Copyright 2010 Philips Consumer Electronics B.V. Eindhoven, The Netherlands.
All rights reserved. No part of this publication may be reproduced, stored in a
retrieval system or transmitted, in any form or by any means, electronic,
mechanical, photocopying, or otherwise without the prior permission of Philips.
.................................................. 1-1 to 1-3
........................................... 5-2
................................................... 7-1 to 7-3
1. Playback Media: CD-R/RW,
DVD+R DL, DVD+R/+RW, DVDR/-RW, Picture CD, USB Digital
Camera (PTP), USB flash drive
2. Picture Compression Format:
JPEG, JPEG digital camera
photos
3. Picture enhancement: Slideshow
with MP3 playback, Create
albums, Rotate, Slideshow with
music playback, Zoom
x
x
x
x
x
x
x
x
1-3
Page 5
Laser Beam Safety Precautions
This DVD player uses a pickup that emits a laser beam.
Do not look directly at the laser beam coming
from the pickup or allow it to strike against your
skin.
The laser beam is emitted from the location shown in the figure. When checking the laser diode, be sure to keep
your eyes at least 30 cm away from the pickup lens when the diode is turned on. Do not look directly at the laser
beam.
CAUTION: Use of controls and adjustments, or doing procedures other than those specified herein, may result in
hazardous radiation exposure.
Drive Mechanism Assembly
Laser Beam Radiation
Laser Pickup
Turntable
Location: Inside Top of DVDmechanism.
2-1
Page 6
Important Safety Precautions
Important
Read and understand all instructions before you use
your home theater. If damage is caused by failure to
follow instructions, the warranty does not apply.
Safety
Risk of electric shock or fire!
•
Never expose the product and
accessories to rain or water. Never place
liquid containers, such as vases, near the
product. If liquids are spilt on or into the
product, disconnect it from the power
outlet immediately. Contact Philips
Consumer Care to have the product
checked before use.
•
Never place the product and accessories
near naked flames or other heat sources,
including direct sunlight.
•
Never insert objects into the ventilation
slots or other openings on the product.
•
Where the mains plug or an appliance
coupler is used as the disconnect device,
the disconnect device shall remain readily
operable.
•
Disconnect the product from the power
outlet before lightning storms.
•
When you disconnect the power cord,
always pull the plug, never the cable.
Risk of short circuit or fire!
•
Before you connect the product to the
power outlet, ensure that the power
voltage matches the value printed on the
back or bottom of the product. Never
connect the product to the power outlet
if the voltage is different.
Risk of injury or damage to the home theater!
For wall-mountable products, use only
•
the supplied wall mount bracket. Secure
the wall mount to a wall that can support
the combined weight of the product
and the wall mount. Koninklijke Philips
Electronics N.V. bears no responsibility
for improper wall mounting that results in
accident, injury or damage.
•
For speakers with stands, use only the
supplied stands. Secure the stands to
the speakers tightly. Place the assembled
stands on flat, level surfaces that can
support the combined weight of the
speaker and stand.
Never place the product or any objects
•
on power cords or on other electrical
equipment.
If the product is transported in
•
temperatures below 5°C, unpack the
product and wait until its temperature
matches room temperature before
connecting it to the power outlet.
Visible and invisible laser radiation when
•
open. Avoid exposure to beam.
Do not touch the disc optical lens inside
•
the disc compartment.
Risk of overheating!
Never install this product in a confined
•
space. Always leave a space of at least
four inches around the product for
ventilation. Ensure curtains or other
objects never cover the ventilation slots
on the product.
Risk of contamination!
Do not mix batteries (old and new or
•
carbon and alkaline, etc.).
Remove batteries if they are exhausted
•
or if the remote control is not to be used
for a long time.
Batteries contain chemical substances,
•
they should be disposed of properly.
Product care
•
Do not insert any objects other than discs
into the disc compartment.
•
Do not insert warped or cracked discs
into the disc compartment.
•
Remove discs from the disc compartment
if you are not using the product for an
extended period of time.
Only use microfiber cloth to clean the
•
product.
3-1
Page 7
Important Safety Precautions
Disposal of your old product and
batteries
Your product is designed and manufactured
with high quality materials and components,
which can be recycled and reused.
When this crossed-out wheeled bin symbol
is attached to a product it means that the
product is covered by the European Directive
2002/96/EC. Please inform yourself about the
local separate collection system for electrical
and electronic products.
Please act according to your local rules and
do not dispose of your old products with your
normal household waste.
Correct disposal of your old product helps to
prevent potential negative consequences for
the environment and human health.
Your product contains batteries covered by
the European Directive 2006/66/EC, which
cannot be disposed with normal household
waste.
Please inform yourself about the local rules
on separate collection of batteries because
correct disposal helps to prevent negative
consequences for the environmental and
human health.
User manual CD
To read the complete user manual, which
includes information on advanced features, use
the CD supplied with your home theater. For
a printed copy of the complete user manual,
contact Philips Consumer Care in your country.
To access the user manual
Caution
The user manual CD is for PC or Mac only. Do
•
not insert the user manual CD into the disc
compartment of the home theater.
Requirements:
•
A PC (Microsoft Windows
compatible) or Mac (OS X) with
CD-ROM
Adobe Reader
•
1 Insert the user manual CD into the CD-
ROM tray of the PC or Mac.
2 Close the CD-ROM tray.
The user manual screen appears. If the
»
user manual screen does not appear,
skip Step 3 and navigate to the ‘pdf’
folder in the CD-ROM, double-clicking
the PDF of your choice.
3 Click a user manual language.
Acrobat Reader launches, displaying
»
the complete user manual in the
language of your choice.
3-2
Page 8
Safety Check after Servicing
Examine the area surrounding the repaired location for damage or deterioration. Observe that screws, parts, and
wires have been returned to their original positions. Afterwards, do the following tests and confirm the specified
values to verify compliance with safety standards.
