Copyright 2005 Philips Consumer Electronics B.V. Eindhoven, The Netherlands.
All rights reserved. No part of this publication may be reproduced, stored in
a retrieval system or transmitted, in any form or by any means, electronic,
mechanical, photocopying, or otherwise without the prior permission of Philips.
Contents PageContents Page
AV Board - Bottom view layout 24
AV Board - Circuit Diagram (Part 1) 25
AV Board - Circuit Diagram (Part 2) 26
AV Board - Circuit Diagram (Part 3) 27
AV Board - Circuit Diagram (Part 4) 28
AV Board - Circuit Diagram (Part 5) 29
AV Board - Circuit Diagram (Part 6) 30
8 Powerbox Spk Assy SW5500C 31 Power Supply Unit - Top view layout 31 Power Supply Unit - Circuit Diagram (Part 1) 32
Power Supply Unit - Circuit Diagram (Part 2) 33
Interface - Top view layout 34
Interface - Circuit Diagram (Part 1) 35
Main Amplifer - Top view layout 36
Main Amplifer - Bottom view layout 37
Connector schematic 38
FR+SURROUND amplifi er schematic 39Subwoofer Amplifer - Top view layout 40
Subwoofer Amplifer - Bottom view layout 41
Subwoofer amplifi er schematic 42Transformer - Top silk layout 43
Exploded View - Box Spk Assy SW5500C 44
Exploded View - Module 45
Wiring Diagram SW5500C 46
9 Module SD6.3 CH HT 47
SD6.3 CH HT Board - Top View Layout 47
SD6.3 CH HT Board - Bottom View Layout 48
SD6.3 CH HT Board - Circuit Diagram (Part1) 49
SD6.3 CH HT Board - Circuit Diagram (Part2) 50
10 Set Mechanical Exploded View 51
11 Partlist 53
Published by KC-TE 0519 AV Systems Printed in the Netherlands Subject to modifi cation EN 3139 785 31200
Version 1.0
Page 2
EN 2
HTS5500C/37/551.
Technical Specifi
cations and Connection Facilities
1. Technical Specifi cations and Connection Facilities
LOCATION OF PC BOARDS
HTS5500 Architecture
PSU
Board
5-DISC
CHANGER
MECHANISM
AV-BOARD-2
TUNER TM08
AV-BOARD -1
SD 6.3
FRONT BOARD
3 PIECES
VERSION VARIATIONS:
Features &
Board in used:
Progressive ScanXX
Control Line To Power BoxXX
Audio OutputXX
Audio InputXX
Power Box (Easy Fit)XX
Video OutputXX
S-Video OutputXX
Y/Pb/Pr (YUV) Component Video OutputXX
Type / Versions:
3755
HTS5500C
Page 3
Technical Specifi
cations and Connection Facilities
Technical Specifi cations
HTS5500C/37/55
1.
EN 3
General:
Mains voltage : 120V ± 15%
240V ± 15%
Mains frequency : 50/60Hz
Power consumption : <= 0.5W at standby
(Center Unit)
<= 0.5W at standby
(Subwoofer)
<= 25W at 1/8 P
rated
(Center Unit)
Dimension (w x h x d) : 360 x 40 x 305mm
Tuner
FM
Tuning range : 87.5-108MHz
Grid : 50kHz /01
100kHz /97
IF frequency : 10.7MHz ± 25kHz
Aerial input : 75Ω coaxial
Sensitivity at 26dB S/N : < 7μV
Selectivity at 600kHz bandwidth : > 25dB
IF rejection : > 60dB
Image rejection : > 25dB
Distortion at RF=1mV, dev. 75kHz : < 3%
-3dB Limiting point : 8μV
Crosstalk at RF=1mV, dev. 67.5kHz : > 28dB
Crosstalk at RF=1mV, dev. 40kHz : > 18dB /97
MW
Input sensitivity
Aux In : 1V at 39kΩ Scart In : 500mV at 39kΩ
Output sensitivity
Line Out (Left/Right) : 0.7V ± 2dB at 47kΩ Scart Out (Left/Right) : 0.6V ± 2dB at 10kΩ
COMPACT DISC/VCD/DVD:
Video Decoding : MPEG-1/MPEG-2/
MPEG-4/DivX 3.11,
4.x & 5.x
Video DAC : 12 Bits, 108MHz
Signal System : PAL / NTSC
Video Format : 4:3 / 16:9
Video S/N : 56dB (minimum)
