Philips HTS-5500-C Service Manual

DVD Player
HTS5500C/37/55
CLASS 1
LASER PRODUCT
1 Technical Specifi cations and Connection Facilities 2 Location of PC Boards 2 Technical Specifi cations 3 Measurement Setup 4 Service Aids 5 Lead Free Requirements 7 2 Dismantling instructions & Service Positions 8 Dismantling instructions 8 3 Diagnostic Software 10 Service test program 10 4 Set Block diagram 13 5 Set wiring diagram 14 6 Panel Front Boards 15 Front Display - Component Layout 15 Front Display - Chip Layout 15 Front Display - Circuit Diagram 16 Key & Open/close Board - Component Layout 17 Key & Open/close Board - Chip Layout 17 Key & Open/close Board - Circuit Diagram 18 Front key board - Component Layout 19 Front key board - Chip Layout 19 Front key board - Circuit Diagram 20 Video Connector Board - Circuit Diagram 21 Video Connector Board - Component Layout 22 Video Connector Board - Chip Layout 22 7 AV Board 23 AV Board - Top view layout 23
©
Copyright 2005 Philips Consumer Electronics B.V. Eindhoven, The Netherlands. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips.
Contents PageContents Page
Published by KC-TE 0519 AV Systems Printed in the Netherlands Subject to modifi cation EN 3139 785 31200
Version 1.0
EN 2
HTS5500C/37/551.
Technical Speci
cations and Connection Facilities
1. Technical Specifi cations and Connection Facilities
LOCATION OF PC BOARDS
HTS5500 ­Architecture
PSU Board
5-DISC CHANGER MECHANISM
AV-BOARD-2
TUNER ­TM08
AV-BOARD -1
SD 6.3
FRONT BOARD 3 PIECES
VERSION VARIATIONS:
Features & Board in used: Progressive Scan X X
Control Line To Power Box X X Audio Output X X Audio Input X X Power Box (Easy Fit) X X Video Output X X S-Video Output X X Y/Pb/Pr (YUV) Component Video Output X X
Type / Versions:
37 55
HTS5500C
Technical Speci
cations and Connection Facilities
Technical Specifi cations
HTS5500C/37/55
1.
EN 3
General:
Mains voltage : 120V ± 15%
240V ± 15% Mains frequency : 50/60Hz Power consumption : <= 0.5W at standby
(Center Unit) <= 0.5W at standby
(Subwoofer) <= 25W at 1/8 P
rated
(Center Unit) Dimension (w x h x d) : 360 x 40 x 305mm
Tuner FM
Tuning range : 87.5-108MHz Grid : 50kHz /01 100kHz /97 IF frequency : 10.7MHz ± 25kHz Aerial input : 75Ω coaxial Sensitivity at 26dB S/N : < 7μV Selectivity at 600kHz bandwidth : > 25dB IF rejection : > 60dB Image rejection : > 25dB Distortion at RF=1mV, dev. 75kHz : < 3%
-3dB Limiting point : 8μV Crosstalk at RF=1mV, dev. 67.5kHz : > 28dB Crosstalk at RF=1mV, dev. 40kHz : > 18dB /97
MW
Input sensitivity Aux In : 1V at 39kΩ Scart In : 500mV at 39kΩ Output sensitivity Line Out (Left/Right) : 0.7V ± 2dB at 47kΩ Scart Out (Left/Right) : 0.6V ± 2dB at 10kΩ
COMPACT DISC/VCD/DVD:
Video Decoding : MPEG-1/MPEG-2/
MPEG-4/DivX 3.11,
4.x & 5.x Video DAC : 12 Bits, 108MHz Signal System : PAL / NTSC Video Format : 4:3 / 16:9 Video S/N : 56dB (minimum)
CVBS Out CVBS level : 1.0 ± 0.1V Luminance S/N : >= 55dB
S-Video Out Y level : 1.0 ± 0.1V Y S/N : >= 60dB C level (burst) : 286mV
RGB/YUV Out Amplitude : 0.7 ± 0.1V S/N : >= 60dB
1)
1)
1)
p-p
p-p
+1/-4dB
p-p
p-p
Tuning range : 531-1602kHz 530-1700kHz for /97 Grid : 9kHz 10kHz /97 IF frequency : 450kHz ± 1kHz Aerial input : Frame aerial Sensitivity at 26dB S/N : < 4.0mV/m Selectivity at 18kHz bandwidth : > 20dB IF rejection : > 45dB Image rejection : > 28dB Distortion at RF=50mV, m=80% : < 5%
AMPLIFIER:
Output power : 900W RMS Front : 150W RMS / channel Rear : 150W RMS / channel Centre : 150W RMS Subwoofer : 150W RMS
Frequency response : 20Hz-50kHz / -3dB Signal-to-noise ratio : > 65dB (CCIR)
1)
Output terminals to be terminated with 75Ω
2)
@ THD = 10%, 1kHz Sinewave except Subwoofer
@ 100Hz Sinewave
EN 4
1.