1. Clearance Distance
When replacing primary circuit components, confirm
specified clearance distance (d) and (d’) between
soldered terminals, and between terminals and
surrounding metallic parts. (See Fig. 1)
Table 1: Ratings for selected area
Chassis or Secondary Conductor
Primary Circuit
AC Line VoltageClearance Distance (d), (d’)
110V~220V≥ 3.2 mm (0.126 inches)
Note:This table is unofficial and for reference only. Be
sure to confirm the precise values.
2. Leakage Current Test
Confirm the specified (or lower) leakage current
between B (earth ground, power cord plug prongs) and
externally exposed accessible parts (RF terminals,
antenna terminals, video and audio input and output
terminals, microphone jacks, earphone jacks, etc.) is
lower than or equal to the specified value in the table
below.
Measuring Method (Power ON):
Insert load Z between B (earth ground, power cord plug
prongs) and exposed accessible parts. Use an AC
voltmeter to measure across the terminals of load Z.
See Fig. 2 and the following table.
d'd
Fig. 1
Exposed Accessible Part
Z
AC Voltmeter
(High Impedance)
Earth Ground
B
Power Cord Plug Prongs
Table 2: Leakage current ratings for selected areas
AC Line VoltageLoad ZLeakage Current (i)Earth Ground (B) to:
110V~220V
Note:This table is unofficial and for reference only. Be sure to confirm the precise values.
0.15 µF CAP. & 1.5 kΩ RES.
Connected in parallel
i ≤ 0.5 mA PeakExposed accessible parts
4-1
Fig. 2
Page 9
CLASS 1
LASER PRODUCT
Safety Information & Warnings
1 Safety Instructions
1.1 General Safety
Safety regulations require that during a repair:
• Connect the unit to the mains via an isolation transformer.
• Replace safety components, indicated by the symbol
only by components identical to the original ones. Any
other component substitution (other than original type)
may increase risk of fire or electrical shock hazard.
Safety regulations require that after a repair, you must return
the unit in its original condition. Pay, in particular, attention to
the following points:
• Route the wires/cables correctly, and fix them with themounted cable clamps.
• Check the insulation of the mains lead for externaldamage.
• Check the electrical DC resistance between the mains
plug and the secondary side:
1. Unplug the mains cord, and connect a wire between
the two pins of the mains plug.
2. Set the mains switch to the ‘on’ position (keep the
mains cord unplugged!).
3. Measure the resistance value between the mains
plug and the front panel, controls, and chassis
bottom.
4. Repair or correct unit when the resistance
measurement is less than 1 MΩ.
5. Verify this, before you return the unit to the customer/
user (ref. UL-standard no. 1492).
6. Switch the unit ‘off’, and remove the wire between the
two pins of the mains plug.
1.2 Laser Safety
This unit employs a laser. Only qualified service personnel
may remove the cover, or attempt to service this device (due
to possible eye injury).
,
2 Warnings
2.1 General
• All ICs and many other semiconductors are susceptible to
electrostatic discharges (ESD,
during repair can reduce life drastically. Make sure that,
during repair, you are at the same potential as the mass
of the set by a wristband with resistance. Keep
components and tools at this same potential.
Available ESD protection equipment:
– Complete kit ESD3 (small tablemat, wristband,
connection box, extension cable and earth cable) 4822 310 10671.
– Wristband tester 4822 344 13999.
• Be careful during measurements in the live voltage
section. The primary side of the power supply, including
the heatsink, carries live mains voltage when you
connect the player to the mains (even when the
player is ‘off’!). It is possible to touch copper tracks and/
or components in this unshielded primary area, when
you service the player. Service personnel must take
precautions to prevent touching this area or components
in this area. A ‘lightning stroke’ and a stripe-marked
printing on the printed wiring board, indicate the primary
side of the power supply.
• Never replace modules, or components, while the unit is
‘on’.
2.2 Laser
• The use of optical instruments with this product, will
increase eye hazard.
• Only qualified service personnel may remove the cover or
attempt to service this device, due to possible eye injury.
• Repair handling should take place as much as possible
with a disc loaded inside the player.
• Text below is placed inside the unit, on the laser cover shield:
). Careless handling
Laser Device Unit
resal rotcudnocimeS : epyT
sAlAaG
Wavelength : 650 nm (DVD)
)DC/DCV( mn 087 :
Output Power : 20 mW
)gnitirw WR+DVD(
Wm 8.0 :
)gnidaer DVD(
Wm 3.0 :
)gnidaer DC/DCV(
Beam divergence : 60 degree
1-2 erugiF
Note: Use of controls or adjustments or performance of
procedure other than those specified herein, may result in
hazardous radiation exposure. Avoid direct exposure to beam.
CAUTION VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN AVOID EXPOSURE TO BEAM
ADVARSEL SYNLIG OG USYNLIG LASERSTRÅLING VED ÅBNING UNDGÅ UDSÆTTELSE FOR STRÅLING
ADVARSEL SYNLIG OG USYNLIG LASERSTRÅLING NÅR DEKSEL ÅPNES UNNGÅ EKSPONERING FOR STRÅLEN
VARNING SYNLIG OCH OSYNLIG LASERSTRÅLNING NÄR DENNA DEL ÄR ÖPPNAD BETRAKTA EJ STRÅLEN
VARO! AVATTAESSA OLET ALTTIINA NÄKYVÄLLE JA NÄKYMÄTTÖMÄLLE LASER SÄTEILYLLE. ÄLÄ KATSO SÄTEESEEN
VORSICHT SICHTBARE UND UNSICHTBARE LASERSTRAHLUNG WENN ABDECKUNG GEÖFFNET NICHT DEM STRAHL AUSSETSEN
DANGER VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN AVOID DIRECT EXPOSURE TO BEAM
ATTENTION RAYONNEMENT LASER VISIBLE ET INVISIBLE EN CAS D’OUVERTURE EXPOSITION DANGEREUSE AU FAISCEAU
Figure 2-2
5-1
Page 10
Instruction on halding ESD protection for DVD loader
2.2 Service Hints
CAUTION
CHARGED CAPACITORS ON THE Decoder BOARD MAY DAMAGE THE DRIVE
ELECTRONICS WHEN CONNECTING A NEW DRIVE.THAT’S WHY, BESIDES THE SAFETY
MEASURES LIKE
• SWITCH OFF POWER SUPPLY
• ESD PROTECTION
ADDITIONAL ACTIONS MUST BE TAKEN BY THE REPAIR TECHNICIAN.
