
Warning !
Invisible laser radiation when open. Avoid direct exposure to beam.
S
Varning !
Osynlig laserstrålning när apparaten är öppnad och spärren är urkopplad. Betrakta ej strålen.
Varoitus !
SF
Avatussa laitteessa ja suojalukituksen ohitettaessa olet alttiina näkymättömälle laserisäteilylle. Älä katso säteeseen!
DK Advarse !
Usynlig laserstråling ved åbning når sikkerhedsafbrydere er ude af funktion. Undgå udsaettelse for stråling.
F
"Pour votre sécurité, ces documents doivent être utilisés par des spécialistes agréés, seuls habilités à réparer votre appareil en panne".
Pb(Lead) Free Solder
When soldering , be sure to use the pb free solder.
INDENTIFICATION:
Regardless of special logo (not always indicated)
onemusttreatall sets from1 Jan 2005 onwards,according next rules:
Important note: In fact also products of year 2004 must be treated in this way as long as you avoid mixing solder­alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this.
Due to lead-free technology some rules have to be respected by the workshop during a repair:
Use only lead-free solder alloy Philips SAC305 with
order code 0622 149 00106. If lead-free solder-paste is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not easy to store and to handle.
Use only adequate solder tools applicable for lead-
free solder alloy. The solder tool must be able – To reach at least a solder-temperature of 400@C, – To stabilize the adjusted temperature at the solder-
tip
– To exchange solder-tips for different applications.
Adjust your solder tool so that a temperature around
360@C – 380@C is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed ~ 4 sec. Avoid temperatures above 400@C otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips switch off un­used equipment, or reduce heat.
Mix of lead-free solder alloy / parts with leaded solder
alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid or does not know whether product is lead-free, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305).
Use only original spare-parts listed in the Service-
Manuals. Not listed standard-material (commodities) has to be purchased at external companies.
Special information for BGA-ICs:Always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for de­soldering always use the lead-free temperature profile, in case of doubt)
Lead free BGA-ICs will be delivered in so-called ‘dry-
packaging’ (sealed pack including a silica gel pack) to protect the IC against moisture. After opening,
1 - 7
dependent of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYS-website. Do not re-use BGAs at all.
For sets produced before 1.1.2005 (except products
of 2004), containing leaded solder-alloy and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes.
On our website www.atyourservice.ce.Philips.com
you find more information to:
• BGA-de-/soldering (+ baking instructions)
• Heating-profiles of BGAs and other ICs used in Philips-sets
You will find this and more technical information within the “magazine”, chapter “workshop news”.
For additional questions please contact your local repair-helpdesk.
REPAIR INSTRUCTIONS
2 - 12 - 1
All functions are not working
Check all cables of system are loose or bad
insert
Standby led of panel whether is light
Check IC101 of main board and their conjoint parts
Re-insert and fix the cable
check output of BK5V on the top of power board
All functions are not working
All functions have no sound
check pin1~pin5 of CN501(on the top of main pcb) whether are +26.5V R5001 whether is+12V
check pin1of C609 (on the top of main pcb) whether is +3.3V
check IC502, IC503 of MAIN PCB and their conjoint parts whether are OK
All functions have no sound
Aux In has no sound
Check switch power and the conjoint parts
check IC501 of main pcb and their conjoint parts whether are ok
MP3 In has no sound
coaxial /optical input has no sound
check pin3 and pin13 of IC301(on the top of main pcb) output whether are ok
check 3 and pin4 of IC303(on the top of main pcb)output whether are 5V and 3.3V
check IC303 of main pcb and their conjoint parts whether are OK
IPOD In have no sound
Aux In has no sound
HDMI Repeater In/out has no Video or sound
check pin7and pin16 of IC301 (on the top of main pcb) output whether is +/-5V and their conjoint parts whether are OK
check IC303 and FB102 of main pcb whether are OK
MP3 In has no sound
check MP3 music output is ok check mp3 jack connect is ok check mp3 jack cable and CN301 connect of mian pcb is ok
check pin2 and pin15 of IC301 on the top of main pcb whether have music input
check IC301 of main pcb is OK
Keep CN301 of main board has
Music input
check from CN301 to IC301 conjoint parts
coaxial /optical input has no sound
check C330 is ok check R332 is 3.3V, check C331 is ok
check pin3 /9/ 22 of IC302 (on the top of main pcb) output whether are all 3.3V
check IC302 of main pcb and their conjoint parts
check their conjoint parts of JK304and JK303
check their conjoints part of L302 L303
IPOD In have no sound
Check Ipod Dock output signal is ok Check Ipod jack connect is ok
Check Pin1/7of IC304 (on the topof main pcb ) have music output.
Check IC301 of main pcb is OK
Please keep having music input signal, Check JK305 is OK
check JK305 to IC304 and their conjoint parts whether are ok
HDMI Repeater In/out has no Video or sound
Check Pin2 of IC603 is1.8V Pin2 of IC604 IS 3.3V of Repeater pcb
Check IC601 of Repeater pcb and conjoint part FB106 FB604 FB605 FB608 FB609 whether is 1.8V FB607 whether is 3.3V
Check Pin1/3 of CN601 Repeater PCB is BK5V/+5V and their conjoint part whether is OK
Check IC601 of Repeater pcb whether is OK
3 - 1 3 - 1
DISASSEMBLY INSTRUCTIONS
Dismantling of the Rear Cover
1) Loosen 13 screws “A” to move the Rear Cover as shown in  gure 1.
A
Figure 1
Dismantling of the SPK Board
1) Loosen 2 screws “B” to remove the SPK Board as shown in  gure 2.
Dismantling of the HDMI Repeat Board
1) Loosen 4 screws “D” to remove the HDMI Repeat Board as shown in  gure 4.
D
Figure 4
Dismantling of the Main Board
1) Loosen 3 screws “E” at the bracket as shown in  gure 5.
2) Loosen 7 screws “F” on the top of Main Board as shown in  gure 6.
Figure 2
Dismantling of the Power Board
1) Loosen 4 screws “C” to remove the Power Board as shown in  gure 3.
c
B
E
Figure 5
F
Figure 3
Figure 6
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