HTS5500C/37/55
MEASUREMENT SETUP
Tuner FM
Technical Speci
cations and Connection Facilities
Bandpass
LF Voltmeter
e.g. PM2534
RF Generator
e.g. PM5326
DUT
250Hz-15kHz
e.g. 7122 707 48001
Ri=50Ω
S/N and distortion meter
e.g. Sound Technology ST1700B
Use a bandpass filter to eliminate hum (50Hz, 100Hz) and disturbance from the pilottone (19kHz, 38kHz).
Tuner AM (MW,LW)
RF Generator
e.g. PM5326
Ri=50Ω
DUT
Frame aerial
e.g. 7122 707 89001
Bandpass
250Hz-15kHz
e.g. 7122 707 48001
LF Voltmeter
e.g. PM2534
S/N and distortion meter
e.g. Sound Technology ST1700B
To avoid atmospheric interference all AM-measurements have to be carried out in a Faraday´s cage. Use a bandpass filter (or at least a high pass filter with 250Hz) to eliminate hum (50Hz, 100Hz).
CD
Use Audio Signal Disc (replaces test disc 3)
DUT
L
R
SBC429 4822 397 30184
S/N and distortion meter
e.g. Sound Technology ST1700B
LEVEL METER
e.g. Sennheiser UPM550
with FF-filter
Recorder
Use Universal Test Cassette CrO2 SBC419 4822 397 30069
or Universal Test Cassette
LF Generator
e.g. PM5110
Fe SBC420 4822 397 30071
DUT
L
R
S/N and distortion meter
e.g. Sound Technology ST1700B
LEVEL METER
e.g. Sennheiser UPM550
with FF-filter
Technical Speci
cations and Connection Facilities
SERVICE AIDS
Service Tools:
Universal Torx driver holder .................................. 4822 395 91019
Torx bit T10 150mm ............................................. 4822 395 50456
Torx driver set T6 - T20 ......................................... 4822 395 50145
Torx driver T10 extended ...................................... 4822 395 50423
Compact Disc:
SBC426/426A Test disc 5 + 5A ............................ 4822 397 30096
SBC442 Audio Burn-in Test disc 1kHz ................. 4822 397 30155
SBC429 Audio Signals disc .................................. 4822 397 30184
Dolby Pro-logic Test Disc ...................................... 4822 395 10216
HTS5500C/37/55
1.
EN 5
HANDLING CHIP COMPONENTS
EN 6
HTS5500C/37/551.
Technical Specifi cations and Connection Facilities
GB
All ICs and many other semi-conductors are susceptible to electrostatic discharges (ESD). Careless handling during repair can reduce life drastically. When repairing, make sure that you are connected with the same potential as the mass of the set via a wrist wrap with resistance. Keep components and tools also at this potential.
Tous les IC et beaucoup d’autres semi-conducteurs sont sensibles aux décharges statiques (ESD). Leur longévité pourrait être considérablement écourtée par le fait qu’aucune précaution n’est prise à leur manipulation. Lors de réparations, s’assurer de bien être relié au même potentiel que la masse de l’appareil et enfiler le bracelet serti d’une résistance de sécurité. Veiller à ce que les composants ainsi que les outils que l’on utilise soient également à ce potentiel.
F
WARNING
ATTENTION
GB
Complete Kit ESD3 (small tablemat, wristband,
connection box, extention cable and earth cable) ...........482 2 3 1 0 1 0 6 7 1
Wristband tester ....................................................................48 2 2 3 4 4 1 3 9 9 9
ESD
D
WARNUNG
Alle ICs und viele andere Halbleiter sind empfindlich gegenüber elektrostatischen Entladungen (ESD). Unsorgfältige Behandlung im Reparaturfall kan die Lebensdauer drastisch reduzieren. Veranlassen Sie, dass Sie im Reparaturfall über ein Pulsarmband mit Widerstand verbunden sind mit dem gleichen Potential wie die Masse des Gerätes. Bauteile und Hilfsmittel auch auf dieses gleiche Potential halten.
