Philips buj103ad Datasheet

Page 1
BUJ103AD
Silicon diffused power transistor
Rev. 01 — 14 December 2004 Product data sheet
1. Product profile

1.1 General description

High-voltage, high-speed planar-passivated NPN power switching transistor in a SOT428 (D-PAK) surface mounted package.

1.2 Features

■ Low thermal resistance ■ Fast switching

1.3 Applications

■ Electronic lighting ballasts ■ DC-to-DC converters
■ Inverters ■ Motor control systems

1.4 Quick reference data

■ V
■ P
≤ 700 V ■ IC≤ 4 A
CESM
≤ 80 W ■ h
tot
= 12.5 (typ)
FEsat

2. Pinning information

Table 1: Pinning
Pin Description Simplified outline Symbol
1 base 2 collector 3 emitter mb mounting base; connected to collector
[1]
SOT428 (D-PAK)
mb
2
3
1
2
1
3
sym056
Page 2
Philips Semiconductors
BUJ103AD
Silicon diffused power transistor

3. Ordering information

Table 2: Ordering information
Type number Package
Name Description Version
BUJ103AD D-PAK plastic single-ended surface mounted package; 3 leads (one lead cropped) SOT428

4. Limiting values

Table 3: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V V V I
C
I
CM
I
B
I
BM
P T T
CESM CBO CEO
tot stg j
peak collector-emitter voltage VBE = 0 V - 700 V collector-base voltage open emitter - 700 V collector-emitter voltage open base - 400 V collector current (DC) - 4 A peak collector current - 8 A base current (DC) - 2 A peak base current - 4 A total power dissipation Tmb≤ 25 °C; see Figure 1 -80W storage temperature −65 +150 °C junction temperature - 150 °C
120
P
der
(%)
80
40
0
0 16012040 80
P
P
%()
der
tot
------------------------ -
P
tot 25 °C()
100%×=
001aab993
Tmb (°C)
Fig 1. Normalized total power dissipation as a function of mounting base temperature
9397 750 14195 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 01 — 14 December 2004 2 of 12
Page 3
Philips Semiconductors
BUJ103AD
Silicon diffused power transistor

5. Thermal characteristics

Table 4: Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-mb)
R
th(j-a)
[1] Device mounted on a printed-circuit board; minimum footprint.
thermal resistance from junction to mounting base see Figure 2 - - 1.56 K/W thermal resistance from junction to ambient
[1]
- 75 - K/W
001aab998
t
p
δ =
T
p
T
t
tp (s)
Z
th(j-mb)
(K/W)
10
δ = 0.5
1
0.2
0.1
0.05
0.02
−1
10
10
0.01
−2
−5
10
−4
10
−3
10
−2
10
−1
P
tot
t
11010
Fig 2. Transient thermal impedance from junction to mounting base as a function of pulse duration

