• Connect the unit to the mains via an isolation transformer.
• Replace safety components, indicated by the symbol
,
only by components identical to the original ones. Any
other component substitution (other than original type)
may increase risk of fire or electrical shock hazard.
Safety regulations require that after a repair, you must return
the unit in its original condition. Pay, in particular, attention to
the following points:
• Route the wires/cables correctly, and fix them with the
mounted cable clamps.
• Check the insulation of the mains lead for external
damage.
• Check the electrical DC resistance between the mains
plug and the secondary side:
1. Unplug the mains cord, and connect a wire between
the two pins of the mains plug.
2. Set the mains switch to the ‘on’ position (keep the
mains cord unplugged!).
3. Measure the resistance value between the mains
plug and the front panel, controls, and chassis
bottom.
4. Repair or correct unit when the resistance
measurement is less than 1 MΩ.
5. Verify this, before you return the unit to the customer/
user (ref. UL-standard no. 1492).
6. Switch the unit ‘off’, and remove the wire between the
two pins of the mains plug.
2.1.2 Laser Safety
This unit employs a laser. Only qualified service personnel
may remove the cover, or attempt to service this device (due
to possible eye injury).
Note: Use of controls or adjustments or performance of
procedure other than those specified herein, may result in
hazardous radiation exposure. Avoid direct exposure to beam.
2.2 Warnings
2.2.1 General
• All ICs and many other semiconductors are susceptible
to electrostatic discharges (ESD,
). Careless handling
during repair can reduce life drastically. Make sure that,
during repair, you are at the same potential as the mass
of the set by a wristband with resistance. Keep
components and tools at this same potential.
Available ESD protection equipment:
– Complete kit ESD3 (small tablemat, wristband,
connection box, extension cable and earth cable)
4822 310 10671.
– Wristband tester 4822 344 13999.
• Be careful during measurements in the live voltage
section. The primary side of the power supply, including
the heatsink, carries live mains voltage when you
connect the player to the mains (even when the
player is ‘off’!). It is possible to touch copper tracks and/
or components in this unshielded primary area, when
you service the player. Service personnel must take
precautions to prevent touching this area or components
in this area. A ‘lightning stroke’ and a stripe-marked
printing on the printed wiring board, indicate the primary
side of the power supply.
• Never replace modules, or components, while the unit is
‘on’.
2.2.2 Laser
• The use of optical instruments with this product, will
increase eye hazard.
• Only qualified service personnel may remove the cover or
attempt to service this device, due to possible eye injury.
• Repair handling should take place as much as possible
with a disc loaded inside the player.
• Text below is placed inside the unit, on the laser cover
shield:
Figure 2-2
2. Safety Information, General Notes & Lead Free Requirements
CAUTION VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN AVOID EXPOSURE TO BEAM
ADVARSEL
SYNLIG OG USYNLIG LASERSTRÅLING VED ÅBNING UNDGÅ UDSÆTTELSE FOR STRÅLING
ADVARSEL SYNLIG OG USYNLIG LASERSTRÅLING NÅR DEKSEL ÅPNES UNNGÅ EKSPONERING FOR STRÅLEN
VARNING SYNLIG OCH OSYNLIG LASERSTRÅLNING NÄR DENNA DEL ÄR ÖPPNAD BETRAKTA EJ STRÅLEN
VARO! AVATTAESSA OLET ALTTIINA NÄKYVÄLLE JA NÄKYMÄTTÖMÄLLE LASER SÄTEILYLLE. ÄLÄ KATSO SÄTEESEEN
VORSICHT SICHTBARE UND UNSICHTBARE LASERSTRAHLUNG WENN ABDECKUNG GEÖFFNET NICHT DEM STRAHL AUSSETSEN
DANGER VISIBLE AND INVISIBLE LASER RADIATION WHEN OPEN AVOID DIRECT EXPOSURE TO BEAM
ATTENTION RAYONNEMENT LASER VISIBLE ET INVISIBLE EN CAS D’OUVERTURE EXPOSITION DANGEREUSE AU FAISCEAU
2.3 Lead Free Requirement
Information about Lead-free produced sets
Philips CE is starting production of lead-free sets from
1.1.2005 onwards.
