Philips HTS5110, HTS5110/12, HTS5110/51, HTS5110/98 Service Manual

Published by KC-LQ 1004 AVM Printed in he Netherlands
HTS5110/12/51/98
Subject to modication EN 3139 785 35230
Home Theater System
Contents
Page
Contents
Page
©
Version 1.0
2 Importand Safety Precautions ......................... 2-1 to 2-2
3 Safety Check After Servicing ..................................... 3-1
4 Safety Information Genard Notes & Lead Free
5 Standard Notes For Servicing ................................... 5-1
6 Special Information of BGA IC & Flat
7 Direction of USE ............................................. 7-1 to 7-5
1 Technical Specification and Connection Facilities
8 Cabinet Disassembly Instructions ................... 8-1 to 8-3
9 Troubleshooting ......................................................... 9-1
10 Software Upgrading Procedure ............................. 10-1
11 Software Version Check Procedure ...................... 10-2
12 Block Diagram ....................................................... 11-1
13 Wiring Diagram ..................................................... 12-1
14 Main Unit--Touch Board Diagram
Circuit Diagram ............................................13-1
Layout Diagram ...........................................13-1
15 Main Unit--VFD Display Board Diagram
Circuit Diagram ............................................14-1
PT6311 IC Specification ..............................14-2
Layout Diagram ...........................................14-3
16 Main Unit--Decoder Board Diagram
Circuit Diagram ...............................15-1 to 15-3
Circuit Diagram ...............................15-6 to 15-9
EN29LV320A IC Specification ....................15-5
UDA1355H IC Specification .....................15-10
Layout Diagram ........................................15-11
M12L64164A IC Specification ....................15-4
17 Main Unit--Radio Transmit Board Diagram
Circuit Diagram ................................16-1 to 16-3
Layout Diagram ...........................................16-4
20 Main Unit Exploded View ...................................... 19-1
18 Subwoofer--Radio Receiver Board Diagram
Circuit Diagram ................................17-1 to 17-3
Layout Diagram ...........................................17-4
19 Subwoofer--Power Board Diagram
Circuit Diagram ................................18-1 to 18-2
Layout Diagram ...........................................18-3
21 Subwoofer Exploded View .................................... 19-2
22 Revision List .......................................................... 20-1
Features
RDS Voltage Selector
ECO Standby DTS
Feature
Different
/12
/51 /98
Pack-IC.................................... 6-1 to 6-3
Requirement ....................................... 4-1
................................................ 1-1 to 1-2
Technical Specications and Connection Facilities
1. Technical Specifications and Connection Facilities
1.1 PCB Locations
Main Unit
Subwoofer
1.2 General:
Power supply : 100-240V, ~50 Hz Power consumption : 35 W
Standby power consumption : < 1 W
1.4 Analog Inputs/Outputs
1.4.1 MP3 LINK IN of Cinch connector to be used for measurements(direct input from Front end)
MP3 LINK Performance: Frequency Response : -1 ± 3dB (150 to 20KHz) Input and output voltages : 500 mV / 20 kOhm
1.3 Radio
Tuning Frequency Range : 87.5 MHz – 108 MHz Antenna Level for 40dB luminance S/N (video unweighted) at 75Ω : ≤ 71dBμV (High End) ≤ 50dBμV (Low End)
Automatic Search Tuning: Scanning time auto search without RF Signal : < 2.5 min. (Typical 3 minutes) Stop level (vision carrier) : ≥ 31dBμV Maximum tuning error during operation (drift) : ≤ 50kHz Maximum tuning error of a recalled program : ± 22.5 kHz Tuning Principles: Automatic system recognition
Decoder Board
VFD Display Board
USB Board
Touch Board-2
Touch Board-1
Radio Transmit Board
1-1
Power Board
Power Control Switch 110/220V (for 55/98version)
Radio Receiver Board