ESD PROTECTION EQUIPMENT:
NL
Alle IC’s en vele andere halfgeleiders zijn gevoelig voor electrostatische ontladingen (ESD). Onzorgvuldig behandelen tijdens reparatie kan de levensduur drastisch doen verminderen. Zorg ervoor dat u tijdens reparatie via een polsband met weerstand verbonden bent met hetzelfde potentiaal als de massa van het apparaat. Houd componenten en hulpmiddelen ook op ditzelfde potentiaal.
Tutti IC e parecchi semi-conduttori sono sensibili alle scariche statiche (ESD). La loro longevità potrebbe essere fortemente ridatta in caso di non osservazione della più grande cauzione alla loro manipolazione. Durante le riparazioni occorre quindi essere collegato allo stesso potenziale che quello della massa dell’apparecchio tramite un braccialetto a resistenza. Assicurarsi che i componenti e anche gli utensili con quali si lavora siano anche a questo potenziale.
WAARSCHUWING
I
AVVERTIMENTO
GB
Safety regulations require that the set be restored to its original condition and that parts which are identical with those specified, be used
Safety components are marked by the symbol
!
.
NL
Veiligheidsbepalingen vereisen, dat het apparaat bij reparatie in zijn oorspronkelijke toestand wordt teruggebracht en dat onderdelen, identiek aan de gespecificeerde, worden toegepast.
De Veiligheidsonderdelen zijn aangeduid met het symbool
!
F
Les normes de sécurité exigent que l’appareil soit remis à l’état d’origine et que soient utiliséés les piéces de rechange identiques à celles spécifiées.
Less composants de sécurité sont marqués
!
D
Bei jeder Reparatur sind die geltenden Sicherheitsvorschriften zu beachten. Der Original zustand des Geräts darf nicht verändert werden; für Reparaturen sind Original-Ersatzteile zu verwenden.
Sicherheitsbauteile sind durch das Symbol
!
markiert.
I
Le norme di sicurezza esigono che l’apparecchio venga rimesso nelle condizioni originali e che siano utilizzati i pezzi di ricambio identici a quelli specificati.
Componenty di sicurezza sono marcati con
!
CLASS 1
LASER PRODUCT
GB
Invisible laser radiation when open. Avoid direct exposure to beam.
Osynlig laserstrålning när apparaten är öppnad och spärren är urkopplad. Betrakta ej strålen.
SF
Avatussa laitteessa ja suojalukituksen ohitettaessa olet alttiina näkymättömälle laserisäteilylle. Älä katso säteeseen!
DK
Usynlig laserstråling ved åbning når sikkerhedsafbrydere er ude af funktion. Undgå udsaettelse for stråling.
S
Warning !
Varning !
Varoitus !
Advarse !
GB
After servicing and before returning set to customer perform a leakage current measurement test from all exposed metal parts to earth ground to assure no shock hazard exist. The leakage current must not exceed
0.5mA.
F
"Pour votre sécurité, ces documents doivent être utilisés par des spécialistes agréés, seuls habilités à réparer votre appareil en panne".
Technical Speci
cations and Connection Facilities
Lead Free Requirements
HTS5500C/37/55
1.
EN 7
Pb(Lead) Free Solder
When soldering , be sure to use the pb free solder.
INDENTIFICATION:
Regardless of special logo (not always indicated) one must treat all sets from 1 Jan 2005 onwards, according next
rules: Important note: In fact also products of year 2004 must be treated in
this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this.
Due to lead-free technology some rules have to be respected by the workshop during a repair:
Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required, please contact the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not easy to store and to handle.
Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able
o To reach at least a solder-temperature of 400°C, o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for different applications.
Adjust your solder tool so that a temperature around 360°C – 380°C is reached and stabilized at the solder joint. Heating­time of the solder-joint should not exceed ~ 4 sec. Avoid temperatures above 400°C otherwise wear-out of tips will rise drastically and fl ux-fl uid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat.
Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid or does not know whether product is lead­free, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305).
Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at external companies.
