Copyright 2013Philips Consumer Electronics B.V. Eindhoven, The Netherlands
All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or
transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise
without the prior permission of Philips.
Published by SL_HF1305 Service Audio Printed in The Netherlands Subject to modification
Dolby Pro-logic Test Disc ....................................4822 395 10216
HANDLING CHIP COMPONENTS
1 - 7
Page 8
GB
A
WARNING
1 - 8
ESD
WAARSCHUWING
NL
ll ICs and many other semi-conductors are
susceptible to electrostatic discharges (ESD).
Careless handling during repair can reduce life
drastically.
When repairing, make sure that you are
connected with the same potential as the mass
of the set via a wrist wrap with resistance.
Keep components and tools also at this
potential.
F
ATTENTION
Tous les IC et beaucoup d’autres
semi-conducteurs sont sensibles aux
décharges statiques (ESD).
Leur longévité pourrait être considérablement
écourtée par le fait qu’aucune précaution n’est
prise à leur manipulation.
Lors de réparations, s’assurer de bien être relié
au même potentiel que la masse de l’appareil et
enfiler le bracelet serti d’une résistance de
sécurité.
Veiller à ce que les composants ainsi que les
outils que l’on utilise soient également à ce
potentiel.
Alle ICs und viele andere Halbleiter sind
empfindlich gegenüber elektrostatischen
Entladungen (ESD).
Unsorgfältige Behandlung im Reparaturfall kan
die Lebensdauer drastisch reduzieren.
Veranlassen Sie, dass Sie im Reparaturfall über
ein Pulsarmband mit Widerstand verbunden
sind mit dem gleichen Potential wie die Masse
des Gerätes.
Bauteile und Hilfsmittel auch auf dieses gleiche
Potential halten.
ESD PROTECTION EQUIPMENT
Alle IC’s en vele andere halfgeleiders zijn
gevoelig voor electrostatische ontladingen
(ESD).
Onzorgvuldig behandelen tijdens reparatie kan
de levensduur drastisch doen verminderen.
Zorg ervoor dat u tijdens reparatie via een
polsband met weerstand verbonden bent met
hetzelfde potentiaal als de massa van het
apparaat.
Houd componenten en hulpmiddelen ook op
ditzelfde potentiaal.
I
AVVERTIMENTO
Tutti IC e parecchi semi-conduttori sono
sensibili alle scariche statiche (ESD).
La loro longevità potrebbe essere fortemente
ridatta in caso di non osservazione della più
grande cauzione alla loro manipolazione.
Durante le riparazioni occorre quindi essere
collegato allo stesso potenziale che quello della
massa dell’apparecchio tramite un braccialetto
a resistenza.
Assicurarsi che i componenti e anche gli utensili
con quali si lavora siano anche a questo
potenziale.
GB
Safety regulations require that the set be restored to its original
condition and that parts which are identical with those specified,
be used.
Safety components are marked by the symbol
!
.
CLASS 1
LASER PRODUCT
NL
Veiligheidsbepalingen vereisen, dat het apparaat bij reparatie in
zijn oorspronkelijke toestand wordt teruggebracht en dat onderdelen,
identiek aan de gespecificeerde, worden toegepast.
De Veiligheidsonderdelen zijn aangeduid met het symbol
!
.
3122 110 03420
F
Les normes de sécurité exigent que l’appareil soit remis à l’état
d’origine et que soient utiliséés les piéces de rechange identiques
à celles spécifiées.
Less composants de sécurité sont marqués
!
.
D
Bei jeder Reparatur sind die geltenden Sicherheitsvorschriften zu
beachten. Der Original zustand des Geräts darf nicht verändert werden;
für Reparaturen sind Original-Ersatzteile zu verwenden.
Sicherheitsbauteile sind durch das Symbol
!
markiert.
I
Le norme di sicurezza esigono che l’apparecchio venga rimesso
nelle condizioni originali e che siano utilizzati i pezzi di ricambio
identici a quelli specificati.
