Copyright 2010 Philips Consumer Electronics B.V. Eindhoven, The Netherlands
All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or
transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without
the prior permission of Philips.
Published by Helen-RY 1207 Service Audio Printed in The Netherlands Subject to modification
The type plate on the back or bottom of the
home theater shows which regions it supports.
Country
China
DVD BD
Media formats
•
AVCHD, BD, BD-R/ BD-RE, BD-Video,
DVD-Video, DVD+R/+RW, DVD-R/-RW,
DVD+R/-R DL, CD-R/CD-RW, Audio CD,
Video CD/SVCD, Picture fi les, MP3 media,
WMA media, DivX Plus HD media, USB
storage device
RMVB (Available only in Asia Pacifi c and China)
One must treat all sets from 1.1.2005 onwards, according
next rules.
Important note
be treated in this way as long as you avoid mixing
solder-alloys (leaded/ lead-free). So best to always use
SAC305 and the higher temperatures belong to this.
Due to lead-free technology some rules have to be
respected by the workshop during a repair:
x Use only lead-free solder alloy Philips SAC305 with
order code 0622 149 00106. If lead-free solder-paste is
required, please contact the manufacturer of your
solder-equipment. In general use of solder-paste within
workshops should be avoided because paste is not easy
to store and to handle.
x Use only adequate solder tools applicable for lead-free
solder alloy. The solder tool must be able
x Adjust your solder tool so that a temperature around
360°C
joint. Heating-time of the solder-joint should not exceed
~ 4 sec. Avoid temperatures above 400°C otherwise
wear-out of tips will rise drastically and flux-fluid will be
destroyed. To avoid wear-out of tips switch off un-used
equipment, or reduce heat.
x Mix of lead-free solder alloy / parts with leaded solder
alloy / parts is possible but PHILIPS recommends
strongly to avoid mixed
solder alloy types (leaded and lead-free). If one cannot
avoid, clean carefully the
solder-joint from old solder alloy and re-solder with new
solder alloy (SAC305).
: In fact also products a little older can also
o To reach at least a solder-temperature of 400°C,
o To stabilize the adjusted temperature at the
solder-tip
o To exchange solder-tips for different applications.
– 380°C is reached and stabilized at the solder
x Use only original spare-parts listed in the
Service-Manuals. Not listed standard-material
(commodities) has to be purchased at external
companies.
xSpecial information for BGA-ICs:
- always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for
de-soldering always use highest lead-free
temperature profile, in case of doubt)
- lead free BGA-ICs will be delivered in so-called
‘dry-packaging’ (sealed pack including a silica gel
pack) to protect the IC against moisture. After
opening, dependent of MSL-level seen on
indicator-label in the bag, the BGA-IC possibly
still has to be baked dry. This will be
communicated via AYS-website.
Do not re-use BGAs at all.
x For sets produced before 1.1.2005, containing
leaded soldering-tin and components, all needed
spare-parts will be available till the end of the
service-period. For repair of such sets nothing
changes.
x On our website:
www.atyourservice.ce.Philips.com
You find more information to:
BGA-de-/soldering (+ baking instructions)
Heating-profiles of BGAs and other ICs used in
Philips-sets
You will find this and more technical information
within the “magazine”, chapter “workshop news”.
For additional questions please contact your local
repair-helpdesk.
Brief Guide
EN Before using your product, read all accompanying safety