S-Video Out
Y level : 1.0 ± 0.1V
Y S/N : >= 60dB
C level (burst) : 286mV
RGB/YUV Out
Amplitude : 0.7 ± 0.1V
S/N : >= 60dB
1)
1)
1)
p-p
p-p
+1/-4dB
p-p
p-p
Tuning range : 531-1602kHz
530-1700kHz for /97
Grid : 9kHz
10kHz /97
IF frequency : 450kHz ± 1kHz
Aerial input : Frame aerial
Sensitivity at 26dB S/N : < 4.0mV/m
Selectivity at 18kHz bandwidth : > 20dB
IF rejection : > 45dB
Image rejection : > 28dB
Distortion at RF=50mV, m=80% : < 5%
AMPLIFIER:
Output power : 900W RMS
Front : 150W RMS / channel
Rear : 150W RMS / channel
Centre : 150W RMS
Subwoofer : 150W RMS
Frequency response : 20Hz-50kHz / -3dB
Signal-to-noise ratio : > 65dB (CCIR)
1)
Output terminals to be terminated with 75Ω
2)
@ THD = 10%, 1kHz Sinewave except Subwoofer
@ 100Hz Sinewave
Page 4
EN 4
1.
HTS5500C/37/55
MEASUREMENT SETUP
Tuner FM
Technical Specifi
cations and Connection Facilities
Bandpass
LF Voltmeter
e.g. PM2534
RF Generator
e.g. PM5326
DUT
250Hz-15kHz
e.g. 7122 707 48001
Ri=50Ω
S/N and distortion meter
e.g. Sound Technology ST1700B
Use a bandpass filter to eliminate hum (50Hz, 100Hz) and disturbance from the pilottone (19kHz, 38kHz).
Tuner AM (MW,LW)
RF Generator
e.g. PM5326
Ri=50Ω
DUT
Frame aerial
e.g. 7122 707 89001
Bandpass
250Hz-15kHz
e.g. 7122 707 48001
LF Voltmeter
e.g. PM2534
S/N and distortion meter
e.g. Sound Technology ST1700B
To avoid atmospheric interference all AM-measurements have to be carried out in a Faraday´s cage.
Use a bandpass filter (or at least a high pass filter with 250Hz) to eliminate hum (50Hz, 100Hz).
CD
Use Audio Signal Disc
(replaces test disc 3)
DUT
L
R
SBC429 4822 397 30184
S/N and distortion meter
e.g. Sound Technology ST1700B
LEVEL METER
e.g. Sennheiser UPM550
with FF-filter
Recorder
Use Universal Test Cassette CrO2 SBC419 4822 397 30069
Dolby Pro-logic Test Disc ...................................... 4822 395 10216
HTS5500C/37/55
1.
EN 5
HANDLING CHIP COMPONENTS
Page 6
EN 6
HTS5500C/37/551.
Technical Specifi cations and Connection Facilities
GB
All ICs and many other semi-conductors are
susceptible to electrostatic discharges (ESD).
Careless handling during repair can reduce life
drastically.
When repairing, make sure that you are
connected with the same potential as the mass
of the set via a wrist wrap with resistance.
Keep components and tools also at this
potential.
Tous les IC et beaucoup d’autres
semi-conducteurs sont sensibles aux
décharges statiques (ESD).
Leur longévité pourrait être considérablement
écourtée par le fait qu’aucune précaution n’est
prise à leur manipulation.
Lors de réparations, s’assurer de bien être relié
au même potentiel que la masse de l’appareil et
enfiler le bracelet serti d’une résistance de
sécurité.
Veiller à ce que les composants ainsi que les
outils que l’on utilise soient également à ce
potentiel.
Alle ICs und viele andere Halbleiter sind
empfindlich gegenüber elektrostatischen
Entladungen (ESD).
Unsorgfältige Behandlung im Reparaturfall kan
die Lebensdauer drastisch reduzieren.
Veranlassen Sie, dass Sie im Reparaturfall über
ein Pulsarmband mit Widerstand verbunden
sind mit dem gleichen Potential wie die Masse
des Gerätes.
Bauteile und Hilfsmittel auch auf dieses gleiche
Potential halten.