The following steps have to be done when replacing the defective loader :
1. Dismantling of the loader to access the ESD protection point if necessary.
2. Solder the ESD protection point*.
3. Disconnect flexfoil cable from the defective loader.
4. Put a paper clip on the flexfoil to short-circuit the contacts (fig.1)
5. Replace the defective loader with a new loader.
6. Remove paperclip from the flexfoil and connect it to the new loader.
7. Remove solder joint on the ESD protection point.
ATTENTION: The laser diode of this loader is protected against ESD by a solder joint which shortcircuits the laserdiode to ground.
*Only applicable for defective loader needed to be sent back to supplier for failure analysis and to support backcharging evidence.
This is also applicable for all partnership workshops.
For proper functionality of the loader this solder joint must be remove after connection loader to the set.
(ESD protection point is accessible from bottom of the loader)
5-2
Page 11
Standard Notes for Servicing
Circuit Board Indications
1. The output pin of the 3 pin Regulator ICs is
indicated as shown.
Top View
Out
2. For other ICs, pin 1 and every fifth pin are
indicated as shown.
Pin 1
3. The 1st pin of every male connector is indicated as
shown.
Pin 1
Input
In
Bottom View
5
10
Instructions for Connectors
1. When you connect or disconnect the FFC (Flexible
Foil Connector) cable, be sure to first disconnect
the AC cord.
2. FFC (Flexible Foil Connector) cable should be
inserted parallel into the connector, not at an
angle.
FFC Cable
Connector
CBA
* Be careful to avoid a short circuit.
Pb (Lead) Free Solder
When soldering, be sure to use the Pb free solder.
Information about lead-free soldering
Philips CE is producing lead-free sets from 1.1.2005
onwards.
IDENTIFICATION
Regardless of special logo (not always
indicated)
One must treat all sets from
onwards, according to the next rule:
Serial Number gives a 14-digit. Digit 5&6 shows the
YEAR, and digit 7&8 shows the WEEK.
So from onwards=from 1 Jan 2005 onwards
Important note : In fact also products of year 2004
must be treated in this way as long as you avoid
mixing solder-alloys (leaded/ lead-free). So best to
always use SAC305 and the higher temperatures
belong to this.
Due to lead-free technology some rules have to be
respected by the workshop during a repair:
• Use only lead-free solder alloy Philips SAC305 with
order code 0622 149 00106. If lead-free solderpaste is required, please contact the manufacturer
of your solder-equipment. In general use of solderpaste within workshops should be avoided because
paste is not easy to store and to handle.
• Use only adequate solder tools applicable for leadfree solder alloy. The solder tool must be able
• To reach at least a solder-temperature of 400°C,
• To stabilize the adjusted temperature at the solder-
• To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature around
360°C
solder joint. Heating-time of the solder-joint should
not exceed ~ 4 sec. Avoid temperatures above
400°C otherwise wear-out of tips will rise drastically
and flux-fluid will be destroyed. To avoid wear-out of
tips switch off un-used equipment, or reduce heat.
• Mix of lead-free solder alloy / parts with leaded
solder alloy / parts is possible but PHILIPS
recommends strongly to avoid mixed solder alloy
types (leaded and lead-free).
If one cannot avoid or does not know whether
product is lead-free, clean carefully the solder-joint
from old solder alloy and re-solder with new solder
alloy (SAC305).
• Use only original spare-parts listed in the ServiceManuals. Not listed standard-material (commodities)
has to be purchased at external companies.
0501
tip
- 380°C is reached and stabilized at the
1 Jan 2005
6-1
Page 12
Special Information of BGA IC & Flat Pack-IC
•
Special information for BGA-ICs:
- always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for desoldering always use the lead-free temperature
profile, in case of doubt)
- lead free BGA-ICs will be delivered in so-called
'dry-packaging' (sealed pack including a silica gel
pack) to protect the IC against moisture. After
opening, dependent of MSL-level seen on indicatorlabel in the bag, the BGA-IC possibly still has to be
baked dry. (MSL=Moisture Sensitivity Level). This
will be communicated via AYS-website.
Do not re-use BGAs at all.
• For sets produced before 1.1.2005 (except products
of 2004), containing leaded solder-alloy and
components, all needed spare-parts will be available
till the end of the service-period. For repair of such
sets nothing changes.
• On our website
www.atyourservice.ce.Philips.com
information to:
• BGA-de-/soldering (+ baking instructions)
• Heating-profiles of BGAs and other ICs used in
Philips-sets
You will find this and more technical information within
the “magazine”, chapter “workshop news”.
For additional questions please contact your local
repair-helpdesk.
you find more
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:
1. Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
Fig. S-1-1
2. Remove the flat pack-IC with tweezers while
applying the hot air.
3. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
CAUTION:
1. The Flat Pack-IC shape may differ by models. Use
an appropriate hot-air flat pack-IC desoldering
machine, whose shape matches that of the Flat
Pack-IC.