INDENTIFICATION:
Regardless of special logo (not always indicated)
One must treat all sets from
1 Jan 2005 onwards, according
next rules.
Example S/N:
Bottom line of typeplate gives a 14-digit S/N. Digit 5&6 is the year, digit 7&8 is
the week number, so in this case 1991 wk 18
So from 0501 onwards = from 1 Jan 2005 onwards
Important note: In fact also products of year 2004 must be treated in this way as long as you
avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher
temperatures belong to this.
Due to lead-free technology some rules have to be respected by the
workshop during a repair:
• Use only lead-free solder alloy Philips SAC305 with order
code 0622 149 00106. If lead-free solder-pate is required,
please contact the manufacturer of your solder-equipment.
In general use of solder-paste within workshops should be
avoided because paste is not easy to store and to handle.
•
Use only adequate solder tools applicable for lead-free
solder alloy. The solder tool must be able
o To reach at least a solder-temperature of 400°C,
o To stabilize the adjusted temperature at the solder-tip
o To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature around 360°C
– 380°C is reached and stabilized at the solder joint.
Heating-time of the solder-joint should not exceed ~ 4 sec.
Avoid temperatures above 400°C otherwise wear-out of
tips will rise drastically and flux-fluid will be destroyed. To
avoid wear-out of tips switch off un-used equipment, or
reduce heat.
• Mix of lead-free solder alloy / parts with leaded solder alloy
/ parts is possible but PHILIPS recommends strongly to
avoid mixed solder alloy types (leaded and lead-free).
If one cannot avoid or does not know whether product is
lead-free, clean carefully the solder-joint from old solder
alloy and re-solder with new solder alloy (SAC305).
• Use only original spare-parts listed in the Service-Manuals.
Not listed standard-material (commodities) has to be
purchased at external companies.
• Special information for BGA-ICs:
- always use the 12nc-recognizable soldering temperature
profile of the specific BGA (for de-soldering always use the
lead-free temperature profile, in case of doubt)
- lead free BGA-ICs will be delivered in so-called ‘drypackaging’ (sealed pack including a silica gel pack) to
protect the IC against moisture. After opening, dependent
of MSL-level seen on indicator-label in the bag, the
BGA-IC possibly still has to be baked dry. (MSL=Moisture
Sensitivity Level). This will be communicated via AYSwebsite.
Do not re-use BGAs at all.
•
For sets produced before 1.1.2005 (except products of
2004), containing leaded solder-alloy and components,
all needed spare-parts will be available till the end of the
service-period. For repair of such sets nothing changes.
•
On our website www.atyourservice.ce.Philips.com you
find more information to:
BGA-de-/soldering (+ baking instructions)
Heating-profiles of BGAs and other ICs used in Philips-sets
You will find this and more technical information within the
“magazine”, chapter “workshop news”.
For additional questions please contact your local repair-helpdesk.
1. Firmware Upgrading
1.1. Preparation to upgrade firmware
• Download the latest software release package.
• Extract the files from ZIP archive (Do not rename the filename).
• Start the CD Burning Software and create a new CD project (data disc) with the following settings:
• File System: Joliet
• Format: MODE 1
• Recording Mode: SINGLE SESSION (TRACK-AT-ONCE), FINALIZE CD
Note: Long file name is necessary for the preparation of the upgrade disc.
• Place the extracted file into the root directory of the new CD project.
• Burn the data onto the CDRs or CD-RWs.
Notes: Burn ALL the extracted files onto a single blank CD-R or CD-RW disc for firmware upgrade
1.2. Procedures to apply the System Software Upgrade and Loader Software Upgrade
There are 2 upgrade processes supported:
- Normal Upgrade (Software Downgrade is NOT possible) and
- Forced Download (Software Downgrade is possible).