Special information for BGA-ICs:
- always use the 12nc-recognizable soldering temperature profi le of the specifi c BGA (for de-soldering always use the lead-free temperature profi le, in case of doubt)
- lead free BGA-ICs will be delivered in so-called ‘dry­packaging’ (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL­level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYS-website.
Do not re-use BGAs at all.
For sets produced before 1.1.2005 (except products of 2004), containing leaded solder-alloy and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes.
On our website www.atyourservice.ce.Philips.com you fi nd more information to:
BGA-de-/soldering (+ baking instructions)Heating-pro les of BGAs and other ICs used in
Philips-sets You will fi nd this and more technical information within the
“magazine”, chapter “workshop news”.
For additional questions please contact your local repair-helpdesk.
EN 8
HTS5500C/37/552.
2. Dismantling Instructions
Dismantling Instructions & Service Positions
2.1 Dismantling of the SD5.5_5dis changer
1) The tray can be manually open by inserting a minus screw drive and push the lever in the direction as shown in Figure 1 to unlock the tray before sliding it out.
2) Slide out the tray and remove the Cover Tray (pos 110) as shown in Figure 2.
Push lever in direction shown to open the tray manually
Figure 1
3) Loosen 7 screws to remove the Front Top.(pos 240)
- 2 screw each on the left & right side (pos 272)
- 3 screws A behind
2.2 Dismantling of the Tuner Module, AV Board, SD6.3 ,Front Board, PSU Module
1) Loosen 2 screw B (see Figure 3a) to remove the Tuner Module (pos 1040).
2) Loosen 4 screws C (see Figure 3b) to remove AV Board 1.
3) Loosen 4 screws D (see Figure 3c) and 2 screws H (see Figure 4a) to remove AV Board 2.
4) Loosen 2 screws E (see Figure 4a) to remove the PSU Module.
5) Loosen 6 screws I (see Figure 4a) and 4 snap hooks to remove Front Board.
- 1 snap hook each on the left & right side (pos 161).
- 2 snap hooks on the bottom side (pos 161).
B
A
Figure 3a
4) Loosen 6 screws G (see Figure 4a and 4b) to remove the SD5.5_5dis changer.
Figure 2
C
Figure 3b
D
Figure 3c
Catch
EN 9
Dismantling Instructions & Service Positions
HTS5500C/37/55
2.
H
E
F
2.3 Service Positions
Insert Thick Insulation Sheet in between the AV Board 1 and 2.
G
I
Figure 4a
AV Board 2
Figure 5
AV Board 1
AV Board 1
G
Figure 4b
Thick Insulation Sheet
Thick Insulation Sheet
PSU
Figure 6
Thick Insulation Sheet
Front Board
Figure 7
Thick Insulation Sheet
SD6.3
Figure 8
AV Board 2
EN 10
3.
HTS5500C/37/55
3. Diagnostic Software
Service test program
To start service test program
hold open/close and
buttons depressed while
plugging in the mains cord
Hold open/close and buttons depressed till the Display shown “S-Vxx-yy”
Diagnostic Software
Display shows
“SERVICE”
followed by ROM version
“S-Vxx-yy”
Main Menu
Display Test
Key
“Display Test”
triggered?
Activate and display
“Pattern1”
“ ”
triggered?
n
“Display Test”
triggered?
Key
Key
S refers to Service Mode V refers to Version xx refers to Software version number of BEA (counting up from 01 to 99) yy refers to Software version number of Front uP (counting up from 01 to 99)
Display Test
n
y
y
n
y
Following display patterns are used to test the display and its connections to μP.
Pattern 1:
All display control pins are ON All LEDs are ON.
- to check for open-circuits
Pattern 2:
Alternate display control pins are ON (Test Pattern: 0x55) The following LEDs are ON: DiscAvailable1 DiscAvailable3 DiscAvailable5 DiscActive2 DiscActive4
- to check for short-circuits
Activate and display
“Pattern2”
Key
“ ”
triggered?
y
(tbd)
n
TEST Activated with ACTION
EEPROM FORMAT TEST
ROTARY ENCODER TEST
LEAVE SERVICE TEST PROGRAM
DISC 1 Load default data. Display shows “NEW”.
Volume
Knob
Disconnect mains cord
Caution! All presets from the customer will be lost!!
Display shows value for 2 seconds. Volume values increases or decreases in steps of 1 until 0 (VOL MIN) or 40 (VOL MAX) is reached.