2. Do not supply hot air to the chip parts around the
flat pack-IC for over 6 seconds because damage
to the chip parts may occur. Put masking tape
around the flat pack-IC to protect other parts from
damage. (Fig. S-1-2)
7-1
Page 13
3. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when
removing it.
Hot-air
Flat Pack-IC
Desoldering
CBA
Masking
Tape
Machine
Flat Pack-IC
Tweezers
Fig. S-1-2
With Soldering Iron:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
With Iron Wire:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
2. Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
3. While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the CBA
contact pads as shown in Fig. S-1-5.
4. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
5. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
Note: When using a soldering iron, care must be
taken to ensure that the flat pack-IC is not
being held by glue. When the flat pack-IC is
removed from the CBA, handle it gently
because it may be damaged if force is applied.
Hot Air Blower
Flat Pack-IC
Desoldering Braid
Soldering Iron
Fig. S-1-3
2. Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Sharp
Pin
Fine Tip
Soldering Iron
Fig. S-1-4
To Solid
Mounting Point
CBA
Tweezers
or
Iron Wire
Soldering Iron
Fig. S-1-5
Fine Tip
Soldering Iron
Flat Pack-IC
Fig. S-1-6
3. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
7-2
Page 14
Special Information BGA IC & Flat Pack-IC
2. Installation
1. Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA
so you can install a replacement flat pack-IC more
easily.
2. The “
(See Fig. S-1-7.) Be sure this mark matches the 1
on the PCB when positioning for installation. Then
presolder the four corners of the flat pack-IC. (See
Fig. S-1-8.)
3. Solder all pins of the flat pack-IC. Be sure that
none of the pins have solder bridges.
” mark on the flat pack-IC indicates pin 1.
Example :
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
Fig. S-1-7
Instructions for Handling Semiconductors
Electrostatic breakdown of the semi-conductors may
occur due to a potential difference caused by
electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a grounding band (1 MΩ) that is
properly grounded to remove any static electricity that
may be charged on the body.
2. Ground for Workbench
Be sure to place a conductive sheet or copper plate
with proper grounding (1 MΩ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on
clothing will not escape through the body grounding
band, be careful to avoid contacting semi-conductors
with your clothing.
<Incorrect>
CBA
Presolder
Flat Pack-IC
Fig. S-1-8
<Correct>
1MΩ
CBA
Grounding Band
1MΩ
CBA
Conductive Sheet or
Copper Plate
7-3
Page 15
Direction of Use
*The following excerpt of the DFU/QSG serves as an introduction to the set.
The Complete Direction for Use can be download in different languages from
the internet site of Philips Customer care Center : www.p4c.philips.com
Your home theater
Congratulations on your purchase, and welcome
to Philips! To fully benefit from the support that
Philips offers, register your home theater at www.
philips.com/welcome.
Main unit
aDisplay panel
b +/-
Increases or decreases volume.
cSOURCE
Selects an audio/video source for the home
theater.
d ( Standby-On )
Switches the home theater on or to
standby.
e ( Play/Pause )
Starts, pauses or resumes play.
f ( Stop )
•
Stops play.
In radio mode, erases the current •
preset radio station.
g ( Open/Close )
Opens or closes the disc compartment.
hDisc compartment
Remote control
t
s
r
q
p
o
n
m
a ( Standby-On )
•
Switches the home theater on or to
standby.
When EasyLink is enabled, press
•
and hold for at least three seconds
to switch all connected HDMI CEC
compliant devices to standby.
b OPEN/CLOSE
Opens or closes the disc compartment.
a
b
c
d
e
f
g
h
i
j
k
l
8-1
Page 16
Remote Control
Direction of Use
cSource buttons
•DISC: Switches to disc source.
•USB: Switches to USB storage device.
•RADIO: Switches to FM radio.
•AUDIO SOURCE: Selects an audio
input source.
•DOCK for iPod: Switches to Philips
Dock for iPod/iPhone.
dSETUP
Accesses or exits the setup menu.
e ( Navigation buttons )
•
Navigate menus.
In video mode, press left or right to •
fast backward or fast forward.
In radio mode, press left or right to
•
search a radio station; press up or
down to fine tune a radio frequency.
f INFO
Displays information about what is playing.
gPlayback buttons
Control playback.
hTREBLE /BASS
Changes treble or bass. Use with +/- .
iNumeric buttons
Selects an item to play.
jAUDIO SYNC
•
Selects an audio language or channel.
Press and hold to synchronize audio •
with video. Use with +/-.
kSOUND MODE
Selects a sound mode.
lREPEAT / PROGRAM
•
Selects a repeat or shuffle mode.
In radio mode, programs radio stations.•
m
ZOOM
Zooms into a video scene or picture.
nHDMI / ANGLE
•
Selects video resolution of HDMI
output from the home theater.
Press and hold to select options for
•
different camera angles.
oSUBTITLE
Selects subtitle language for video.
pSURROUND
Switches to surround sound or stereo
sound.
q +/-
Increases or decreases volume.
r ( Mute )
Mutes or restores volume.
s BACK
Returns to a previous menu screen.
tOK
Con? rms an entry or selection.
8-2
Page 17
Direction of Use
emoh ruoy tcennoC
theater
to a TV and other devices. The basic connections
of the home theater with its accessories are
provided in the Quick Start. For a comprehensive
interactive guide, see www.connectivityguide.
philips.com.
etoN
of the product for identi cation and supply
ratings.