Componenty di sicurezza sono marcati con
!
.
GB
After servicing and before returning set to customer perform a leakage
current measurement test from all exposed metal parts to earth ground
to assure no shock hazard exist, The leakage current must not
exceed 0.5mA.
GB
Warning !
Invisible laser radiation when open.
Avoid direct exposure to beam.
S
Varning !
Osynlig laserstrålning när apparaten är öppnad och spärren
är urkopplad. Betrakta ej strålen.
Varoitus !
SF
Avatussa laitteessa ja suojalukituksen ohitettaessa olet alttiina
näkymättömälle laserisäteilylle. Älä katso säteeseen!
DK Advarse !
Usynlig laserstråling ved åbning når sikkerhedsafbrydere er
ude af funktion. Undgå udsaettelse for stråling.
F
"Pour votre sécurité, ces documents doivent être utilisés par
des spécialistes agréés, seuls habilités à réparer votre
appareil en panne".
Page 9
Pb(Lead) Free Solder
When soldering , be sure to use the pb free solder.
INDENTIFICATION:
Regardless of special logo (not always indicated)
onemust treatall setsfrom 1 Jan 2005 onwards,according
next rules:
Important note: In fact also products of year 2004 must
be treated in this way as long as you avoid mixing solderalloys (leaded/ lead-free). So best to always use SAC305
and the higher temperatures belong to this.
Due to lead-free technology some rules have to be
respected by the workshop during a repair:
• Use only lead-free solder alloy Philips SAC305 with
order code 0622 149 00106. If lead-free solder-paste
is required, please contact the manufacturer of your
solder-equipment. In general use of solder-paste
within workshops should be avoided because paste is
not easy to store and to handle.
• Use only adequate solder tools applicable for lead-
free solder alloy. The solder tool must be able
– To reach at least a solder-temperature of 400@C,
– To stabilize the adjusted temperature at the solder-
tip
– To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature around
360@C – 380@C is reached and stabilized at the solder
joint. Heating-time of the solder-joint should not exceed
~ 4 sec. Avoid temperatures above 400@C otherwise
wear-out of tips will rise drastically and flux-fluid will
be destroyed. To avoid wear-out of tips switch off unused equipment, or reduce heat.
• Mix of lead-free solder alloy / parts with leaded solder
alloy / parts is possible but PHILIPS recommends
strongly to avoid mixed solder alloy types (leaded and
lead-free).
If one cannot avoid or does not know whether product
is lead-free, clean carefully the solder-joint from old
solder alloy and re-solder with new solder alloy
(SAC305).
• Use only original spare-parts listed in the Service-
Manuals. Not listed standard-material (commodities)
has to be purchased at external companies.
• Special information for BGA-ICs:
– Always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for desoldering always use the lead-free temperature profile,
in case of doubt)
– Lead free BGA-ICs will be delivered in so-called ‘dry-
packaging’ (sealed pack including a silica gel pack) to
protect the IC against moisture. After opening,
1 - 9
dependent of MSL-level seen on indicator-label in the
bag, the BGA-IC possibly still has to be baked dry.
(MSL=Moisture Sensitivity Level). This will be
communicated via AYS-website.
Do not re-use BGAs at all.
•For sets produced before 1.1.2005 (except products
of 2004), containing leaded solder-alloy and
components, all needed spare-parts will be available
till the end of the service-period. For repair of such
sets nothing changes.
• On our website www.atyourservice.ce.Philips.com
you find more information to:
• BGA-de-/soldering (+ baking instructions)
• Heating-profiles of BGAs and other ICs used in
Philips-sets
You will find this and more technical information
within the “magazine”, chapter “workshop news”.
For additional questions please contact your local
repair-helpdesk.
Page 10
2 - 12 - 1
Software upgrade & Procedure to restore product setting
1)Restore factory setting
a) Press “ ” <Home> button on R/C.
b) Select <SETUP>, then press “OK” button on R/C.
c) Select <Advanced>.
d) Select <Restore default settings>,then press <OK> to confirm.
