Philips CGY2013G-C1 Datasheet

DATA SH EET
Preliminary specification Supersedes data of 1996 Jul 12 File under Integrated Circuits, IC17
1998 Jan 23
INTEGRATED CIRCUITS
CGY2013G
1998 Jan 23 2
Philips Semiconductors Preliminary specification
GSM 4 W power amplifier CGY2013G
FEATURES
Power Amplifier (PA) overall efficiency 52%
35.5 dB gain
0 dBm input power
Gain control range >55 dB
Low output noise floor of PA < −130 dBm/Hz in GSM RX
band
Wide operating temperature range −20 to +85 °C
LQFP 48 pin package
Compatible with power ramping controller PCF5077
Compatible with GSM RF transceiver SA1620.
APPLICATIONS
880 to 915 MHz hand-held transceivers for E-GSM applications
900 MHz Time Division Multiple Access (TDMA) systems.
GENERAL DESCRIPTION
The CGY2013G is a GSM class 4 GaAs Monolithic Microwave Integrated Circuit (MMIC) power amplifier specifically designed to operate at 3.6 V battery supply.
The PA requires only a 30 dB harmonic low-pass filter to comply with the GSM transmit spurious specification. It can be switched off and its power controlled by monitoring the actual drain voltage applied to the amplifier stages.
QUICK REFERENCE DATA
Note
1. For conditions, see Chapters “AC characteristics” and “DC characteristics”.
ORDERING INFORMATION
SYMBOL PARAMETER
(1)
MIN. TYP. MAX. UNIT
V
DD
positive supply voltage 3.6 V
I
DD
positive peak supply current 2.4 A
P
o(max)
maximum output power 35.5 dBm
T
amb
operating ambient temperature 20 +85
ο
C
TYPE
NUMBER
PACKAGE
NAME DESCRIPTION VERSION
CGY2013G LQFP48 plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm SOT313-2
1998 Jan 23 3
Philips Semiconductors Preliminary specification
GSM 4 W power amplifier CGY2013G
BLOCK DIAGRAM
PINNING
SYMBOL PIN DESCRIPTION
GND 1 to 4 ground RFO/V
DD4
5 to 8 power amplifier output and fourth stage supply voltage GND 9 to 17 ground DETO/V
DD5
18 power sensor output and supply voltage
V
GG2
19 fourth stage negative gate supply voltage GND 20 to 26 ground RFI 27 power amplifier input GND 28 ground V
DD1
29 first stage supply voltage GND 30 ground V
GG1
31 first three stages negative gate supply voltage GND 32 ground V
DD2
33 second stage supply voltage GND 34 to 41 ground V
DD3
42 third stage supply voltage GND 43 to 48 ground
Fig.1 Block diagram.
(1) Ground pins 1 to 4, 9to 17, 20 to 26, 28, 30, 32, 34 to 41 and 43 to 48.
handbook, full pagewidth
CGY2013G
MGD627
(1)
31
19
18
5,6,7,8
29 33 42
27
GND
SENSOR
DRIVER
V
GG1
V
GG2
RFO/V
DD4
V
DD1
V
DD2
V
DD3
RFI
DETO/V
DD5
1998 Jan 23 4
Philips Semiconductors Preliminary specification
GSM 4 W power amplifier CGY2013G
Fig.2 Pin configuration.
handbook, full pagewidth
1 2 3 4 5 6 7 8
9 10 11
36 35 34 33 32 31 30 29 28 27 26
13
14
15
16
17
18
19
20
21
22
23
48
47
46
45
44
43
42
41
40
39
38
12
24 37
25
CGY2013G
MGD628
GND GND GND V
DD2
V
GG1
GND V
DD1
GND RFI GND GND
GND GND GND GND
RFO/V
DD4
RFO/V
DD4
RFO/V
DD4
GND GND
GND GND
GND
GND
GND
GND
GND
GND
V
DD3
GND
GND
GND
GND
GND
GND
RFO/V
DD4
GND
GND
GND
GND
DETO/V
DD5
V
GG2
GND
GND
GND
GND
GND
GND
FUNCTIONAL DESCRIPTION Operating conditions
The CGY2013G is designed to meet the European Telecommunications Standards Institute (ETSI) GSM documents, the
“ETS 300 577 specification”
, which are
defined as follows:
ton= 542.8 µs
T = 4.3 ms
Duty cycle = 1/8.
The device is specifically designed for pulse operation allowing the use of a LQFP48 plastic package.
Power amplifier
The power amplifier consists of four cascaded gain stages with an open-drain configuration. Each drain has to be loaded externally by an adequate reactive circuit which also has to be a DC path to the supply.
The amplifier bias is set using a negative voltage applied at pins V
GG1
and V
GG2
. This negative voltage must be present before the supply voltage is applied to the drains to avoid current overstress for the amplifier.
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