Before you make or change any connections,
•
ensure that all devices are disconnected from
the power outlet.
srotcennoC
srotcennoc ediS
retaeht emoh ruoy tcennoc uoy spleh noitces sihT
mottob ro kcab eht ta etalp epyt eht ot refeR •
srotcennoc kcaB
a TO SUBWOOFER
Connects to the supplied subwoofer.
b SPEAKERS
.srekaeps deilppus eht ot stcennoC
c FM ANTENNA
Connects the FM antenna for radio
reception.
d AUX IN
eht no tuptuo oidua golana eht ot stcennoC
TV or an analog device.
e NI LAIXAOC
Connects to the coaxial audio output on
the TV or a digital device.
f VIDEO OUT
Connects to the composite video input on
the TV.
g HDMI OUT
.VT eht no tupni IMDH eht ot stcennoC
a ( USB )
storage device.
b MP3 LINK
Audio input from an MP3 player.
c Dock for iPod
Connects to a Philips Dock for iPod/iPhone.
(Sold separately)
srotcennoc refoowbuS
BSU a morf tupni erutcip ro oediv ,oiduA
a AC MAINS~
.ylppus rewop eht ot stcennoC
b TO MAIN UNIT
eht ot tcennoC TO
SUBWOOFERconnector on the main unit.
8-3
Page 18
Direction of Use
Connect to the TV
Connect your home theater directly to a TV
through one of the following connectors (from
highest to basic quality video):
a HDMI
b Scart
c Composite video
Option 1: Connect to the TV through
HDMI
Note
If the HDTV has a DVI connector, connect •
using an HDMI/DVI adapter.
If the TV supports EasyLink HDMI CEC,
•
control the home theater and TV with one
remote control (see ‘Use Philips EasyLink’ on
page 13 ).
(Cable not supplied)
TV
Option 3: Connect to the TV through
composite video (CVBS)
Note
The composite video cable or connector might •
be labeled AV IN,VIDEO IN,COMPOSITE or
BASEBAND.
TV
Connect audio from TV or
other devices
Use your home theater to play audio from the
TV or other devices such as a cable box.
Tip
Press •AUDIO SOURCE repeatedly to select
the audio output of your connection.
Option 2: Connect to the TV through
Scart
Use the supplied scart adapter.
TV
Option 1: Connect audio through analog
audio cables
(Cable not supplied)
TV
8-4
Page 19
Option 2: Connect audio through coaxial
cable
Note
The digital coaxial cable or connector might be •
labeled COAXIAL/DIGITAL OUT or SPDIF
OUT.
(Cable not supplied)
TV
Connect a Philips Dock for
iPod/iPhone
Direction of Use
(Philips Dock for iPod/iPhone not supplied)
DOCK for iPod
8-5
Page 20
Cabinet Disassembly Instructions
1. Disassembly Flowchart
This flowchart indicates the disassembly steps to gain
access to item(s) to be serviced. When reassembling,
follow the steps in reverse order. Bend, route, and
dress the cables as they were originally.
[1] Back Cabinet
[2] Decoder Board,
AMP Board
[3] DVD Loader Driver,
VFD Display Board,
[4]USB Board,
Ipod Docking Board
[5] DVD Door
2. Disassembly Method
Note:
(1) Identification (location) No. of parts in the figures
(2) Name of the part
(3) Figure Number for reference
(4) Identification of parts to be removed, unhooked,
Switching Regulator (ISR) designed to
meet the on-board power conversion
needs of battery powered or other equipment requiring high efficiency and
small size. This high performance ISR
offers a unique combination of features
combining 87% typical efficiency with
open-collector on/off control and adjustable output voltage.
Quiescent current in the shutdown
mode is typically less than 100µA.
PT Series Suffix
Case/Pin
Configuration
Vertical Through-Hole