1.4.2 Video Rear output Connector CVBS output:
DC Level : 0V+1V Amplitude output: : 1.04V
Technical Specications and Connection Facilities
1-2
1.6 Dimension and Weight
1.5 (AUDIO OUT) Coaxial Digital LPCM : according IEC 60958
MPEG 1, MPEG 2, AC3 : according IEC 61937 DTS : according IEC 61937 + addendum
1.5.1 USB Compatibility : USB 2.0
Type of connector : Series A Connector
1.5.2 HDMI Output
Set Dimension W x H x D : 790.6 x 100.3 x 50mm Net Weight : 1.5kg
Subwoofer Dimension W x H x D : 182 x 365 x 306mm Net Weight : 6kg
Compatibility : HDMI version 1.3 Type of connector : Type A connector (19 pins)
1.7 Video Performance
1.7.1 SNR PAL
RGB CVBS Y/C
≥ 55 dB Lumincance: ≥ 55 dB
Chroma: ≥ 55 dB (AM) ≥ 52 dB (PM)
Y: ≥ 57 dB C: ≥ 57 dB (AM) ≥ 54 dB (PM)
NTSC
Y Pb Pr CVBS Y/C
≥ 55 dB Lumincance: ≥ 55 dB
Chroma: ≥ 54 dB (AM) ≥ 54 dB (PM)
Y: ≥ 55 dB C: ≥ 54 dB (AM) ≥ 54 dB (PM)
1.7.2 Bandwidth PAL
RGB CVBS Y/C
0.5 to 4 MHz:+1dB/
-2dB
0.5 to 4 MHz:+1dB/
-2dB
Y:4.8MHz-3dB
4.8 MHz:-3dB 4.8 MHz:-3dB C:700 kHz
5.8 MHz:-6dB 5.8 MHz:-6dB
NTSC
YPbPr CVBS Y/C
4.2 MHz:-3dB 4.2 MHz:-3dB Y:4.2MHz-3dB
5.8 MHz:-6dB 5.8 MHz:-6dB C:≥ 700 kHz
With Pscan:
8.4MHz -3dB
Electronics N.V. bears no responsibility for improper wall mounting that results in accident, injury or damage.
For speakers with stands, use only the supplied stands. Secure the stands to the speakers tightly. Place the assembled stands on flat, level surfaces that can support the combined weight of the speaker and stand. Never place the product or any objects on power cords or on other electrical equipment. If the product is transported in temperatures below 5°C, unpack the product and wait until its temperature matches room temperature before connecting it to the power outlet. Visible and invisible laser radiation when open. Avoid exposure to beam. Do not touch the disc optical lens inside the disc compartment.
Risk of overheating!
Never install this product in a conned space. Always leave a space of at least four inches around the product for ventilation. Ensure curtains or other objects never cover the ventilation slots on the product.
Risk of contamination!
Do not mix batteries (old and new or carbon and alkaline, etc.). Remove batteries if they are exhausted or if the remote control is not to be used for a long time. Batteries contain chemical substances, they should be disposed of properly.
Product care
Do not insert any objects other than discs into the disc compartment. Do not insert warped or cracked discs into the disc compartment. Remove discs from the disc compartment if you are not using the product for an extended period of time.
Only use microfiber cloth to clean the product.
Important
Important Safety Precautions
Read and understand all instructions before you use your home theater. If damage is caused by failure to follow instructions, the warranty does not apply.
Safety
Risk of electric shock or re!
Never expose the product and accessories to rain or water. Never place liquid containers, such as vases, near the product. If liquids are spilt on or into the product, disconnect it from the power outlet immediately. Contact Philips Consumer Care to have the product checked before use. Never place the product and accessories near naked ames or other heat sources, including direct sunlight. Never insert objects into the ventilation slots or other openings on the product. Where the mains plug or an appliance coupler is used as the disconnect device, the disconnect device shall remain readily operable. Disconnect the product from the power outlet before lightning storms. When you disconnect the power cord, always pull the plug, never the cable.
Risk of short circuit or re!
Before you connect the product to the power outlet, ensure that the power voltage matches the value printed on the back or bottom of the product. Never connect the product to the power outlet if the voltage is different.
Risk of injury or damage to the home theater!