ESD PROTECTION EQUIPMENT:
NL
Alle IC’s en vele andere halfgeleiders zijn
gevoelig voor electrostatische ontladingen (ESD).
Onzorgvuldig behandelen tijdens reparatie kan
de levensduur drastisch doen verminderen.
Zorg ervoor dat u tijdens reparatie via een
polsband met weerstand verbonden bent met
hetzelfde potentiaal als de massa van het
apparaat.
Houd componenten en hulpmiddelen ook op
ditzelfde potentiaal.
Tutti IC e parecchi semi-conduttori sono
sensibili alle scariche statiche (ESD).
La loro longevità potrebbe essere fortemente
ridatta in caso di non osservazione della più
grande cauzione alla loro manipolazione.
Durante le riparazioni occorre quindi essere
collegato allo stesso potenziale che quello della
massa dell’apparecchio tramite un braccialetto
a resistenza.
Assicurarsi che i componenti e anche gli utensili
con quali si lavora siano anche a questo
potenziale.
WAARSCHUWING
I
AVVERTIMENTO
GB
Safety regulations require that the set be restored to its original
condition and that parts which are identical with those specified,
be used
Safety components are marked by the symbol
!
.
NL
Veiligheidsbepalingen vereisen, dat het apparaat bij reparatie in
zijn oorspronkelijke toestand wordt teruggebracht en dat onderdelen,
identiek aan de gespecificeerde, worden toegepast.
De Veiligheidsonderdelen zijn aangeduid met het symbool
!
F
Les normes de sécurité exigent que l’appareil soit remis à l’état
d’origine et que soient utiliséés les piéces de rechange identiques
à celles spécifiées.
Less composants de sécurité sont marqués
!
D
Bei jeder Reparatur sind die geltenden Sicherheitsvorschriften zu
beachten. Der Original zustand des Geräts darf nicht verändert werden;
für Reparaturen sind Original-Ersatzteile zu verwenden.
Sicherheitsbauteile sind durch das Symbol
!
markiert.
I
Le norme di sicurezza esigono che l’apparecchio venga rimesso
nelle condizioni originali e che siano utilizzati i pezzi di ricambio
identici a quelli specificati.
Componenty di sicurezza sono marcati con
!
CLASS 1
LASER PRODUCT
GB
Invisible laser radiation when open.
Avoid direct exposure to beam.
Osynlig laserstrålning när apparaten är öppnad och spärren
är urkopplad. Betrakta ej strålen.
SF
Avatussa laitteessa ja suojalukituksen ohitettaessa olet alttiina
näkymättömälle laserisäteilylle. Älä katso säteeseen!
DK
Usynlig laserstråling ved åbning når sikkerhedsafbrydere er
ude af funktion. Undgå udsaettelse for stråling.
S
Warning !
Varning !
Varoitus !
Advarse !
GB
After servicing and before returning set to customer perform a leakage
current measurement test from all exposed metal parts to earth ground to
assure no shock hazard exist. The leakage current must not exceed
0.5mA.
F
"Pour votre sécurité, ces documents doivent être utilisés par
des spécialistes agréés, seuls habilités à réparer votre
appareil en panne".
Page 7
Technical Specifi
cations and Connection Facilities
Lead Free Requirements
HTS5500C/37/55
1.
EN 7
Pb(Lead) Free Solder
When soldering , be sure to use the pb free solder.
INDENTIFICATION:
Regardless of special logo (not always indicated)
one must treat all sets from 1 Jan 2005 onwards, according next
rules:
Important note: In fact also products of year 2004 must be treated in
this way as long as you avoid mixing solder-alloys (leaded/ lead-free).
So best to always use SAC305 and the higher temperatures belong
to this.
Due to lead-free technology some rules have to be respected by the
workshop during a repair:
• Use only lead-free solder alloy Philips SAC305 with order
code 0622 149 00106. If lead-free solder-paste is required,
please contact the manufacturer of your solder-equipment.
In general use of solder-paste within workshops should be
avoided because paste is not easy to store and to handle.
• Use only adequate solder tools applicable for lead-free solder
alloy. The solder tool must be able
o To reach at least a solder-temperature of 400°C,
o To stabilize the adjusted temperature at the solder-tip
o To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature around 360°C
– 380°C is reached and stabilized at the solder joint. Heatingtime of the solder-joint should not exceed ~ 4 sec. Avoid
temperatures above 400°C otherwise wear-out of tips will rise
drastically and fl ux-fl uid will be destroyed. To avoid wear-out
of tips switch off un-used equipment, or reduce heat.