Horizontal Through-Hole
Horizontal Surface Mount
PT6310 Series
4—38**V
o +
—±1.0±2.0%V
002001—egnahc daol %05µSec
See Application Notes.
-40—+85°C
-40—+70
—500
—10—G’s
—
(PT1234X)
N
A
C
A0.2—*1.0egnar
kpA—0.5—V5
o
V%5.0±52.0±—egnar
o
o
V%—2±—A0.2 =
o
V%—0.5—toohsrednu/revo
o
%—78—A 0.2 =
zHk008007006segnar
Aµ—001—V51 =
Am—01—V01=
°C
C°521+—04-—
G’s
smarg—5.6———thgieW
15-2
15-2
Page 30
Main Unit -- VFD Display Board Layout Diagram
15-315-3
Page 31
Main Unit -- iPod Terminal, Door Control and USB Board Circuit & Layout Diagam
5
234
1
IPOD
1 5V
2 NC
3 RX
4 GND D
5 AL
6 TX
7 GND A
9 GND
8 AL
8
7
6
9
9P
6 TX
7 GND A
8 AL
9 GND
1 5V
3 RX
2 NC
4 GND D
5 AL
SW301
Touch Switch
35-HTS3220-03A1
1
2
CN301
2P
CN401
4
3
2
1
4P
GND-u
D+
Dvbus
USB
J401
6
GND
5
Shield
4
GND
3
D+
2
D-
1
vbus
16-116-1
Page 32
Main Unit -- AMP Board Circuit Diagram
+27V_IN
CN1
CON2X3P(PH=4.2MM)
2
4
6
4750mA
J5
2
1
CON2.54-2
1
3
5
GNDGND
POW/MUTE
R474.7K
R504.7K
VCC
CB9
0.1uF
MCU5V
2
R308
NC/10K
R452.2K
Q2
2N3904
13
2
R51
47K
R464.7K
R48 4.7K
Q3
13
2N3904
POW/MUTE
J3
2
1
CON2.54-2
TP21
VCC
TP24
CE27
+27V_IN
+
L12 FB/1206
CB8
L13 FB/1206
0.1uF
CE28
CD11/220UF35V/D8H12
CB16
0.1uF
TUO_WSV5UCM
CD263/100UF35V/D8H7
27V_IN
+
CB11
0.1uF
CB12
0.1uF
U5
4
AP1501-5V
FB
21
VOUTVIN
GND
SD
3
5
R39
0R/10K
L11
47uH_3A
+
D1
SK34
12
CE29
CD263/470UF16V/D8H12
ECO_POWER
MUTE
S_MUTE
D2
1N4148
C30
0.1uF
ECO_POWER
12
R575.6K
R605.6K
R63
22K
3
12
3
R6410R
Q4
D965,DIP
Q6
D965,DIP
12
MCU5V
12
D6
1N4001
C29 0.047uF/dilun
+
CE33 220uF/16V
C31 0.1uF
L14
100uH/0.8A
17-1
VF1
VF2
U9
BZ1
1
2
3
4
5
6
1
6
7
2
7
3
8
4
8
9
5
9
D4FR104
2
R53220
R56220
R59100
1
D3
6.2V
D5
27V
CE34
+
220uF/35V
-27V
R61
47K
CE75
SW_IN
CD11X/10UF16V/D4H7
R551M
C28 100pF
+
2
R62
330
13
Q5
2N3904
27V_IN
R54
4.7K
CE32 CD11X/4.7UF16V/D4H7
R58
2.2K
CE35
+
CD11/220UF35V/D8H12
J4
CON2.0-5
+
SW_OUT
27V_IN
SW_IN
GND
MCU5V
ECO_POWER
MUTE
S_MUTE
VF2
1
VF1
2
-27V
3
GND
4
MCU5V
5
27V_IN2
SW_IN2
GND2
MCU5V2
ECO_POWER 2
MUTE2
S_MUTE2
TP26
TP27
TP28
TP29
TP30
17-1
Page 33
Main Unit -- AMP Board Circuit Diagram
ROUT
LOUT
R_OUT
L_OUT
J1
7
6
5
4
3
2
1
CON2.0-7
CE5
2.2UF16V/0603
CE12
2.2UF16V/0603
R211K
R241K
27V_IN
MCU5V
S_MUTE
MUTE
ECO_POWER
GND
ADD2
+
+
2.2UF16V/0603
C11 0.1uF
C13 0.1uF
TP5
TP6
TP7
TP8
TP9
TP11
TP31
OUT_R+
CE1
+
R210K
R3
100K
OUT_L+
CE11
+
2.2UF16V/0603
R1410K
R16
100K
C19 0.068uF
R28
6.8K
R22
6.8K
R29
24k
J2
CON2.0-5
C27
0.047uF
R110K
234
2
3
VSS
CF4558
567
567
R1510K
C12
R2324k
0.068uF
567
81
567
VCC1
CF4558
23VSS
234
ROUT
5
4
LOUT
3
GND
2
SW_IN
1
27V_IN
R35
0R/0805
R36
15K
VREF_FILTER
+
CE24
CD11X/100UF35V/D8H7
CE22.2UF16V/0603
+
27V_4558
R41K
U2
VCC1
CB1
81
0.1uF
R121K
CE13 2.2UF16V/0603
+
C140.47uF/10% /1UF
27V_4558
U4
CB4
0.1uF
C20 0.47uF/10% /1UF
VREF_FILTER
TP32
TP33
TP34
TP35
27V_4558
CE23
+
CHIP CAP EL 100UF-35V M 8*7
R37
15K
OUT_R-
VREF_FILTER
OUT_L-
R_OUT
L_OUT
27V_IN
+
CE4
CD263/470UF35V/D10H16
R5 4.7K
ECO_POWER
+
CE6
R6
47K
47UF
R10 4.7K
MUTE
R11
10K/NC
OUT_L+
OUT_L-
OUT_R+
OUT_R-
HOLE/GND
H4
H2
1
1
HOLE/GND
1
1
2
2
3
3
4
4
5
5
2
2
3
3
4
4
5
5
9
9
8
8
7
7
6
6
9
9
8
8
7
7
6
6
HOLE/GND
H5
H6
1
1
HOLE/GND
1
1
2
2
3
3
4
4
5
5
2
2
3
3
4
4
5
5
9
9
8
8
7
7
6
6
9
9
8
8
7
7
6
6
R314.7K
R324.7K
R174.7K
R184.7K
R19
3.9K
R333.9K
C25
470pF
C9
470pF
R343.9K
SW_IN
LOUT
+
CE9
1u/50V
R309 470
R310 8.2K
C26
470pF
R203.9K
CB17
0.47uF
STANDBY1
MUTE1
CE7CD11X/4.7UF16V/D4H7
CE8CD11X/4.7UF16V/D4H7