2)Password change
a) Press “
” <Home> button on R/C.
b) Select <SETUP>, then press “OK” button on R/C.
c) Select <preference>.
d) Select <Change Password> <Confirm>, then press <OK> button
on R/C.
“0000” is default password supplied.
3)Trade mode
a) In open model,press “
” <Home> button on R/C.
b) Press “2” “5” “9” on R/C,VFD will display “TRA ON” or “TRA
OFF”.
4)Check software version
a) Press “
” <Home> button on R/C
b) Select <Setup>, then press <OK> button on R/C.
c) Select <Advanced Setup> <Version information>,then press
<OK> button on R/C.
d) TV will show message as follow:
Model:HTB7250D/12
Versions
System SW:X.XX.XXX
Subsystem SW:XX-XX-XX-XX
Wireless(Wi-Fi):XX:XX:XX:XX:XX:XX
Extended unique Identifier(EUI64):0025d1fffeof3c15
PRODUCT ID:A5UDJSCREQVGSCG5
For information,frequently asked questions and
software updates,please visit
www.philips.com/support
Close
e) press <OK> button to exit .
5) Upgrading new software
Method 1: Update software from a USB storage device
a) Create a folder named “UPG” in your USB storage device, and
Copy the latest upgrading software into the folder.
b) Connect the USB storage device to the home theater.
c) Press “
” <Home> button on R/C, and select <Setup>.
d) Select <Advanced> <Software Update> <USB>.
e)Follow the onscreen instructions to confirm the update.
»» Update process takes about 5 minutes to complete.
»» Once complete, the home theater automatically switches off and
restarts.If it does not, disconnect the powercord for a few seconds
and then reconnect it.
Method 2: Update software from the internet
Note: To check for new updates, compare the current software
version of your home theater with the latest software version (if
available) on the Philips web site, and for BD-Live application and
software update, make sure that the network router has access to
the Internet and the firewall is disabled.
a) The “LAN” jack at the back panel of the set must be connect to
the network router via network cable and the set connect to TV,
Prepare the connection as shown follow:
/NI IMDH
CRA IMDH
b) Press “
” <Home> button on R/C, and select <Setup>.
c) Select <Advanced> <Software Update> <Network>.
»» If an upgrade media is detected, you are prompted to start or
cancel the update.
»» Downloading of the upgrading file maytake long, depending on
your home network condition.
5 Follow the onscreen instructions to confirm the update.
»» Update process takes about 5 minutes to complete.
»» Once complete, the home theater automatically switches off and
restarts.If it does not, disconnect the powercord for a few seconds
and then reconnect it.
LAN
6)How to replace the defective Blu-ray Loader
a) Remove the defective Blu-ray Loader.
b) Remove the shield cover at the top of Blu-ray Loader as shown
7) Update the onscreen help
If the current version of the onscreen help is lower than the latest
version available on www.philips.com/support, download and install
below:
i) Loosen 5 screws on the top of Blu-ray Loader as shown in
figure1
the latest onscreen help.
* A USB flash drive that is FAT or NTFS formatted, with at least
35MB of memory. Do not use a USB hard drive.
* A computer with internet access.
A
* An archive utility that supports the ZIP file format
a) Connect a USB flash drive to your computer.
b) In your web browser, go to www.philips.com/support.
c) At the philips support website, find your product and click on User
Figure 1
c) Assembly Blu-ray Loader to “J800”,”J900”,”J901” on the top of BD
Board as shown below.
manuals, and then locate the User Manual Upgrade Software. (The
help update is available as a zip file).
d) Save the zip file in the root directory of your USB flash drive.
e) Use the archive utility to extract the help update file in the root
directory. (A file named “HTSXXXXeDFU.zip” is extracted under the
UPG folder of your USB flash drive, “xxxx” being the model number
of your home theater.)
f) Disconnect the USB flash drive from your computer.