• Mix of lead-free solder alloy / parts with leaded solder alloy /
parts is possible but PHILIPS recommends strongly to avoid
mixed solder alloy types (leaded and lead-free).
If one cannot avoid or does not know whether product is leadfree, clean carefully the solder-joint from old solder alloy and
re-solder with new solder alloy (SAC305).
• Use only original spare-parts listed in the Service-Manuals.
Not listed standard-material (commodities) has to be
purchased at external companies.
• Special information for BGA-ICs:
- always use the 12nc-recognizable soldering temperature
profi le of the specifi c BGA (for de-soldering always use the
lead-free temperature profi le, in case of doubt)
- lead free BGA-ICs will be delivered in so-called ‘drypackaging’ (sealed pack including a silica gel pack) to protect
the IC against moisture. After opening, dependent of MSLlevel seen on indicator-label in the bag, the BGA-IC possibly
still has to be baked dry. (MSL=Moisture Sensitivity Level).
This will be communicated via AYS-website.
Do not re-use BGAs at all.
• For sets produced before 1.1.2005 (except products of 2004),
containing leaded solder-alloy and components, all needed
spare-parts will be available till the end of the service-period.
For repair of such sets nothing changes.
• On our website www.atyourservice.ce.Philips.com you fi nd
more information to:
BGA-de-/soldering (+ baking instructions)
Heating-profi les of BGAs and other ICs used in
Philips-sets
You will fi nd this and more technical information within the
“magazine”, chapter “workshop news”.
For additional questions please contact your local repair-helpdesk.
Page 8
EN 8
HTS5500C/37/552.
2. Dismantling Instructions
Dismantling Instructions & Service Positions
2.1 Dismantling of the SD5.5_5dis changer
1) The tray can be manually open by inserting a minus
screw drive and push the lever in the direction as shown
in Figure 1 to unlock the tray before sliding it out.
2) Slide out the tray and remove the Cover Tray (pos 110) as
shown in Figure 2.
Push lever in direction
shown to open the
tray manually
Figure 1
3) Loosen 7 screws to remove the Front Top.(pos 240)
- 2 screw each on the left & right side (pos 272)
- 3 screws A behind
2.2 Dismantling of the Tuner Module, AV Board,
SD6.3 ,Front Board, PSU Module
1) Loosen 2 screw B (see Figure 3a) to remove the Tuner
Module (pos 1040).
2) Loosen 4 screws C (see Figure 3b) to remove
AV Board 1.
3) Loosen 4 screws D (see Figure 3c) and 2 screws H (see
Figure 4a) to remove AV Board 2.
4) Loosen 2 screws E (see Figure 4a) to remove the PSU
Module.
5) Loosen 6 screws I (see Figure 4a) and 4 snap hooks to
remove Front Board.
- 1 snap hook each on the left & right side (pos 161).
- 2 snap hooks on the bottom side (pos 161).
B
A
Figure 3a
4) Loosen 6 screws G (see Figure 4a and 4b) to remove the
SD5.5_5dis changer.
Figure 2
C
Figure 3b
D
Figure 3c
Page 9
Catch
EN 9
Dismantling Instructions & Service Positions
HTS5500C/37/55
2.
H
E
F
2.3 Service Positions
Insert Thick
Insulation Sheet
in between the AV
Board 1 and 2.
G
I
Figure 4a
AV Board 2
Figure 5
AV Board 1
AV Board 1
G
Figure 4b
Thick Insulation Sheet
Thick Insulation Sheet
PSU
Figure 6
Thick Insulation Sheet
Front Board
Figure 7
Thick Insulation Sheet
SD6.3
Figure 8
AV Board 2
Page 10
EN 10
3.
HTS5500C/37/55
3. Diagnostic Software
Service test program
To start service test program
hold open/close and
buttons depressed while
plugging in the mains cord
Hold open/close and buttons depressed till the Display shown “S-Vxx-yy”
Diagnostic Software
Display shows
“SERVICE”
followed by ROM version
“S-Vxx-yy”
Main Menu
Display Test
Key
“Display Test”
triggered?
Activate and display
“Pattern1”
“ ”
triggered?
n
“Display Test”
triggered?