C10
470pF
CE18 CD11X/4.7UF16V/D4H7
CE19 CD11X/4.7UF16V/D4H7
+
CE36
10uF
+
CE37
0.047uF
+
+
27V_IN
+
CE17
CD263/470UF35V/D10H16
STANDBY1
MUTE1
+
+
D7 1N60
1
D9
1N60
12
D8 1N60
12
D10
1N60
12
CE10
1uF
CE20
1uF
CE14
1uF
CE21
1uF
CB3
0.1uF
CB6
0.1uF
2
+
CE38
47u/50V
L1 FB/DIP
U1
1
PACCL
2
SD
3
PVCCL
4
MUTE
5
LIN
6
RIN
7
BYPASS
8
GND
9
GND
10
PVCCR
11
VCLAMP
12
PVCCR
CE15
1uF
L6 FB/DIP
U3
1
PACCL
2
SD
3
PVCCL
4
MUTE
5
LIN
6
RIN
7
BYPASS
8
GND
9
GND
10
PVCCR
11
VCLAMP
12
PVCC PGNDR
CE22
1uF
ADD2
R312
CB15
0.1uF
150K
30
30
PGNDL
PGNDL
LOUT
AVCC
AVCC
GAIN0
TPA3123D2
GAIN1
ROUT
PGNDR
PGNDR
30
30
PGNDL
PGNDL
LOUT
AVCC
AVCC
GAIN0
TPA3123D2
GAIN1
ROUT
PGNDR
+
CE3
CD263/470UF35V/D10H16
2526272829
2526272829
24
23
22
21
BSL
20
19
18
17
16
BSR
15
14
13
+
CE16
CD263/470UF35V/D10H16
2526272829
2526272829
24
23
22
21
BSL
20
19
18
17
16
BSR
15
14
13
C1 0.22uF/0805
R8100K
R9100K
C5 0.22uF/0805
CB2
0.1uF
C15 0.22uF/0805
R26100K
R27100K
C21 0.22uF/0805
CB5
0.1uF
Y1
Y2
Y3
Y4
L3 FB/100/5A
C3
220pF
L5 FB/100/5A
C7
220pF
L8 FB/100/5A
C17
220pF
L10 FB/100/5A
C22
220pF
L233UH/3.5A LHP1014
R7
5.6R
C4
1800pF
L4 33UH/3.5A LHP1014
R13
5.6R
C8
1800pF
L7 33UH/3.5A LHP1014
R25
5.6R
C18
1800pF
L9 33UH/3.5A LHP1014
R30
5.6R
C24
1800pF
27V_IN
SW_IN
GND
MCU5V
MUTE
ECO_POWER
S_MUTE
C2
0.47uF/dilun
C6
0.47uF/dilun
C16
0.47uF/dilun
C23
0.47uF/dilun
SPK_ROUT+
SPK_ROUT-
27V_IN1
SW_IN1
GND1
MCU5V1
MUTE1
ECO_POWER 1
S_MUTE1
TP2
TP1
SPK_LOUT+
SPK_LOUT-
TP4
TP3
1
2
3
4
5
6
P2
PRC-101A
1
2
3
4
5
6
P1
PRC-101A
17-2
17-2
Page 34
LS
HS
LS
HS
OSC/RAMP
MUTE
CONTROL
BYPASS
AV
CONTROL
CONTROL
BIAS
THERMAL
SC
DETECT
SC
DETECT
AVDD
AVCC
LIN
RIN
MUTE
BYPASS
GAIN1
GAIN0
SD
BSL
PVCCL
LOUT
PGNDL
VCLAMP
BSR
PVCCR
ROUT
PGNDR
VCLAMP
VCLAMP
AVDD
AVDD
AVDD/2
AVDD
AVDD
AVDD/2
REGULATOR
AGND
+
-
+
-
U1,U3 -- TPA3123D2 IC Specification
TPA3123D2 BLOCK DIAGRAM
PWP (TSSOP) PACKAGE
(TOP VIEW)
SD
NAME
TERMINAL
24-PIN
(PWP)
2I
PVCCL
SD
PVCCL
MUTE
LIN
RIN
BYPASS
AGND
AGND
PVCCR
VCLAMP
PVCCR
1
2
3
4
5
6
7
8
9
10
11
12
Table 1. TERMINAL FUNCTIONS
I/O/PDESCRIPTION
Shutdown signal for IC (low = disabled, high = operational). TTL logic levels with compliance to
AVCC
24
23
22
21
20
19
18
17
16
15
14
13
RIN6IAudio input for right channel
LIN5IAudio input for left channel
GAIN018IGain select least-significant bit. TTL logic levels with compliance to AVCC
GAIN117IGain select most-significant bit. TTL logic levels with compliance to AVCC
MUTE4I
Mute signal for quick disable/enable of outputs (high = outputs switch at 50% duty cycle, low =
outputs enabled). TTL logic levels with compliance to AVCC
BSL21I/OBootstrap I/O for left channel
PVCCL1, 3PPower supply for left-channel H-bridge, not internally connected to PVCCR or AVCC
LOUT22OClass-D 1/2-H-bridge positive output for left channel
PGNDL23, 24PPower ground for left-channel H-bridge
VCLAMP11PInternally generated voltage supply for bootstrap capacitors
BSR16I/OBootstrap I/O for right channel
ROUT15OClass-D 1/2-H-bridge negative output for right channel
PGNDR13, 14PPower ground for right-channel H-bridge.
PVCCR10, 12PPower supply for right-channel H-bridge, not connected to PVCCL or AVCC
AGND9PAnalog ground for digital/analog cells in core
AGND8PAnalog ground for analog cells in core
BYPASS7O
Reference for preamplifier inputs. Nominally equal to AVCC/8. Also controls start-up time via
external capacitor sizing.