Diagnostic Software
HTS5500C/37/55
3.
EN 11
Reprogramming of DVD version Matrix
After repair, the customer setting and region code may be lost. Reprogramming will put the set back in the state in which it has left the factory, ie. with the default setting and the allowed region code.
HTS5x00 Software Version Matrix
Model
HTS5500
1
C/37
HTS5500
2
C/55
To reprogram do as follows:
1) Power up the set and select DISC source.
2) Open tray by press “OPEN/CLOSE” button on the set or press and hold “STOP” button on the RC.
3) Press the following buttons on the Remote Control:
<9> <9> <9> <9> <AUDIO> <1> ......... for HTS5500C/37
<9> <9> <9> <9> <AUDIO> <2> ......... for HTS5500C/55
4) The display shows ‘YYYY-ZZ’ and the tray will close. YYYY = model number (eg. 8300, 8500, etc.) ZZ = slash stroke version (eg. 01, 69, etc.)
Key
Sequence
Open
Tray 9999
Audio 1
Open
Tray 9999
Audio 2
Region
LATAM 4 PAL yes
Region
Code
US 1 NTSC yes
TV
Type
PSCAN
Procedure for check Software version
1) Power up the set and select DISC source.
2) Open tray by press “OPEN/CLOSE” button on the set or press and hold “STOP” button on the RC.
3) Press “DISPLAY” button on the Remote control.
4) The TV screen will shows:
SD6.3 Vxx YYYY-ZZ A BB SERVO: nnnnnnnn REG:A
xx = version number YYYY = model number (eg. 8300, 8500, etc.) ZZ = slash stroke version (eg. 01, 69, etc.) A = region code BB = Front uP software version number nnnnnnnn = servo version number
Trade Mode
Trade mode is a feature that will block all set keys when enabled. It is for dealers to prevent customers from removing disc, changing source etc using the set keys. Rotary and Remote Control (RC) keys are still allowed inTrade mode.
To activate Trade Mode:
1) Power up the set and select DISC source.
2) Open tray by press “OPEN/CLOSE” button on the set or press and hold “STOP” button on the RC.
3) Then press buttons <2> <5> <9> on the RC.
4) The display shows ‘TRA ON’ and the tray will close. Trade Mode is now enabled.
To deactivate Trade Mode:
1) Power up the set and select DISC source.
2) Open tray by press and hold “STOP” button on the RC.
3) Then press buttons <2> <5> <9> on the RC.
4) The display shows ‘TRA OFF’ and the tray will close. Trade Mode is now disabled.
Procedure to change Tuner Grid (not for all versions)
In North and South America, the frequency step between adjacent channels in the MW band is 10kHz (9kHz in some areas). The preset frequency step in the factory is 9kHz.
IMPORTANT! Changing the tuning grid will erase all previously stored preset radio stations.
1) Press TUNER on the remote (or press SOURCE control on front panel) to select “FM” or “MW”.
2) Press STANDY ON to switch the DVD system to standby mode.
3) While holding down SOURCE and PREV on the front panel, disconnect and connect the power cord to the power supply again.
-> The display will show “GRID 9” or “GRID 10”. Helpful hints:
- GRID 9 and GRID 10 indicate that the tuning grid is in step of 9kHz and 10kHz respectively.
- The FM tuning grid also will be changed from 50kHz to 100kHz or vice versa.
Procedure to upgrade software
1) Power up the set and select DISC source.
2) Open tray by press “OPEN/CLOSE” button on the set or press and hold “STOP” button on the RC.
3) Place Upgrade CD-ROM with fi lename “HTS5500.bin” onto tray and close.
4) The set will response and display the following:
- LOAD (After the disc is read, the tray will open for you to remove the disc)
- ERASE (Erasing disc)
- WRITE (Writing disc)
- ERROR (if upgrade is unsuccessful)
- UPG END (if upgrade is successful)
- DISC->CLOSE->LOAD (Tray will close indicating that the upgrade process is completed)
5) The whole process should not take more than 5 minutes.
Caution: Do not unplug the set until upgrade is completed.
EN 12
Notes:
HTS5500C/37/553.