Key
Key
S refers to Service Mode
V refers to Version
xx refers to Software version number of BEA
(counting up from 01 to 99)
yy refers to Software version number of Front uP
(counting up from 01 to 99)
Display Test
n
y
y
n
y
Following display patterns are used to test the display and its
connections to μP.
Pattern 1:
All display control pins are ON
All LEDs are ON.
- to check for open-circuits
Pattern 2:
Alternate display control pins are ON (Test Pattern: 0x55)
The following LEDs are ON:
DiscAvailable1
DiscAvailable3
DiscAvailable5
DiscActive2
DiscActive4
- to check for short-circuits
Activate and display
“Pattern2”
Key
“ ”
triggered?
y
(tbd)
n
TESTActivated withACTION
EEPROM FORMAT
TEST
ROTARY
ENCODER TEST
LEAVE SERVICE
TEST PROGRAM
DISC 1 Load default data. Display shows “NEW”.
Volume
Knob
Disconnect
mains cord
Caution!
All presets from the customer will be
lost!!
Display shows value for 2 seconds.
Volume values increases or decreases in
steps of 1 until 0 (VOL MIN) or 40 (VOL
MAX) is reached.
Page 11
Diagnostic Software
HTS5500C/37/55
3.
EN 11
Reprogramming of DVD version Matrix
After repair, the customer setting and region code may be lost.
Reprogramming will put the set back in the state in which it has left
the factory, ie. with the default setting and the allowed region code.
HTS5x00 Software Version Matrix
Model
HTS5500
1
C/37
HTS5500
2
C/55
To reprogram do as follows:
1) Power up the set and select DISC source.
2) Open tray by press “OPEN/CLOSE” button on the set or press
and hold “STOP” button on the RC.
3) Press the following buttons on the Remote Control:
<9> <9> <9> <9> <AUDIO> <1> ......... for HTS5500C/37
<9> <9> <9> <9> <AUDIO> <2> ......... for HTS5500C/55
4) The display shows ‘YYYY-ZZ’ and the tray will close. YYYY = model number (eg. 8300, 8500, etc.)
ZZ = slash stroke version (eg. 01, 69, etc.)
Key
Sequence
Open
Tray 9999
Audio 1
Open
Tray 9999
Audio 2
Region
LATAM4PALyes
Region
Code
US1NTSCyes
TV
Type
PSCAN
Procedure for check Software version
1) Power up the set and select DISC source.
2) Open tray by press “OPEN/CLOSE” button on the set or press
and hold “STOP” button on the RC.
3) Press “DISPLAY” button on the Remote control.
4) The TV screen will shows:
SD6.3 Vxx YYYY-ZZ A BB
SERVO: nnnnnnnn REG:A
xx = version number
YYYY = model number (eg. 8300, 8500, etc.)
ZZ = slash stroke version (eg. 01, 69, etc.)
A = region code
BB = Front uP software version number
nnnnnnnn = servo version number
Trade Mode
Trade mode is a feature that will block all set keys when enabled.
It is for dealers to prevent customers from removing disc, changing
source etc using the set keys. Rotary and Remote Control (RC) keys
are still allowed inTrade mode.
To activate Trade Mode:
1) Power up the set and select DISC source.
2) Open tray by press “OPEN/CLOSE” button on the set
or press and hold “STOP” button on the RC.
3) Then press buttons <2> <5> <9> on the RC.
4) The display shows ‘TRA ON’ and the tray will close. Trade Mode is now enabled.
To deactivate Trade Mode:
1) Power up the set and select DISC source.
2) Open tray by press and hold “STOP” button on the RC.
3) Then press buttons <2> <5> <9> on the RC.
4) The display shows ‘TRA OFF’ and the tray will close.Trade Mode is now disabled.
Procedure to change Tuner Grid (not for all
versions)
In North and South America, the frequency step between adjacent
channels in the MW band is 10kHz (9kHz in some areas). The preset
frequency step in the factory is 9kHz.
IMPORTANT!
Changing the tuning grid will erase all previously stored preset
radio stations.
1) Press TUNER on the remote (or press SOURCE control on front
panel) to select “FM” or “MW”.
2) Press STANDY ON to switch the DVD system to standby mode.
3) While holding down SOURCE and PREV on the front panel,
disconnect and connect the power cord to the power supply
again.
-> The display will show “GRID 9” or “GRID 10”.