For wall-mountable products, use only the supplied wall mount bracket. Secure the wall mount to a wall that can support the combined weight of the product and the wall mount. Koninklijke Philips
2-1
Disposal of your old product and batteries
Your product is designed and manufactured with high quality materials and components, which can be recycled and reused.
When this crossed-out wheeled bin symbol is attached to a product it means that the product is covered by the European Directive 2002/96/EC. Please inform yourself about the local separate collection system for electrical and electronic products. Please act according to your local rules and do not dispose of your old products with your normal household waste. Correct disposal of your old product helps to prevent potential negative consequences for the environment and human health.
Your product contains batteries covered by the European Directive 2006/66/EC, which cannot be disposed with normal household waste. Please inform yourself about the local rules on separate collection of batteries because correct disposal helps to prevent negative consequences for the environmental and human health.
Important Safety Precautions
2-2
3-1
Safety Check after Servicing
Examine the area surrounding the repaired location for damage or deterioration. Observe that screws, parts, and wires have been returned to their original positions. Afterwards, do the following tests and confirm the specified values to verify compliance with safety standards.
1. Clearance Distance
When replacing primary circuit components, confirm specified clearance distance (d) and (d’) between soldered terminals, and between terminals and surrounding metallic parts. (See Fig. 1)
Table 1: Ratings for selected area
Note: This table is unofficial and for reference only. Be
sure to confirm the precise values.
2. Leakage Current Test
Confirm the specified (or lower) leakage current between B (earth ground, power cord plug prongs) and externally exposed accessible parts (RF terminals, antenna terminals, video and audio input and output terminals, microphone jacks, earphone jacks, etc.) is lower than or equal to the specified value in the table below.
Measuring Method (Power ON): Insert load Z between B (earth ground, power cord plug
prongs) and exposed accessible parts. Use an AC voltmeter to measure across the terminals of load Z. See Fig. 2 and the following table.
Table 2: Leakage current ratings for selected areas
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
AC Line Voltage Clearance Distance (d), (d’)
110V~220V 3.2 mm (0.126 inches)
AC Line Voltage Load Z Leakage Current (i) Earth Ground (B) to:
110V~220V
0.15 µF CAP. & 1.5 k RES. Connected in parallel
i 0.5 mA Peak Exposed accessible parts
Chassis or Secondary Conductor
Primary Circuit
Fig. 1
d' d
AC Voltmeter (High Impedance)
Exposed Accessible Part
B
Earth Ground Power Cord Plug Prongs
Z
Fig. 2
1 Safety Instructions
1.1 General Safety Safety regulations require that during a repair:
• Connect the unit to the mains via an isolation transformer.
• Replace safety components, indicated by the symbol
, only by components identical to the original ones. Any other component substitution (other than original type) may increase risk of fire or electrical shock hazard.
Safety regulations require that after a repair, you must return the unit in its original condition. Pay, in particular, attention to the following points:
• Route the wires/cables correctly, and fix them with the mounted cable clamps.
Check the insulation of the mains lead for external damage.
• Check the electrical DC resistance between the mains plug and the secondary side:
1. Unplug the mains cord, and connect a wire between the two pins of the mains plug.
2. Set the mains switch to the ‘on’ position (keep the mains cord unplugged!).
3. Measure the resistance value between the mains plug and the front panel, controls, and chassis bottom.
4. Repair or correct unit when the resistance measurement is less than 1 MΩ.
5. Verify this, before you return the unit to the customer/ user (ref. UL-standard no. 1492).
6. Switch the unit ‘off’, and remove the wire between the two pins of the mains plug.
2 Warnings
2.1 General
• All ICs and many other semiconductors are susceptible to electrostatic discharges (ESD,
). Careless handling during repair can reduce life drastically. Make sure that, during repair, you are at the same potential as the mass of the set by a wristband with resistance. Keep components and tools at this same potential. Available ESD protection equipment: – Complete kit ESD3 (small tablemat, wristband, connection box, extension cable and earth cable) 4822 310 10671. – Wristband tester 4822 344 13999.