1.2.1. Normal Upgrade (All existing settings will remain the same after software upgrade)
• For normal upgrading, power up the set, open the tray, insert the upgrade disc, close the tray and follow
the on screen instructions.
• VFD will show “ VERIFY -> ERASE -> UPGRADE ”.
• After upgrading the set, the Disc will be ejected.
• Remove the disc and close the tray.
• Then the set will go to standby.
• Waking up again from standby, the set will reboot from upgraded flash.
1.2.2. Forced Upgrade(All the settings will be reset to default /58 version)
Notes: After Forced Upgrade, the procedures described in 1.4 must be proceeded to restore the stroke version.
• Press and Hold Rec key on front Panel.
• Power ONthe set
• VFD will show “FRC DWLD”
• Open the tray and insert the upgrade disc.
• Close the tray and the sets will start upgrading:-VFD will show “ VERIFY -> ERASE -> UPGRADE ”
• After upgrading the set, the Disc will be ejected.
• Disc tray remains open for 5 minutes and closes after time out without user action. Or, if the tray is closed
by the user, then the set goes to standby and boots from upgraded flash. (Time out of 5 mins or user
action, whichever is earlier, causes the set to go to standby.)
Note: Do not press any buttons or interrupt the mains supply during the upgrading process, otherwise the set
may become defective.
1.3. How to read out the firmware version to confirm set has been upgraded
• Press “HOME” button on remote control and navigate to Settings -> Setup -> Version Info.
• Press the blue button on remote control for OSD to display the Detail Version Info:
• Figure 1 shows the version info displayed by DVDR5500 EU running 49.0a backend software and drive
It is important to restore the Dynamic Stroke version of the set before returning the repaired set back to the
customer. Restoring this stroke version will ensure that the set is correctly set for the region.
Recorders are configured to a desired stroke version by entering a pre-defined RC key sequence.
The RC key sequence is made up of 2 parts: <XXXX> + <YY>, where <XXXX> refers to a platform and <YY>
refers to the stroke version. Follow the steps below to change dynamic stroke versions:
• Close DVD tray with no disc
• Make sure the OSD to display the home menu.
• Enter the following RC sequence:
• <5> <5> <0> <0> <0> <5> <OK> for /05
• <5> <5> <0> <0> <3> <1> <OK> for /31
• <5> <5> <0> <0> <5> <8> <OK> for /58
• While entering the RC sequence, the VFD will display the entered keys
• The VFD will display “WRNGSTRK” if the incorrect sequence is entered.
• If the correct RC sequence is entered and <OK> is pressed the VFD will dispaly “STROKEYY”
• Press standby button to go to standby mode or power off the mains to complete the process
Note:It is essential to standby or power off the set for the stroke version restoration to take effect. The set will
then start in the Virgin Mode.
1. Mechanical Instructions
Note: The position numbers given here refers to the Exploded view in chapter 8.
1.1. Dismantling of the DVD Tray cover manually
1) Insert a screwdriver into the slot provided at the bottom of the set and push in the direction as shown in
Figure1 to unlock before sliding the Tray cover 110 out.
Figure 1- unlock the tray loader
2) Remove the Tray cover 110 as shown in Figure 2.
Figure 2 - remove the tray cover
1.2. Dismantling of the Front Panel
1) Remove 7 screws to loosen Top cover 240.
2) Remove the screws to detach the Front Panel and loosen the Front Loader Plate190 as shown in Figure 3.
The Front Panel Service Position as shown in Figure 4.
Figure 3 - detach the front panel
Front Panel
Insulation Sheet
Figure 4 - Front Panel Service Position
1.3. Dismantling of the Basic Engine
1) To dismantle the Basic Engine without interference, it is necessary to detach the Front Panel together with
the Plate Front Loader. Remove 4 mounting screw as shown in Figure 5 to detach the Basic Engine
Assembly 1004 from the Frame 162.