AVCC19, 20PHigh-voltage analog power supply. Not internally connected to PVCCR or PVCCL
Thermal padDie padP
Connect to ground. Thermal pad should be soldered down on all applications to properly
BCKI1bpt4mtht5vbit clock input (master or slave)
WSI2bpt4mtht5vword select input (master or slave)
DATAI3iptht5vdigital data input
LOCK4op4mcPLL lock indicator output
SPDIFOUT5op4mcSPDIF output
V
DDE
V
SSE
6vddedigital pad supply voltage
7vssedigital pad ground
DATAO8ops5cdigital data output
WSO9bpt4mtht5vword select output (master or slave)
BCKO10bpt4mtht5vbit clock output (master or slave)
CLK_OUT11op4mcclock output; 256f
V
DDX
12vddcocrystal oscillator and PLL supply voltage
or 384f
s
s
XTALIN13apiocrystal oscillator input
XTALOUT14apiocrystal oscillator output
V
SSX
15vsscocrystal oscillator and PLL ground
RESET16ipthdt5vreset input
MODE017apiomode selection input 0 for static mode or microcontroller mode (grounded
2
for I
C-bus)
MODE118bpts5tht5vmode selection input 1 for static mode or AO address input and output for
microcontroller mode
MODE219bpts5tht5vmode selection input 2 for static mode or U_RDY output for microcontroller
mode
SEL_STATIC20apioselection input for static mode, I
2
C-bus mode or L3-bus mode
SLICER_SEL021bpts5tht5vSPDIF slicer selection input 0 for static mode and USER bit output for
microcontroller mode
SLICER_SEL122bpts5tht5vSPDIF slicer selection input 1 for static mode and AC3 preamble detect
output for microcontroller mode
SPDIF023apioSPDIF input 0
SPDIF124apioSPDIF input 1
SPDIF225apioSPDIF input 2
SPDIF326apioSPDIF input 3
V
V
DDI
SSIS
27vddidigital core supply voltage
28vssisdigital core ground
MP029apiomulti-purpose pin 0: frequency select for static mode, not used for
microcontroller mode
MP130iptht5vmulti-purpose pin 1: SFOR1 for static mode, SCL for I
2
C-bus mode and
L3CLOCK for L3-bus mode
2
MP231iic400kt5vmulti-purpose pin 2: SFOR0 for static mode, SDA for I
C-bus mode and
L3DATA for L3-bus mode
V
ADCP
V
ADCN
SYMBOLPINPAD
32vddcopositive ADC reference voltage
33vssconegative ADC reference voltage
(1)
DESCRIPTION
VINL34apioADC left channel input
V
SSA2
35vsscoADC ground
VINR36apioADC right channel input
V
V
V
DDA2
REF
DDA1
37vddcoADC supply voltage
38apioreferencevoltage for ADC and DAC
39vddcoDAC supply voltage
VOUTL40apioDAC left channel output
V
SSA1
41vsscoDAC ground
VOUTR42apioDAC right channel output
RTCB43ipthdt5vtest control input
MUTE44iipthdt5vDAC mute input
18-8
18-8
Page 44
Main Unit -- Decoder Board Layout Diagram
18-9
18-9
Page 45
Subwoofer -- AMP/Power Board Circuit Diagram
19-1
19-1
Page 46
Subwoofer -- AMP/Power Board Circuit Diagram
IC5
TDA8920CJ
19-219-2
Page 47
IC5: TDA8920 IC Specification
Block Diagram
Pining
handbook, full pagewidth
IN1
IN1+
SGND1
OSC
MODE
SGND2
IN2+
IN2
9
8
11
7
6
2
5
4
V
V
DDA2
3
INPUT
STAGE
MODE
INPUT
STAGE
1
SSA2
V
mute
mute
V
DDA1
10
OSCILLATOR
12
SSA1
PWM
MODULATOR
STABI
MANAGER
PWM
MODULATOR
PROTSTABI
RELEASE1
SWITCH1
ENABLE1
TEMPERATURE SENSOR
CURRENT PROTECTION
ENABLE2
SWITCH2
RELEASE2
1924
V
SSD
HW
CONTROL
AND
HANDSHAKE
CONTROL
AND
HANDSHAKE
V
DRIVER
HIGH
DRIVER
LOW
TDA8920TH
DRIVER
HIGH
DRIVER
LOW
V
DDP2
23431181
SSP1
V
DDP1
V
SSP1
V
DDP2
V
SSP2
SYMBOLPINDESCRIPTION
15
BOOT1
V
SSA2
1negativeanalog supply voltage for
channel 2
SGND22signal ground channel 2
16
OUT1
V
DDA2
IN2
3positive analog supply voltage for
channel 2
4negative audio input for channel 2
IN2+5positive audio input for channel 2
MODE6mode select input
(standby/mute/operating)
OSC7oscillator frequency adjustment or
22
BOOT2
tracking input
IN1+8positive audio input for channel 1
21
OUT2
IN1
V
DDA1
9negative audio input for channel 1
10positive analog supply voltage for
channel 1
SGND111signal ground for channel 1
V
2017
MBL461
SSA1
12negative analog supplyvoltage for
channel 1
PROT13time constant capacitor for
protection delay
V
DDP1
14positive power supply for
channel 1
BOOT115bootstrap capacitor for channel 1
handbook, halfpage
V
SSD
V
DDP2
BOOT2
OUT2
V
SSP2
HW
STABI
V
SSP1
OUT1
BOOT1
V
DDP1
PROT
24
23
22
21
20
19
TDA8920TH
18
17
16
15
14
13
MBL462
1
2
3
4
5
6
7
8
9
10
11
12
V
SSA2
SGND2
V
DDA2
IN2
IN2+
MODE
OSC
IN1+
IN1
V
DDA1
SGND1
V
SSA1
OUT116PWM output from channel 1
V
SSP1
17negative power supply voltage for
channel 1
STABI18decoupling internal stabilizer for
logic supply
HW19handle wafer; must be connected
to pin 24
V
SSP2
20negative power supply voltage for
channel 2
OUT221PWM output from channel 2
BOOT222bootstrap capacitor for channel 2
V
DDP2
23positive power supply voltage for
channel 2
V
SSD
24negative digital supply voltage
(1) Pin 19 should be connected to pin 24 in the application.
Fig.2 Pin configuration.
19-3
19-3
Page 48
Subwoofer -- AMP Power Board Layout Diagram
19-419-4
Page 49
Main Unit -- Exploded View
20-120-1
Page 50
Subwoofer -- Exploded View
For/98version
SUB016
20-2
20-2
Page 51
Packing Exploded View
ACC12-A
ACC12-B
ACC16
ACC8,ACC9,
ACC10,ACC11
ACC12-C
SUB001
ACC12-D
ACC15
Main Unit
ACC1
ACC5
ACC2,ACC3,ACC4
ACC15
ACC12-E
SPKL
ACC12-F
ACC12-G
SPKR
20-3
ACC13
ACC14
20-3
Page 52
Revision List
Version 1.0
* Initial Release
Revision List
21-1
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