• Be careful during measurements in the live voltage section. The primary side of the power supply, including the heatsink, carries live mains voltage when you connect the player to the mains (even when the player is ‘off’!). It is possible to touch copper tracks and/ or components in this unshielded primary area, when you service the player. Service personnel must take precautions to prevent touching this area or components in this area. A ‘lightning stroke’ and a stripe-marked printing on the printed wiring board, indicate the primary side of the power supply.
• Never replace modules, or components, while the unit is ‘on’.
Safety Information, General Notes & Lead Free Requirements
4-1
5-1
Standard Notes for Servicing
Circuit Board Indications
1. The output pin of the 3 pin Regulator ICs is indicated as shown.
2. For other ICs, pin 1 and every fifth pin are indicated as shown.
3. The 1st pin of every male connector is indicated as shown.
Instructions for Connectors
1. When you connect or disconnect the FFC (Flexible Foil Connector) cable, be sure to first disconnect the AC cord.
2. FFC (Flexible Foil Connector) cable should be inserted parallel into the connector, not at an angle.
Pb (Lead) Free Solder
When soldering, be sure to use the Pb free solder. Information about lead-free soldering Philips CE is producing lead-free sets from 1.1.2005
onwards.
IDENTIFICATION
Regardless of special logo (not always indicated)
One must treat all sets from onwards, according to the next rule: Serial Number gives a 14-digit. Digit 5&6 shows the YEAR, and digit 7&8 shows the WEEK.
So from onwards=from 1 Jan 2005 onwards
Important note : In fact also products of year 2004 must be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this.
Due to lead-free technology some rules have to be respected by the workshop during a repair:
• Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder­paste is required, please contact the manufacturer of your solder-equipment. In general use of solder­paste within workshops should be avoided because paste is not easy to store and to handle.
• Use only adequate solder tools applicable for lead­free solder alloy. The solder tool must be able
• To reach at least a solder-temperature of 400°C,
• To stabilize the adjusted temperature at the solder-
tip
• To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature around 360°C
- 380°C is reached and stabilized at the solder joint. Heating-time of the solder-joint should not exceed ~ 4 sec. Avoid temperatures above 400°C otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat.
• Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed solder alloy types (leaded and lead-free). If one cannot avoid or does not know whether product is lead-free, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305).
• Use only original spare-parts listed in the Service­Manuals. Not listed standard-material (commodities) has to be purchased at external companies.
Top View
Out
In
Bottom View
Input
5
10
Pin 1
Pin 1
FFC Cable
Connector
CBA
* Be careful to avoid a short circuit.
1 Jan 2005
0501
6-1
Special information for BGA-ICs:
- always use the 12nc-recognizable soldering temperature profile of the specific BGA (for de­soldering always use the lead-free temperature profile, in case of doubt)
- lead free BGA-ICs will be delivered in so-called 'dry-packaging' (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level seen on indicator­label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYS-website. Do not re-use BGAs at all.
• For sets produced before 1.1.2005 (except products of 2004), containing leaded solder-alloy and components, all needed spare-parts will be available till the end of the service-period. For repair of such sets nothing changes.
• On our website www.atyourservice.ce.Philips.com
you find more
information to:
• BGA-de-/soldering (+ baking instructions)
• Heating-profiles of BGAs and other ICs used in
Philips-sets
You will find this and more technical information within the “magazine”, chapter “workshop news”.
For additional questions please contact your local repair-helpdesk.
How to Remove / Install Flat Pack-IC
Special Information of BGA IC & Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:
1. Prepare the hot-air flat pack-IC desoldering machine, then apply hot air to the Flat Pack-IC (about 5 to 6 seconds). (Fig. S-1-1)
2. Remove the flat pack-IC with tweezers while applying the hot air.
3. Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)
CAUTION:
1. The Flat Pack-IC shape may differ by models. Use an appropriate hot-air flat pack-IC desoldering machine, whose shape matches that of the Flat Pack-IC.