Diagnostic Software
EN 13
HTS5500C/37/55
1
11
1
1
1
RDS_CLK
GND_D
PCM_Data_LR
GND_D
GND_D
GND_D
GND_D
PCM_Data_SLR
PCM_Data_Sub_Cen
GND_ND
1
1
GND_D PCM_Data_LR GND_D
RDS_CLK RDS_DAT
SCL-DAC SDA-DAC
GND_D
GND_D
GND_D
PCM_Data_SLR
PCM_Data_Sub_Cen
GND_ND
1
1
1
DNG
+1V8_Sense
GND_D GND_D
+1V8
SCL-DAC SDA-DAC
KLCSMCP
OL_ATADMCP
DNG
KLCMCP
KLCRLMCP
DNG
ted_ciM
DNG
tuo_FIDPS
DNG
05P
1
DNG
KLCSMCP
OL_ATADMCP
DNG
KLCMCP
KLCRLMCP
DNG
ted_ciM
DNG
tuo_FIDPS
DNG
05P
3eniL / 1TRACS
3eniL / 0TRACS
1
1
Y
C
V_DNG
SBVC
U_B
DNG
ETUM_VA
ni_ciM_ATAD_MCPFIDPS
V_DNG
1
1
+1V8_Sense GND_D GND_D
+1V8
2 eniL / CN
V_DNG
V_DNG
Y_G
V
_ D N G
V
_ R
V_DNG
1
1
1
1
1
V_DNG
1
1
1
RDS_DAT
3eniL / 1TRACS
3eniL / 0TRACS
2 eniL / CN
V_DNG
V_DNG
Y_G
V_DNG
V_R
V_DNG
Y
C
V_DNG
SBVC
U_B
DNG
ETUM_VA
ni_ciM_ATAD_MCPFIDPS
Block Diagram_HTS5500C_HYwk512
4. Set Block diagram
Set Block Diagram
4.
EN 14
HTS5500C/37/55
5.
HEADPHONE
GND
OUT
VS
(SAA6581)
RDS
(TM 08)
TUNER
74HC4052
Wiring Diagram_3139 249 27191_HYwk511
5. Set wiring diagram
Set Wiring Diagram
EN 15
HTS5500C/37/55
6. Panel Front Boards Front Display - Component Layout
Panel Front Boards
6.
3139 243 3174 pt3 HY wk511
Front Display - Chip Layout
3139 243 3174 pt3 HY wk511
EN 16
HTS5500C/37/55
Front Display - Circuit Diagram
Panel Front Boards
RESET
VASS
INT3
INT2 INT4
INT5
XTIN XTOUT
SCL
V
P9<0:7>
V
SO1
5 6
7
6
5
4
3
2
29
28
27
26
25
24
2 3 4
TC1
SCK0
0 1 2 3 4 5 6
SI1
SCK1
DVO
TEST
VKKVDDVAREF
14
13
12
11
10
9
8
SDA
22
TC3
P1<0:7>
STOP
P2<0:2>
SI0
SO0
P3<0:2>
AIN
31
30
P5<0:3>
PD<0:4>
V3
P6<0:7>
V
P7<0:7>
V
P8<0:7>
23
16
21
20
19
18
17
P4<0:7>
AIN
1
0
15
VSS
PDO
2
1
XTAL
P0<0:7>
PPG
PWM
TC4
13
12
11
10
7
INT0 INT1 TC2
-30V
NC
1300 A5 1301 H3 1302 F3 1303 C4 1304 C5
23456789101112 13
12345678
*
*
*
E
F
G
H
I
A
B
C
D
E
F
G
H
I
1305 B1 1306 B1 2300 E4 2301 E3 2302 A3 2303 B4 2304 B5 2305 B4 2306 B4
DISC2_G
0V
1
NC
1F MORF/OT
-25V
-11V
2F MORF/OT
2307 B4 2308 I10 2309 I11 2310 I11 2311 I4 2312 E6 2313 E6 2314 E2 2315 C1 2316 C3
-25V
9101112 13
A
B
C
D
-32V
TO/FROM
NC
NC
NC
5V
-30V
-18V
DC vtg measured in STOP MODE
2317 C3 2318 C2 2319 B8 2320 D11 2321 D11 2322 E11 2323 F13 2324 F11 2325 C13
P S U
-18V
- NIL PHILIPS HTS5500
-30V
* 3342 - 150 YAMAHA C300
-25V
*
V
-32V
NC
-30V
A
2326 C13 2327 C13 2328 D13 2329 D13 2330 D13 2331 D13 2332 D13
-30V
5V2