Figure 5 - Basic Engine mounting screw
2) Flip the Basic Engine over to remove 4 screws from the PCB protection plate. Service Position of the Basic
Engine is shown in Figure 6.
Insulation
Sheet
Figure 6 - Basic Engine Service Position
1.4. Dismantling of the PSU Board
1) Remove 3 screws and detach the PSU Board 1005as shown in Figure 7.
Figure 7 - PSU remove mounting screws
2) Service position for PSU Board is given in Figure 8.
Insulation
Sheet
Figure 8 - PSU Board Service Position
1.5. Dismantling of the Digital Board
1) Remove 5 screws to loosen the Digital Board 1002 as shown in Figure 9.
Figure 9 - Remove mounting screws for Digital Board
2) It is necessary to detach the Front Panel for Digital Board Service Position as shown in Figure 10.
Insulation Sheet
Figure 10 - Digital Board Service Position
1.6. Dismantling of the Analog Board
1) Remove screws from the Back Plate 230 to detach Analogue Board 1001.
Service position for Analogue Board is given in Figure 13.
Notes: Beware of short cable connections from the Analog Board to the PSU Board. Make sure them not
to come out from the connectors of PSU Board while flipping over the Analog Board for servicing.
Insulation Sheet
Beware of the cable connections
Figure 11 - Analogue Board Service Position
1. Technical Specifications and Connection Facilities
1.1. PCB Locations
Front Standby Board
(Behind the Front Plate)
1.2. General
PSU
Drive D 5.1 Open
Analog Board
Digital Board
Front Display Board
(Behind the Front Plate)
Mains voltage: 220V-240V
Mains frequency: ~50 Hz
Power consumption: 23 W
Standby Power consumption: <3.2W
1.3. Hybrid Tuner
1.3.1. Hybrid Tuner-Analogue TV
Test equipment: Fluke 54200 TV Signal generator
Test streams: PAL BG Philips Standard test pattern
1.3.1.1. System
B/G, I, L/L’, D/K
1.3.1.2. RF – Loop Through:
Frequency range: 43 MHz – 860 M Hz
Gain (ANT IN – ANT OUT) without amplifier: -4 dB ± 2 dB
Gain (ANT IN – ANT OUT) with amplifier: From 2 dB + 3 dB until 2 dB – 2 dB
1.3.2. Receiver
Output of Euro connector/Cinch to be used for measurements (direct output from front end)
Video Performance:
Frequency response (0 - 4.4 MHz): 0 ± 4dB
Group delay (0 - 4.4 MHz): 0 ± 150 n sec
S/N Ratio (RF level = 70dBuV, BW =
5MHz, LPS = 200kHz, SC Trap = OFF) ≥ 45 dB
Audio Performance (Mono/German Stereo):
Frequency response (100 Hz – 12 kHz) relative to 1 kHz: 0 ± 3dB
S/N Ratio unweighted (20Hz – 20kHz): ≥ 45 dB
Total Harmonic distortion at 1kHz: FM± 25 kHz: ≤ 1.5 %
Total Harmonic distortion at 1kHz: AM: m = 54% (L/L’): ≤ 2 %
Audio Performance (NICAM Stereo/Dual)
Frequency response (40 Hz - 15 kHz): 0 ± 3dB
(Relative to 1 kHz)
S/N Ratio unweighted (20Hz – 20kHz): ≥ 65 dB
Total Harmonic distortion at 1kHz: ≤ 0.5 %
Channel Separation: ≥ 45 dB
1.3.3. Tuning
Tuning Frequency Range: 45.25 MHz – 863.25 MHz
Antenna Level for 40dB luminance
S/N unweighted at 75Ω: ≤ 40 dBµV (High End)