2. Do not supply hot air to the chip parts around the flat pack-IC for over 6 seconds because damage to the chip parts may occur. Put masking tape around the flat pack-IC to protect other parts from damage. (Fig. S-1-2)
Fig. S-1-1
3. The flat pack-IC on the CBA is affixed with glue, so be careful not to break or damage the foil of each pin or the solder lands under the IC when removing it.
With Soldering Iron:
1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3)
2. Lift each lead of the flat pack-IC upward one by one, using a sharp pin or wire to which solder will not adhere (iron wire). When heating the pins, use a fine tip soldering iron or a hot air desoldering machine. (Fig. S-1-4)
3. Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)
With Iron Wire:
1. Using desoldering braid, remove the solder from all pins of the flat pack-IC. When you use solder flux which is applied to all pins of the flat pack-IC, you can remove it easily. (Fig. S-1-3)
2. Affix the wire to a workbench or solid mounting point, as shown in Fig. S-1-5.
3. While heating the pins using a fine tip soldering iron or hot air blower, pull up the wire as the solder melts so as to lift the IC leads from the CBA contact pads as shown in Fig. S-1-5.
4. Bottom of the flat pack-IC is fixed with glue to the CBA; when removing entire flat pack-IC, first apply soldering iron to center of the flat pack-IC and heat up. Then remove (glue will be melted). (Fig. S-1-6)
5. Release the flat pack-IC from the CBA using tweezers. (Fig. S-1-6)
Note: When using a soldering iron, care must be
taken to ensure that the flat pack-IC is not being held by glue. When the flat pack-IC is removed from the CBA, handle it gently because it may be damaged if force is applied.
Hot-air Flat Pack-IC Desoldering Machine
CBA
Flat Pack-IC
Tweezers
Masking Tape
Fig. S-1-2
Flat Pack-IC
Desoldering Braid
Soldering Iron
Fig. S-1-3
Fine Tip Soldering Iron
Sharp Pin
Fig. S-1-4
To Solid Mounting Point
Soldering Iron
Iron Wire
or
Hot Air Blower
Fig. S-1-5
Fine Tip Soldering Iron
CBA
Flat Pack-IC
Tweezers
Fig. S-1-6
6-2
6-3
2. Installation
1. Using desoldering braid, remove the solder from the foil of each pin of the flat pack-IC on the CBA so you can install a replacement flat pack-IC more easily.
2. The “
” mark on the flat pack-IC indicates pin 1. (See Fig. S-1-7.) Be sure this mark matches the 1 on the PCB when positioning for installation. Then presolder the four corners of the flat pack-IC. (See Fig. S-1-8.)
3. Solder all pins of the flat pack-IC. Be sure that none of the pins have solder bridges.
Instructions for Handling Semi-
Special Information BGA IC & Flat Pack-IC
conductors
Electrostatic breakdown of the semi-conductors may occur due to a potential difference caused by electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a grounding band (1 M) that is properly grounded to remove any static electricity that may be charged on the body.
2. Ground for Workbench
Be sure to place a conductive sheet or copper plate with proper grounding (1 M) on the workbench or other surface, where the semi-conductors are to be placed. Because the static electricity charge on clothing will not escape through the body grounding band, be careful to avoid contacting semi-conductors with your clothing.
Example :
Pin 1 of the Flat Pack-IC is indicated by a " " mark.
Fig. S-1-7
Presolder
CBA
Flat Pack-IC
Fig. S-1-8
<Incorrect>
CBA
Grounding Band
Conductive Sheet or Copper Plate
1M
1M
<Correct>
CBA
RADIO: Switches to FM radio. COAX: Switches to coaxial digital input source. AUX: Switches to auxiliary input source. MP3 LINK: Switches to MP3 Link input source.
c
SETUP
Accesses or exits the setup menu.
d
(Navigation buttons) Navigate menus. In video mode, press left or right to fast backward or fast forward. In radio mode, press left or right to search a radio station; press up or down to ne tune a radio frequency.
e
(Fast Backward) (Fast Forward) Fast backwards or fast forwards. Press repeatedly to change the search speed.
f
INFO Displays information about what is playing.