2333 D13 2334 D13 2335 E13 2336 E13 2337 B7 2338 B7 2339 C5 2340 C6 2341 B7 3300 F4 3301 F4 3302 B3 3303 H10 3304 H11 3305 I11
5V
NC
NC
DISC3_G
5V
DISPLAY PANEL
5V3
-27V
3306 I12 3307 I11 3308 I11 3309 H4 3310 H4 3313 F6 3314 F6 3315 F6 3316 F6 3317 F6 3318 D6 3319 E6 3320 D6 3321 D3 3322 D3
Key_B02
-30V
5V
-25V
5V
#
-30V
+5VL
3323 C3 3324 C2 3325 C2 3326 D12 3327 E12 3328 E11 3329 F13 3330 F13 3331 F11 3332 D5 3333 B5 3334 B6 3335 B10 3336 B13 3337 B10 3338 B13
Optional
-22V
27V
-30V
0V
0V5
-20V
3340 H5 3341 H5 3342 H6 3343 H6 3344 E6 3345 G6 3346 I5 3347 I6 3348 I7 3349 I8 4301 H4 4302 H4 4303 E3 5300 B7 6300 A3 6301 A3
2V5
-25V
-27V
DISC5_G
DISC1_Y
1V6
DISC4_G
6302 I11 6303 C1 6304 H6 6305 I6 6306 H8 6307 I8 7300 B7 7301 B10 7302 F3 7303 E11 7304 E11 7305 E12 7306 H11 7307 D2 7308 C2 7309 I5
7310 H6
*
B
DISC5_Y
5V
5V
5V
7311 I7 7312 H8 T300 E4 T301 F3 T302 C10 T303 C13 T304 G4 T305 C11 T306 C12 T307 C12 T309 A5 T310 A5 T311 B3 T314 F6 T315 F6 T316 F6
FTD DISPLAY
OPTIONAL
NC
5V
5V
0V
T317 C6 T318 C6 T319 C6 T320 D6 T321 D6 T322 C6 T323 C6 T324 C6 T325 D6 T326 D6 T327 D6 T328 E6
NC
DISC3_Y
-30V
V23-
5V
-25V
T329 E6 T330 F6 T331 F6 T332 H3 T333 H3 T334 H3 T335 C3 T336 D2 T337 C11
-32V
GND_B
*
5V
NC
TO/FROM
*
DISC4_Y
T343 C11 T344 C11 T345 C11 T346 C11 T347 C11 T348 C11 T349 C4 T350 C4 T351 C4 T352 D4 T353 D4 T354 D4 T355 E12 T356 B10 T357 B13 T358 A5 T359 A5 T360 C2
MONO BOARD SD6.3
2V
5V
NC
DISC2_Y
-30V
-25V
-30V
GND_FD
*
5V
T338 C11 T339 C11 T340 C11 T341 C11 T342 C11
FOR OEM MODELS ONLY
NC
DISC1_G
8MHz
-24V
+12V
*
6032
n001
6 7 8 9
1011
T320
09FMN-SMT-A-TF
1 2 3 4 5
87
7
9
8
GND_FD
1301
73 74 75 76 77
10
13
93
83 04
62 63 64
65 66 67 68 69 70 71 72
52 53 54 55 56
57 58 59 60 61
41 42 43 44 45 46 47 48
49 50 51
28 29 30 31 32 33
34 35 36 37
21 22
14
12 11
23
24
25
26 27
2 3 4 5 6
15 16 17
18
19
20
79 80 1
7333
7R4
Φ
MICROPROCESSOR
TMP87PM74ZF
7300
+5V_ever
3536 37 383940 41 4445567
89
GND_FD
1213 14 1516 17 18192
20 30
3132 33 34
1
FTD 12-ST-50GNK
7301
11011
RT-01T-1.0B
1305
GND_FD
1n0
2311
8032
n001
K01
6033
5033
K01
3304
1K2
2
GND
1
OUT
3
VS
7u4
9032
7302
7R4
8333
100p2328
K01
0333
3332
GND_FD
2K7
T325 T326
+5V_ever
T303
2329 100p
+5V_ever
1333
R074
17
0n1
7132
15
2 3 4 5 6 7 8 9
16
15FMN-SMT-A-TF
1303
1
10 11 12 13 14
603T
T357
22p2313
1K03314
p74
3032
3K3
T300
0133
2n2
0132
2K2
GND_FD
0433
GND_FD
GND_FD
3318 4K7
3307
47K
T356
3315 1K0
7032
p74
+5V_ever
+5VL
4302
