BYV27-50 to 200−100−pF
BYV27-300 and 400−80−pF
BYV27-500 and 600−65−pF
maximum slope of reverse recovery
current
thermal resistance from junction to tie-pointlead length = 10 mm46K/W
thermal resistance from junction to ambientnote 1100K/W
IF= 0.5 A to IR=1A;
measured at IR= 0.25 A;
see Fig. 27
see Figs 22, 23 and 24
when switched from
I
= 1 A to VR≥ 30 V
F
and dIF/dt = −1A/µs;
see Fig. 26
−− 4A/µs
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig. 25.
For more information please refer to the
“General Part of associated Handbook”
.
1997 Nov 244
Philips SemiconductorsProduct specification
Ultra fast low-loss
controlled avalanche rectifiers
GRAPHICAL DATA
2.0
handbook, halfpage
I
F(AV)
(A)
1.6
1.2
0.8
0.4
0
0200
BYV27-50 to200
a = 1.42; VR=V
Switched mode application.
201510 lead length (mm)
100
; δ = 0.5.
RRMmax
o
T ( C)
tp
MGA849
2.0
handbook, halfpage
I
F(AV)
(A)
1.6
1.2
0.8
0.4
0
0200
BYV27-300 and 400
a = 1.42; VR=V
Switched mode application.
RRMmax
; δ = 0.5.
BYV27 series
lead length 10 mm
100
o
T ( C)
tp
MLC293
Fig.2Maximum permissible average forward
current as a function of tie-point temperature
(including losses due to reverse leakage).
handbook, halfpage
3
I
F(AV)
(A)
lead length 10 mm
2
1
0
0200
BYV27-500 and 600
a = 1.42; VR=V
Switched mode application.
RRMmax
; δ = 0.5.
100
Ttp (°C)
MGK648
Fig.3Maximum permissible average forward
current as a function of tie-point temperature
(including losses due to reverse leakage).
2.0
handbook, halfpage
I
F(AV)
(A)
1.6
1.2
0.8
0.4
0
0200
BYV27-50 to 200
a = 1.42; VR=V
Device mounted as shown in Fig. 25.
Switched mode application.
RRMmax
; δ = 0.5.
100
o
T ( C)
amb
MGA848
Fig.4Maximum permissible average forward
current as a function of tie-point temperature
(including losses due to reverse leakage).
1997 Nov 245
Fig.5Maximum permissible average forward
current as a function of ambient temperature
(including losses due to reverse leakage).
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