Helpful hints:
- GRID 9 and GRID 10 indicate that the tuning grid is in step of
9kHz and 10kHz respectively.
- The FM tuning grid also will be changed from 50kHz to 100kHz
or vice versa.
Procedure to upgrade software
1) Power up the set and select DISC source.
2) Open tray by press “OPEN/CLOSE” button on the set or press
and hold “STOP” button on the RC.
3) Place Upgrade CD-ROM with fi lename “HTS5500.bin” onto tray
and close.
4) The set will response and display the following:
- LOAD (After the disc is read, the tray will open for you to remove the disc)
- ERASE (Erasing disc)
- WRITE (Writing disc)
- ERROR (if upgrade is unsuccessful)
- UPG END (if upgrade is successful)
- DISC->CLOSE->LOAD (Tray will close indicating that the upgrade process is completed)
5) The whole process should not take more than 5 minutes.
Caution: Do not unplug the set until upgrade is completed.
Page 12
EN 12
Notes:
HTS5500C/37/553.
Diagnostic Software
Page 13
EN 13
HTS5500C/37/55
1
11
1
1
1
RDS_CLK
GND_D
PCM_Data_LR
GND_D
GND_D
GND_D
GND_D
PCM_Data_SLR
PCM_Data_Sub_Cen
GND_ND
1
1
GND_D
PCM_Data_LR
GND_D
RDS_CLK
RDS_DAT
SCL-DAC
SDA-DAC
GND_D
GND_D
GND_D
PCM_Data_SLR
PCM_Data_Sub_Cen
GND_ND
1
1
1
DNG
+1V8_Sense
GND_D
GND_D
+1V8
SCL-DAC
SDA-DAC
KLCSMCP
OL_ATADMCP
DNG
KLCMCP
KLCRLMCP
DNG
ted_ciM
DNG
tuo_FIDPS
DNG
05P
1
DNG
KLCSMCP
OL_ATADMCP
DNG
KLCMCP
KLCRLMCP
DNG
ted_ciM
DNG
tuo_FIDPS
DNG
05P
3eniL / 1TRACS
3eniL / 0TRACS
1
1
Y
C
V_DNG
SBVC
U_B
DNG
ETUM_VA
ni_ciM_ATAD_MCPFIDPS
V_DNG
1
1
+1V8_Sense
GND_D
GND_D
+1V8
2 eniL / CN
V_DNG
V_DNG
Y_G
V
_
D
N
G
V
_
R
V_DNG
1
1
1
1
1
V_DNG
1
1
1
RDS_DAT
3eniL / 1TRACS
3eniL / 0TRACS
2 eniL / CN
V_DNG
V_DNG
Y_G
V_DNG
V_R
V_DNG
Y
C
V_DNG
SBVC
U_B
DNG
ETUM_VA
ni_ciM_ATAD_MCPFIDPS
Block Diagram_HTS5500C_HYwk512
4. Set Block diagram
Set Block Diagram
4.
Page 14
EN 14
HTS5500C/37/55
5.
HEADPHONE
GND
OUT
VS
(SAA6581)
RDS
(TM 08)
TUNER
74HC4052
Wiring Diagram_3139 249 27191_HYwk511
5. Set wiring diagram
Set Wiring Diagram
Page 15
EN 15
HTS5500C/37/55
6. Panel Front Boards
Front Display - Component Layout
1102 3139 248 84301 PCBAS FRONT PANEL HTS5500/37
1103 3139 118 58661 PCBAS AV PANEL HTS5500
1106 3139 117 11111 MODULESMPS 04-20
1107 2422 542 00022 TUN A F ENG06703QF USA B
1109 3139 248 71992 MOD SD5.5
1109 3141 079 32991 MOD SD5.5 PACKAGING
1102 3139 118 58641 PCBAS FRONT KEY HTS5500
1200 3139 118 58671 PCBAS AV HTS5500
ELECTRICAL PARTS LIST - PCBAS FRONT IO HTS5500
MISCELLANEOUS
1200 2422 025 17501 CON BM H 15P F 1.00 FFC SMT R
1202 4822 276 13775 SWITCH
1203 4822 276 13775 SWITCH
1204 4822 276 13775 SWITCH
1205 4822 276 13775 SWITCH
1206 4822 276 13775 SWITCH
1208 4822 276 13775 SWITCH
5200 3198 018 31590 FXDIND SM 0805 15U PM20 COL R
Page 54
EN 54
11.