≤ 60 dBµV (Low End)
Automatic Search Tuning
Scanning time auto search without RF Signal: 3 minutes 30 seconds typical
Stop level (vision carrier): ≥ 40 dBµV
Maximum tuning error during operation (drift): ± 100 kHz
Tuning Principles:
Automatic system recognition (B/G, I, L/L’, D/K)
Manual Selection in “Store” mode
Storage of frequencies at each random position number
1.3.4. Hybrid Tuner-DVB-T TV
1.3.4.1. DVB-T Tuning
Frequency range: 448-861MHz (/05 only)
49-861MHz (/31, /58 only)
Gain (Ant IN – Ant OUT): -1dB to 3dB
Auto Search scanning time: 1 min 14 sec typical (without RF signal)
1.3.4.2. DVB – T - Video Decoding
Demultiplexing: according ISO 13818-1 (MPEG standard)
Video bit rate: up to 15 M bit/sec
Video format: 4:3, 16:9, 14:9
Resolution: up to 720 pixels x 576 lines
1.3.4.3. DVB – T – Video Performance
DVB-T-RF antenna signal IN: Video Performance measured at Rear Cinch Video Out:
S/N(Unweighted,5MHz-BW limitation SC trap ON): ≥ 52dB
Frequency response 0.1 to 4.8MHz: +1/-5dB
Y/Chroma delay: ≤ 55ns
2-T-K-factor: ≤ 2%
1.3.4.4. DVB – T – Audio Decoding
Audio decompression: MPEG-1 & MPEG 2 Layer I and II
Audio modes: Stereo, Dual
1.3.4.5. DVB-T-Audio Performance
DVB-T-RF antenna signal IN: Audio performance measured at Rear Cinch Audio Out:
S/N(A-weighted, 22kHz-BW limited) : ≥ 88dB
Frequency response 20Hz to 20kHz : ± 1dB
THD + Noise (at 1kHz) : ≥ 85dB
THD + noise (ratio) for 16Hz to 20kHz: ≥ 65dB
Channel Separation(at 1kHz) : ≥ 100dB
1.4. Analog Inputs/Outputs
1.4.1. SCART 1 (Connected to TV)
Pin Signals:
1 Audio-out R 1.8V RMS
2 Audio-in R
3 Audio-out L 1.8V RMS
4 Audio GND
5 Blue GND
6 Audio- in L
7 Blue-out 0.7Vpp ± 0.1V into 75 Ω
8 Function switch < 2V = no signal or internal bypass
4.5V - 7V = asp. Ratio 16:9 DVD
9.5V - 12V = asp. Ratio 4:3 DVD
9 Green GND
10 P50 control not use
11 Green out 0.7Vpp ± 0.1V into 75 Ω
12 NC
13 Red GND
14 Fast switch GND
15 Red-out 0.7Vpp ± 0.1V into 75 Ω
16 Fast switch
RGB / CVBS or Y out < 0.4V into 75W = CVBS
1V- 3V into 75W = RGB
17 CVBS GND OUT
18 CVBS GND IN
19 CVBS-out 1Vpp ± 0.1V into 75 Ω
20 CVBS-in
21 Shield
1.4.2. SCART 2 (Connected to AUX)
Pin Signals:
1 Audio-out R 1.8V RMS
2 Audio-in R
3 Audio-out L 1.8V RMS
4 Audio GND
5 Blue GND
6 Audio-in L
7 Blue-in
8 Function switch
9 Green GND
10 NC
11 Green-in
12 NC
13 Red GND
14 Fast switch GND
15 Red-in
16 Fast switch
RGB / CVBS or Y in
17 CVBS-OUT GND
18 CVBS in GND
19 CVBS out 1Vpp ± 0.1V into 75Ω
20 CVBS in
21 Shield
Output voltage 2 channel mode: 2Vrms ± 1dB
Channel unbalance (1kHz): ≤ |0.22| dB (0.05V)
Crosstalk 1kHz: ≥ |100| dB
Crosstalk 16Hz-20kHz: ≥ |90| dB
Frequency response: ≤ |0.2| dB
Frequency response with de-emphasis: ≤ |0.5| dB
Signal to noise ratio (unweighted): ≤ - 95 dB
Signal to noise ratio (A-weighted): ≤ - 100 dB
Signal to noise ratio (with automute): ≤ - 115 dB
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