g
(Play/Pause)
Starts, pauses or resumes playback.
h
(Stop)
Stops playback. In radio mode, erases the current preset radio station.
i TREBLE / BASS
Changes treble or bass. Use with +/-.
j Numeric buttons
Selects an item to play.
k AUDIO SYNC
Press and hold to access the setting for audio sync, then press +/- to set the audio delay time.
l SOUND MODE
Selects a predened sound effect.
m ZOOM
Zooms into a video scene or picture.
n REPEAT A-B
a
(Standby-On)
Switches the home theater on or to standby. When EasyLink is enabled, press and hold for at least three seconds to switch all connected HDMI CEC compliant devices to standby.
b Audio Source
USB: Switches to USB storage device.
19
18 17
16 15
1 2
3
5
4
7
6
9
8
12
11
10
14
13
22 21
20
23
19
18 17
16 15
1 2
3
5
4
7
6
9
8
12
11
10
14
13
22 21
20
23
Direction of Use
*The following excerpt of the DFU/QSG serves as an introduction to the set.
The Complete Direction for Use can be download in different languages from the internet site of Philips Customer care Center: www.p4c.philips.com
Remote Control
7-1
Marks two points within a chapter or track for repeat play, or turns off repeat mode.
o REPEAT / PROGRAM
Selects a repeat or shufe mode. In radio mode, programs radio stations.
p SUBTITLE
Selects a subtitle language for video.
q SURROUND
Selects Dolby Virtual Speaker surround sound.
r
+/-
Increases or decreases volume.
s
(Mute)
Mutes or restores volume.
t
/ (Previous/Next) Skips to the previous or next track, chapter or file.
u
BACK
Returns to a previous menu screen.
v OK
Conrms an entry or selection.
w AUDIO Selects an audio language or channel.
Direction of Use
Remote Control
7-2
Back connectors
a DC IN
Connects to the AC-DC adapter.
b VIDEO OUT (CVBS)
Connects to the composite video input on the TV.
c HDMI OUT
Connects to the HDMI input on the TV.
d FM75
Connects the FM antenna for radio reception.
e DIGITAL IN-COAXIAL
Connects to the coaxial audio output on the TV or a digital device.
f AUX IN Connects to the analog audio output on the TV or an analog device.
Connect to the TV
Connect your home theater directly to a TV through one of the following connectors (from highest to basic quality video):
a HDMI b Composite video c SCART
Connect your
Direction of Use
home theater
This section helps you connect your home theater to a TV and other devices. The basic connections of the home theater with its accessories are provided in the Quick Start. For a comprehensive interactive guide, see www. connectivityguide.philips.com.
Note
Refer to the type plate at the back or bottom of the product for identication and supply ratings. Before you make or change any connections, ensure that all devices are disconnected from the power outlet.
Connectors
Front connectors
a (USB)
Audio, video or picture input from a USB storage device.
b MP3 LINK Audio input from an MP3 player.
7-3
Connect audio from TV or other devices
Use your home theater to play audio from the TV or other devices such as a cable box. Choose from the following connectors.
Option 1: Connect audio through a digital coaxial cable
Note
The digital coaxial cable or connector might be labeled COAXIAL DIGITAL OUT or SPDIF OUT.
(Cable not supplied)
Option 1: Connect to the TV through HDMI
Note
If the HDTV has a DVI connector, connect using an HDMI/DVI adaptor. If the TV supports EasyLink HDMI CEC, control the home theater and TV with one remote control (see ‘Use Philips EasyLink’ on page 17).
Option 2: Connect to the TV through composite video (CVBS)
Note
The composite video cable or connector might be labeled AV IN,VIDEO IN,COMPOSITE or BASEBAND.
Option 3: Connect to the TV through SCART
Use the supplied scart adapter.
Direction of Use
7-4
Option 2: Connect audio through analog audio cables
Option 3: Connect audio through an HDMI cable
Note
The HDMI connector on the TV might be labeled HDMI 1 or HDMI ARC.This feature works with Audio Return Channel (ARC) compatible devices only.
Direction of Use
7-5
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