HTS5500C/37/55
Spare Parts List
DIODES
6200 4822 130 11416 PDZ6.8B
6201 4822 130 11416 PDZ6.8B
6202 9322 184 08676 LED VS LTL-816YE (LITO) A
6203 9322 184 08676 LED VS LTL-816YE (LITO) A
6204 9322 184 08676 LED VS LTL-816YE (LITO) A
6205 9322 184 08676 LED VS LTL-816YE (LITO) A
6206 9322 184 08676 LED VS LTL-816YE (LITO) A
6207 9322 183 96676 LED VS LTL-816GE (LITO) A
6208 9322 183 96676 LED VS LTL-816GE (LITO) A
6209 9322 183 96676 LED VS LTL-816GE (LITO) A
6210 9322 183 96676 LED VS LTL-816GE (LITO) A
6211 9322 183 96676 LED VS LTL-816GE (LITO) A
6212 9322 179 76676 LED VS LTL-816EELC (LITO) A
ELECTRICAL P ARTS LIST - PCBAS FRONT DISP HTS5500/37
MISCELLANEOUS
1301 2422 025 17201 CON H 9P F 1.00 SM FFC 0.3 R
1302 2422 025 17033 CON H 8P F 1.00 SM FFC 0.3 R
1303 2422 025 17501 CON BM H 15P F 1.00 FFC SMT R
5300 3198 018 52280 FXDIND SM 0603 2U2 PM10 COL R
ELECTRICAL PARTS LIST- PCBAS VIDEO CONN HTS5500
MISCELLANEOUS
1400 2422 025 17154 CON BM V 20P F 1.00 FFC 0.3 B
1401 2422 026 05419 SOC CINCH H 1P F 1L1 BK B
1402 2422 033 00468 SOC COMBI H 2P F CINCH/MDIN Y
1403 2422 026 05589 SOC CINCH H 3P F 1L3 RDBUGN Y
ELECTRICAL PARTS LIST - PCBAS AV PANEL HTS5500
MISCELLANEOUS
1100 2422 025 17154 CON BM V 20P F 1.00 FFC 0.3 B
1101 2422 025 18364 CON V 16P F 1.00 FFC 0.3 Y
1102 2422 025 17509 CON BM V 30P F 1.00 FFC 0.3 B
1201 2422 025 17509 CON BM V 30P F 1.00 FFC 0.3 B
1300 2422 025 18766 SOC SUBD H 15P F BU 1216 Y
1402 2422 086 11092
1403 2422 086 11103 FUSE SM F 2A 125V UL R
1404 2422 025 09405 CON BM V 2P M 2.00 PH B
1405 2422 086 11103 FUSE SM F 2A 125V UL R
1503 4822 267 11039 11P. FEM.
1504 4822 267 31449 SOC CINCH H 6P F
1601 2422 025 16806 CON BM H 7P F 1.00 FFC SMT R
FUSE SM F 500MA 50V UL R
DIODES
6301 4822 130 10837 UDZS8.2B
6302 3198 020 55680 DIO REG SM BZX384-C5V6 COL R
6304 4822 130 11397 BAS316
6305 4822 130 11397 BAS316
6306 4822 130 11397 BAS316
6307 4822 130 11397 BAS316
Page 55
Spare Parts List
HTS5500C/37/55
11.