+5V_ever
GND_D
T314
T311
10K
3324
GND_B
1K0
3323
GND_FD
GND_FD
GND_FD
4132
p22
4301
n33
6132
5300
2u2
743T
T304
503T
GND_FD
BC847BW
7308
4K7
3322
BC847BW
7307
T322
B-6.5ZDP
2036
1300
S5B-EH
1 2 3 4 5
p74
4032
n33
1232
T360
3317
5233
10R
100p
K01
1306
RT-01T-1.0B
1
2327
GND_FD
3320 4K7
543T
6333
2R2
7304
BC327-25
7303
BC337-25
3326
T316
T335
330R
3319 1K0
T323
n74
GND_FD
GND_FD
GND_VFD
9132
VFIL_DC
9033
3K3
0K1
8033
733T
833T
843T
VKK
T349
643T
T321
+5VL
T330
T350
T329
T358
+5V_ever
T309
T353
2K11433
+12VL
T302
T355
22u
2322
3232
p22
+5VL
+5V_ever
GND_FD
GND_VFD
5333
2R2
10R
3333
GND_VFD
T319
8332n33
T336
4303
T315
2324
22u
7233
R033
7u4
7332
8132
0n1
3342
T351
150R
2331 100p
+5V_ever
GND_FD
T310
9233
7K4
2312 22p
T331
2335 100p
+5V_ever
2325 100p
T318
100p2332
T317
+5V_ref
GND_B
T328
10R
3334
7312
BC857BW
BAS316
6306
6307
BAS316
10K
3348
K01
9433
GND_FD
+5V_ever
BC857BW
7310
7309
BC847BW
3346
10K
BAS316
BAS316
6305
6304
7433
K01
0432
p22
9332
p22
T334
3345
10K
GND_FD
1032
n001
2315
2u2
GND_FD
GND_FD
+12VL
BC847BW
7311
BC847BW
7305
T352
100p2326
T301
100p2334
+5V_ever
2333 100p
443T
100p2330
7K2
1033
0033
7K2
703T
5032
u22
6301
PDZ8.2-B
VKK
VFIL_DC
+5V_ref
2K73343
T324
T327
1432
7u4
u22
T332
GND_FD
GND_FD
0232
3036
613SAB
8233
R074
1304
0036
6V5C-483XZB
GND_FD
p74
2032
7306 BC847BW
T359
K01
2033
3303 100R
VKK
T333
100p2336
3313 1K0
4K7
3321
3316 10R
0032
GND_FD
GND_FD
u001
T354
GND_B
243T
343T
143T
933T
043T
GND_FD
5 6 7 8
910
1302
08FMN-SMT-A-TF
1 2 3 4
+5V_ref
10K
3344
DISC3_G
B01
B03 VOL_A VOL_B
PBox_Ctrl
DISC5_G
DISC4_G
PBox_Ctrl
P14
P15
P16
DISC3_Y DISC4_Y DISC5_Y
B02
DISC2_G DISC3_G DISC4_G DISC5_G
+5VL
DISC1_Y DISC2_Y
STANDBY_LED
G4
G3
G2
G5
G12
G11
G10
G9
G8
G7
G6
G5
G4
G3
G2
G1
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
FIL2
FIL1
G1
21G
61P
G8
G9
G10
G11
G12
2G1G3G4G5G
6G
G6
DISC1_G
INTRQ
DISC1_G
B01
SDA
STDBY_CTRL
1LIF
2LIF
8G
SCL
51P
IR
ioRC6
DISC2_G DISC1_Y DISC2_Y DISC3_Y DISC4_Y DISC5_Y
FIL_DIR
IR
STANDBY_LED
IR
ioRC6
STDBY_CTRL
INTRQ
SDA
4P5P6P7P8P
9P
01P
11P
21P
31P
41P
VOL_B
VOL_A
SCL
G7
3P
B03
B02
11G
01G
9G
7G
1P
2P
3139_243_31714_31392433174 pt3 HY wk511
6.
EN 17
HTS5500C/37/55
Key & Open/Close Board - Component Layout
Panel Front Boards
3139 243 3168 pt3 HY wk511
Key & Open/Close Board - Chip Layout
3139 243 3168 pt3 HY wk511
6.
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