Caution: Do not switch off the home theater or remove the USB
J900
J901
J800
d) Remove soldered joint on the ESD protection points.
flash dirve during the update.
g) Connect the USB flash drive containing the downloaded file to
your home theater. (Make sure that no disc is loaded inside the disc
compartment)
The ESD Protection points
on the top of board
h) Press “
” <Home> button on R/C.
i) Enter 338 on the remote control.
Bottom side view of OPU
Note: The ESD protection points must be soldered if
www
o the Blu-ray Loader is OK and needs to be disconnected from
connector J800, J900 and J901 of the BD Board.
o the defective Blu-ray Loader is needed to be send back to
supplier for failure analysis and to support backcharging evidence.
j) Follow the onscreen instructions to confirm the update.
k) Disconnect the USB flash drive from the home theater.
CAUTION!
This information is confi dential and may not be
distributed.Only a qualifi ed service person should
reprogram the Region Code.
Note:In some service positions the components or copper patterns of one board may risk touching its
neighbouring pc boards or metallic parts. To prevent such short-circuit use a piece of hard paper or
other insulating material between them.
Dismantling of the VFD Board
1) Loosen 1 screws “D” on the top of VFD Board as shown in gure 4.
Dismantling of the Top Cover
1) Loosen 1 screw “A” at the back panel to remove the top cover as shown in gure 1.
A
Figure 1
Dismantling of the BT Board
1) Loosen 2 screws “B” on the top of BT board as shown in gure 2.
D
Figure 4
Dismantling of the DVD Module
1) Loosen 5 screws “E” at the DVD Module as shown in gure 5.
E
B
Figure 2
Dismantling of the TOUCH Board
1) Loosen 3 screws “C” at the bracket of Touch Board as shown in gure.
C
Figure 5
Dismantling of the MP3 &USB &SENSOR Board
1) Loosen 3 screws “F” on the top of MP3&USB Board as shown in gure 6.
2) Loosen 2 screws “G” on the top of SENSOR Board as shown in gure 7.
G
F
Figure 3
Figure 7
Figure 6
Page 14
Dismantling of the BD Board
1) Loosen 4 screws “H” on the top of BD Board as shown in gure 8.
2) Loosen 1screw “I” at the back panel as shown in gure 9.
H
Figure 8
3 - 23 - 2
K
Figure 11
SERVICE POSITIONS (MAIN UNIT)
Service Position A - MAIN&BD Board
Figure 9
Dismantling of the MAIN Board
1) Loosen 6 screws “J” on the top of main board as shown in gure 10.
2) Loosen 2 screws “K” at the back panel as shown in gure 11
J
I
Service Position E - All Boards
Figure 10
Page 15
3 - 33 - 3
DISASSEMBLY INSTRUCTIONS-SUBWOOFER
Dismantling of the Subwoofer Rear Panel
1) Loosen 9 screws “Q” at the subwoofer rear panel as shown in gure 17.
Q
Dismantling of the Subwoofer AMP Board
1) Loosen 4 screws “S” on the top of subwoofer AMP board as shown in gure 19.
S
Figure 19
Figure 17
Dismantling of the Power Board
1) Loosen 5 screws “R” on the top of power board as shown in gure 18.
SERVICE POSITIONS (SUBWOOFER)
R
Figure 18
Page 16
3 - 13 - 1
DISASSEMBLY INSTRUCTIONS-MAIN UNIT
Note:In some service positions the components or copper patterns of one board may risk touching its
neighbouring pc boards or metallic parts. To prevent such short-circuit use a piece of hard paper or
other insulating material between them.
Dismantling of the VFD Board
1) Loosen 1 screws “D” on the top of VFD Board as shown in gure 4.
Dismantling of the Top Cover
1) Loosen 1 screw “A” at the back panel to remove the top cover as shown in gure 1.
A
Figure 1
Dismantling of the BT Board
1) Loosen 2 screws “B” on the top of BT board as shown in gure 2.
D
Figure 4
Dismantling of the DVD Module
1) Loosen 5 screws “E” at the DVD Module as shown in gure 5.