EN 55
RESISTORS
3272 2422 549 43062 IND FXD SM EMI 100MHZ 600R R
3493 4822 117 11151
3494 4822 117 11151
5206 2422 549 43062 IND FXD SM EMI 100MHZ 600R R
5207 2422 549 43062 IND FXD SM EMI 100MHZ 600R R
5208 2422 549 43062 IND FXD SM EMI 100MHZ 600R R
5209 2422 549 43062 IND FXD SM EMI 100MHZ 600R R
5210 2422 549 43062 IND FXD SM EMI 100MHZ 600R R
5211 2422 549 43062 IND FXD SM EMI 100MHZ 600R R
5401 4822 157 11717 BLM31P500SPT
5402 4822 157 11499 BLM11P600SPT
5403 4822 157 11717 BLM31P500SPT
5404 2422 535 94092 IND FXD SM 0805 33U PM10 R
5405 2422 535 94092 IND FXD SM 0805 33U PM10 R
ELECTRICAL PARTS LIST - PCBAS SD6.3 CH HT
MISCELLANEOUS
1101 2422 025 17529 CON BM H 24P F 0.50 FFC 0.3 R
1104 2422 025 16388 CON BM V 16P F 1.00 FFC 0.3 R
1105 2422 025 17768 CON V 9P F 1.00 SM FFC 0.3 R
1151 4822 157 11717 BLM31P500SPT
1152 4822 157 11717 BLM31P500SPT
1153 4822 157 11717 BLM31P500SPT
1301 2422 025 17451 CON BM H 30P F 1.00 FFC 0.3 R
1302 2422 025 17451 CON BM H 30P F 1.00 FFC 0.3 R
1305 2422 025 16968 CON BM H 8P F 1.00 FFC 0.3 R
RESISTORS
3301 2350 035 10229 RST NETW SM ARV24 4X22R PM5 R
3302 2350 035 10229 RST NETW SM ARV24 4X22R PM5 R
3303 2350 035 10229 RST NETW SM ARV24 4X22R PM5 R
3304 2350 035 10229 RST NETW SM ARV24 4X22R PM5 R
3305 2350 035 10229 RST NETW SM ARV24 4X22R PM5 R
3346 4822 157 11499 BLM11P600SPT
3365 2422 549 43062 IND FXD SM EMI 100MHZ 600R R
3367 2422 549 43062 IND FXD SM EMI 100MHZ 600R R
5131 3198 018 41880 FXDIND SM 1210 1U8 PM5 COL R
5132 3198 018 41880 FXDIND SM 1210 1U8 PM5 COL R
5133 3198 018 41880 FXDIND SM 1210 1U8 PM5 COL R
5134 3198 018 41880 FXDIND SM 1210 1U8 PM5 COL R
5135 3198 018 41880 FXDIND SM 1210 1U8 PM5 COL R
5136 3198 018 41880 FXDIND SM 1210 1U8 PM5 COL R
5300 4822 157 11499 BLM11P600SPT
5301 4822 157 11499 BLM11P600SPT
5302 4822 157 11499 BLM11P600SPT
5303 4822 157 11499 BLM11P600SPT
5305 4822 157 11499 BLM11P600SPT
5308 4822 157 11499 BLM11P600SPT
5342 4822 157 11499 BLM11P600SPT
5343 4822 157 11499 BLM11P600SPT
5344 4822 157 11499 BLM11P600SPT
5345 4822 157 11499 BLM11P600SPT
TRANSISTORS & INTREGATED CIRCUITS
7101 4822 209 17398 LD1117DT33
7102 9322 165 15685 IC SM NCP303LSN30 (ONSE) R
7106 4822 130 11565 2SB1132
7107 4822 130 11565 2SB1132
7108 9322 212 30685 FET POW SM TN0200T (VISH) R
7108
9340 547 13215 FET SIG SM BSH103 (PHSE) R
(ALT)
7109 9322 212 30685 FET POW SM TN0200T (VISH) R
7109 9340 547 13215 FET SIG SM BSH103 (PHSE) R
(ALT)
7110 9340 219 30115 BC817-25W
7111 9322 201 94668 IC SM MM1646XH (MITM) R
7112 9322 219 32671 IC SM MT1389EE/B-L (MEDI) Y
7121 9340 425 20115 TRA SIG SM BC847BS (PHSE) R
7131 9965 000 04199 BSN20
7132 9965 000 04199 BSN20
7301 9322 189 04668 IC SM M24C16-RDW6 (ST00) R
7302 9322 166 67668 IC SM MT48LC4M16A2TG-7E(MRN0)R
7302 9322 209 02668 IC SM IS42S16400B-7T (ISSI) R
ALT1
7302 9322 209 03668 IC SM IS42S16400B-7TL (ISSI) R
ALT2
7302 9322 166 67668 IC SM MT48LC4M16A2TG-7E(MRN0)R
ALT3
7304 9322 185 10668 IC SM CS8415A-CZ (CILO) R
7306 9352 687 20125 IC SM 74LVC1G125GW (PHSE) R
7309 3139 240 51231 FLASH EMBEDDED SW (HTS5500)
7310 4822 209 17345 M62320FP
ELECTRICAL PARTS LIST - SET WIRING FOR HTS5500
MISCELLANEOUS