Philips BYV26E, BYV26D, BYV26G, BYV26B Datasheet

DISCRETE SEMICONDUCTORS

DATA SHEET

handbook, 2 columns

M3D116

BYV26 series

Fast soft-recovery

controlled avalanche rectifiers

Product specification

1996 May 30

Supersedes data of February 1994

File under Discrete Semiconductors, SC01

Philips Semiconductors	Product specification

Fast soft-recovery

BYV26 series

controlled avalanche rectifiers

FEATURES

∙Glass passivated

∙High maximum operating temperature

∙Low leakage current

∙Excellent stability

∙Guaranteed avalanche energy absorption capability

∙Available in ammo-pack.

	DESCRIPTION	This package is hermetically sealed
	Rugged glass SOD57 package, using	and fatigue free as coefficients of
		expansion of all used parts are
	a high temperature alloyed
		matched.
	construction.

k

a

MAM047

Fig.1 Simplified outline (SOD57) and symbol.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL	PARAMETER	CONDITIONS	MIN.	MAX.	UNIT
VRRM	repetitive peak reverse voltage
	BYV26A		−	200	V
	BYV26B		−	400	V
	BYV26C		−	600	V
	BYV26D		−	800	V
	BYV26E		−	1000	V
	BYV26F		−	1200	V
	BYV26G		−	1400	V
VR	continuous reverse voltage
	BYV26A		−	200	V
	BYV26B		−	400	V
	BYV26C		−	600	V
	BYV26D		−	800	V
	BYV26E		−	1000	V
	BYV26F		−	1200	V
	BYV26G		−	1400	V
IF(AV)	average forward current	Ttp = 85 °C; lead length = 10 mm;
	BYV26A to E	see Figs 2 and 3;	−	1.00	A
	BYV26F and G	averaged over any 20 ms period;	−	1.05	A
		see also Figs 10 and 11
IF(AV)	average forward current	Tamb = 60 °C; PCB mounting (see
	BYV26A to E	Fig.19); see Figs 4 and 5;	−	0.65	A
	BYV26F and G	averaged over any 20 ms period;	−	0.68	A
		see also Figs 10 and 11
IFRM	repetitive peak forward current	Ttp = 85 °C; see Figs 6 and 7
	BYV26A to E		−	10.0	A
	BYV26F and G		−	9.6	A

1996 May 30

2

Philips Semiconductors	Product specification

Fast soft-recovery

BYV26 series

controlled avalanche rectifiers

SYMBOL	PARAMETER	CONDITIONS	MIN.	MAX.	UNIT
IFRM	repetitive peak forward current	Tamb = 60 °C; see Figs 8 and 9
	BYV26A to E		−	6.0	A
	BYV26F and G		−	6.4	A
IFSM	non-repetitive peak forward current	t = 10 ms half sine wave; Tj = Tj max	−	30	A
		prior to surge; VR = VRRMmax
ERSM	non-repetitive peak reverse	IR = 400 mA; Tj = Tj max prior to	−	10	mJ
	avalanche energy	surge; inductive load switched off
Tstg	storage temperature		−65	+175	°C
Tj	junction temperature	see Figs 12 and 13	−65	+175	°C

ELECTRICAL CHARACTERISTICS

Tj = 25 °C unless otherwise specified.

SYMBOL	PARAMETER	CONDITIONS	MIN.	TYP.	MAX.	UNIT
VF	forward voltage	IF = 1 A; Tj = Tj max;
	BYV26A to E	see Figs 14 and 15	−	−	1.3	V
	BYV26F and G		−	−	1.3	V
VF	forward voltage	IF = 1 A;
	BYV26A to E	see Figs 14 and 15	−	−	2.50	V
	BYV26F and G		−	−	2.15	V
V(BR)R	reverse avalanche breakdown	IR = 0.1 mA
	voltage
	BYV26A		300	−	−	V
	BYV26B		500	−	−	V
	BYV26C		700	−	−	V
	BYV26D		900	−	−	V
	BYV26E		1100	−	−	V
	BYV26F		1300	−	−	V
	BYV26G		1500	−	−	V
IR	reverse current	VR = VRRMmax; see Fig.16	−	−	5	μA
		VR = VRRMmax;	−	−	150	μA
		Tj = 165 °C; see Fig.16
trr	reverse recovery time	when switched from
	BYV26A to C	IF = 0.5 A to IR = 1 A;	−	−	30	ns
	BYV26D and E	measured at IR = 0.25 A;	−	−	75	ns
		see Fig.20
	BYV26F and G		−	−	150	ns
Cd	diode capacitance	f = 1 MHz; VR = 0 V;
	BYV26A to C	see Figs 17 and 18	−	45	−	pF
	BYV26D and E		−	40	−	pF
	BYV26F and G		−	35	−	pF

1996 May 30

3

Philips Semiconductors	Product specification

Fast soft-recovery

BYV26 series

controlled avalanche rectifiers

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

dIR

maximum slope of reverse recovery

when switched from

--------

current

IF = 1 A to VR ³ 30 V and

dt

dIF/dt = -1 A/ms;

-

-

A/ms

BYV26A to C

7

see Fig.21

BYV26D and E

-

-

6

A/ms

BYV26F and G

-

-

5

A/ms

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

Rth j-tp

thermal resistance from junction to tie-point

lead length = 10 mm

46

K/W

Rth j-a

thermal resistance from junction to ambient

note 1

100

K/W

Note

1.Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ³40 mm, see Fig.19. For more information please refer to the ‘General Part of Handbook SC01’.

1996 May 30

4