E
B
Figure 2
Dismantling of the TOUCH Board
1) Loosen 3 screws “C” at the bracket of Touch Board as shown in gure.
C
Figure 5
Dismantling of the MP3 &USB &SENSOR Board
1) Loosen 3 screws “F” on the top of MP3&USB Board as shown in gure 6.
2) Loosen 2 screws “G” on the top of SENSOR Board as shown in gure 7.
G
F
Figure 3
Figure 7
Figure 6
Page 17
Dismantling of the BD Board
1) Loosen 4 screws “H” on the top of BD Board as shown in gure 8.
2) Loosen 1screw “I” at the back panel as shown in gure 9.
H
Figure 8
3 - 23 - 2
K
Figure 11
SERVICE POSITIONS (MAIN UNIT)
Service Position A - MAIN&BD Board
Figure 9
Dismantling of the MAIN Board
1) Loosen 6 screws “J” on the top of main board as shown in gure 10.
2) Loosen 2 screws “K” at the back panel as shown in gure 11
J
I
Service Position E - All Boards
Figure 10
Page 18
3 - 33 - 3
DISASSEMBLY INSTRUCTIONS-SUBWOOFER
Dismantling of the Subwoofer Rear Panel
1) Loosen 9 screws “Q” at the subwoofer rear panel as shown in gure 17.
Q
Dismantling of the Subwoofer AMP Board
1) Loosen 4 screws “S” on the top of subwoofer AMP board as shown in gure 19.
S
Figure 19
Figure 17
Dismantling of the Power Board
1) Loosen 5 screws “R” on the top of power board as shown in gure 18.
SERVICE POSITIONS (SUBWOOFER)
R
Figure 18
Page 19
BLOCK DIAGRAM
4 - 14 - 1
BD OPU Sanyo TRV-415H09
Walleywood loader Loader
RJ-45
Ethernet
BRAND: ALPHA
WiFi Module
Model Number: WUS-N18M
(Ralink RT3370)
USB 2.0
Audio/Karaoke DAO
slot Loader
TPIC2050
Motor driver
Build in(integrated)
USB cable
+5V/1.0A
+5V/1.0A
USB1 Front
RF
Connector
USB2
Current pr otect
TPS2553
Current protect
TPS2553
Audio/Karaoke DAO
CEC
HDMI
HDMI IN + MPEG BOARD
SERVO
BD HDMI1
EP94M3 CTL I2C
DDR3
128MB 2pcs
DDR3
256MB 1pcs
NADN Flash
256MB
BD Backend
MT8580BDAG
H_I2S
BD-MCLK
BD I2S
SPF-MCLK
I2C
Audio I2S
MCLK
IR
INT
I2C
UART
HDMI Out
Write
EDID AT24C02
Serial EEP ROM
Read
iPOD
Implementation
MFI337S3959
ESD Protect
x 2pcs
BK5V
BK5V
+12V
+5V
CEM8311/AO4813
(7.0A MOSFET SW IC)
HDMI1 Out
LDO Reg.
LM1117-33
LDO Reg.
LM1117-33
H/L Power SW control
DC TO DC
TPS54418RE
DC TO DC
G5627F11U
WB1542
DC/DC
LM1117-3.3V
LDO
HD1V8
HD3V3
Motor driver
+12V (1.3A)
+5V
Motor driv er
1.2V
(3.5A)
1.5V
(2.0A)
USB/WiFI
3.3V(1.0A)
3.3V(0.3A)
UART
LM1117-ADJ
LM1117-1.2V
LM1117-1.8V
Debug1
Debug2
Debug3
Debug4
Debug5
GND
+3.3V
For MCU Debug
+3.3V
TX
RX
SW-Upgrade
LDO
LDO
LDO
CEC
9V
TO OPU
1.2V
(0.3A)
1.8V
To video ADC
0R Jump
(Simple)
Powre down
0R Jump
(Advance)
PWR/STBY
UART1
AT24C02
EEPROM
UART2
DE-PWR
EP94M3 CTL I2C
IR
IR
Transistor
PWM port
8 - Char Only THB72XX
LCD Display Only THB9245
13-Char Only THB92XX
AC(to VFD)
VFD DRIVER
STM32F100VC
256K FLASH,16K SRAM
UI-User Input ( Key/IR)
VFD display
D-AMP control
CEC Player
CEC Audio System
Tuner/RDS control
VFD Display
PT6311
7 KEY
LED x 1 only STB for HTB72XX
LED x 7 for HTB92XX
Touch PAD IC
eKT4701
I2C
Tuner Pack
MP3/Mic Delect
DC port
Diode
and R.C
PWM pin
Transistor
FAN Control
CTL IO BT
Display Unit Part
White LED
Only THB92XX
Tuner Audio
From spk output
Fan
HDMI3 IN
EDID AT24C02
Serial EEP ROM
EDID AT24C02
Serial EEP ROM
For HTB72xx
MAIN BOARD
COAXIAL
OPTICAL
Blutooth module
BM84
Audio/Karaoke DAO
Tuner Audio
AUX-IN
MP3/Mic Detect
MP3/Mic
ESD Protect
For HTB92xx
CTL IO BT
BT Audio
AUX in
IC 4558
MP3 in
x 2pcs
MIC in
I2C
CS8422
SPDIF Rx
CS5346
MUX+ADC
Switch
EP94M3
HDMI SPDIF IN(ARC)
BD-MCLK
SPF-MCLK
I2C
SCLK
LRCK
MCLK
3.3V
LDO Reg.
LM1117-33
5V
LDO Reg.
LM1117-33
Mic Mono Jack
Provision Mic for 93/98 version
BD-MCLK
I2C
Mic
SPF-MCLK
BD I2S
1.8V
3.3V
I2C
Audio I2S
H_I2S
MCLK
+32.5V
GND
+15V
GND
BK9V
Reset
S-PWM
S-GND
DE-PWR
STBY
3M 14pin cable
10pin connector
HDMI SPDIF IN(ARC)
H-I2S
+32.5V
(wire #24)
+32.5V
(wire #24)
GND
(wire #24)
GND
(wire #24)
+15V
(wire #24)
+15V
(wire #24)
GND
(wire #24)
GND
(wire #24)
(wire #24)
BK9V
Reset
(wire #28)
S-PWM
(wire #28)
S-GND
(wire #28)
(wire #28)
DE-PWR
(wire #28)
STBY
I2C
PWM IN
+15V
Transistor
MCLK
Buffer
74HC04
+12V
Subwoofer Unit Part
TAS5538
D-AMP PWM
TAS5612
AMP
Fan
VOLUME
FAN CTRL
SUB SPK
180W(10%)
230W(30%)
I2C
TAS5612A
PWR AMP
+-
EP94M3 I2C
DDCTX-I2C
EP94M3-RST
TXHPD To MT8580 HDMI IN
DDCTX-I2C To MT8580 HDMI IN
SRR/SRL
RR/RL
FL
FL
FR/FL
135W
OUTPUT 30% 270W
C/SUB
RR/RL
5
FR/FL
SPK (ohm)
3
SUB
RX5V(H1/2/3)
TO-EP94M3
Subwoofer PSU
Power consumption < 0.5W
PSU
EP94M3-INT
RXHPD(H1/2/3)
STBY
DE-PWR
+33V
+33V
+12V
+12V
BK5V
For HTB92xx
For HTB72xx
Page 20
WIRING DIAGRAM
4 - 24 - 2
AC SOCKET
CN901
SV1
SV2
V2
V10
V5
V3
V4
V1
Page 21
5 - 15 - 1
IC304 INTERNAL IC DIAGRAM - CS5346 CQZ
MAIN+VFD+SUB+USB+MP3+SENSOR+BT BOARD
TABLE OF CONTENTS
Internal IC Diagram ...........................................................................5-1