6. Characteristics

Table 5: Characteristics
Tmb = 25°C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
I
CES
I
CBO
I
CEO
collector-emitter cut-off current
collector-base cut-off current VBE = 0 V; VCE = V collector-emitter cut-off
VBE = 0 V; VCE = V
= 0 V; VCE = V
V
BE
V
= V
CEO
CEOMmax
CESMmax CESMmax CESMmax
= 400 V
; Tj= 125 °C
current
I
EBO
V
CEOsus
V
CEsat
emitter-base cut-off current VEB = 7 V; IC = 0 A - - 0.1 mA collector-emitter sustaining
voltage collector-emitter saturation
IB = 0 A; IC = 10 mA; L = 25 mH; see
Figure 3 and 4
IC = 3.0 A; IB = 0.6 A; see Figure 10 - 0.25 1.0 V
voltage
V
BEsat
base-emitter saturation
IC = 3.0 A; IB = 0.6 A; see Figure 11 - 0.97 1.5 V
voltage
h
FE
9397 750 14195 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 01 — 14 December 2004 3 of 12
DC current gain IC = 1 mA; VCE = 5 V; see Figure 9 10 17 32
= 500 mA; VCE = 5 V 13 22 32
I
C
[1]
- - 1.0 mA
[1]
- - 2.0 mA
[1]
- - 1.0 mA
[1]
- - 0.1 mA
400 - - V
Page 4
Philips Semiconductors
BUJ103AD
Silicon diffused power transistor
Table 5: Characteristics
…continued
Tmb = 25°C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
h
FEsat
DC saturation current gain IC = 2.0 A; VCE = 5 V 11 16 22
= 3.0 A; VCE = 5 V - 12.5 -
I
C
Dynamic characteristics
Switching times (resistive load); see
t
on
t
stg
t
f
turn-on time I storage time - 2.7 3.3 µs
fall time - 0.3 0.35 µs
Switching times (inductive load); see
t
stg
t
f
storage time I
fall time - 30 60 ns
Switching times (inductive load); see
t
stg
t
f
[1] Measured with half sine-wave voltage (curve tracer).
storage time I
fall time - - 120 ns
Figure 5 and 6
= 2.5 A; I
Con
R
=75Ω
L
Figure 7 and 8
= 2 A; I
Con
V
BB
Figure 7 and 8
= 2 A; I
Con
V
BB
= −I
Bon
Boff
= 0.4 A; LB = 1 µH;
Bon
= −5V
= 0.4 A; LB = 1 µH;
Bon
= −5 V; Tj= 100 °C
(mA)
= 0.5 A;
I
C
- 0.52 0.6 µs
- 1.2 1.4 µs
- - 1.8 µs
100 Ω to 200 Ω
horizontal oscilloscope vertical
6 V
30 Hz to 60 Hz
50 V
1 Ω300 Ω
001aab987
Fig 3. Test circuit for collector-emitter sustaining
voltage
250
100
10
0
min
V
CEOsus
001aab988
Fig 4. Oscilloscope display for collector-emitter
sustaining voltage test waveform
VCE (V)
9397 750 14195 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 01 — 14 December 2004 4 of 12
Page 5
Philips Semiconductors
BUJ103AD
Silicon diffused power transistor
I
C
V
CC
R
L
V
IM
0
t
p
T
R
B
DUT
001aab989
90 %
t
I
B
t
on
stg
t
off
I
Bon
10 %
VIM = −6 V to +8 V; VCC = 250 V; tp=20µs; δ =tp/T = 0.01.
RB and RL calculated from I requirements.
Con
and I
Bon
tr ≤ 30 ns
−I
Boff
Fig 5. Test circuit for resistive load switching Fig 6. Switching times waveforms for resistive load
I
Con
90 %
10 %
t
f
001aab990
t
t
I
C
I
Con
90 %
V
CC
L
C
10 %
L
I V
Bon
BB
B
DUT
001aab991
t
t
stg
t
I
off
Bon
I
B
f
t
t
−I
Boff
VCC = 300 V; VBB = −5 V; LC = 200 µH; LB = 1 µH.
001aab992
Fig 7. Test circuit for inductive load switching Fig 8. Switching times waveforms for inductive load
9397 750 14195 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 01 — 14 December 2004 5 of 12
Page 6
Philips Semiconductors
BUJ103AD
Silicon diffused power transistor
2
10
h
FE
10
1
−2
10
Tj = 25 °C
VCE = 5 V
−1
001aab994
1 V
IC (A)
10110
Fig 9. DC current gain as a function of collector
current; typical values
001aab996
V
BEsat
(V)
1.4
1.2
001aab995
IB (A)
10110
V
2.0
CEsat
(V)
1.6
1.2
0.8
0.4
IC = 1 A 2 A 3 A 4 A
0
−2
10
−1
Tj = 25 °C.
Fig 10. Collector-emitter saturation voltage as a
function of base current; typical values
001aab997
V
CEsat
(V)
0.5
1.0
0.8
0.6
0.4
0.2
0
−1
10
I
(A)
C
101
IC/IB = 4. IC/IB = 4.
Fig 11. Base-emitter saturation voltage as a function of
collector current; typical values
0.4
0.3
0.2
0.1
0
−1
10
I
(A)
C
101
Fig 12. Collector-emitter saturation voltage as a
function of collector current; typical values
9397 750 14195 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 01 — 14 December 2004 6 of 12
Page 7
Philips Semiconductors
BUJ103AD
Silicon diffused power transistor
10
I
C
(A)
8
V
CC
6
4
2
0
0 1000800400 600200
Tj≤ T
j(max)
V
.
V
CEclamp
L
C
L
I V
Bon
BB
B
DUT
≤ 1000 V; VCC = 150 V; VBB = −5 V;
V
CEclamp
probe point
001aab999
LB=1µH; LC= 200 µH.
Fig 13. Test circuit for reverse bias safe operating area Fig 14. Reverse bias safe operating area
2
10
I
C
(A)
I
CMmax
I
Cmax
10
10
(1)
1
−1
duty cycle = 0.01
II
(3)
(2)
tp = 20 µs
50 µs 100 µs
200 µs 500 µs DC
001aac000
CEclamp
001aac001
(V)
I
−2
10
−3
10
1 10
(3)
III
(3)
2
10
10
V
CEclamp
(V)
3
Tmb≤ 25 °C; Mounted with heatsink compound and 30 ± 5 Newton force on the center of the envelope.
(1) P
maximum and P
tot
peak maximum lines.
tot
(2) Second breakdown limits. (3) I = Region of permissible DC operation.
II = Extension for repetitive pulse operation. III = Extension during turn-on in single transistor converters provided that RBE≤ 100 Ω and tp≤ 0.6 µs.
Fig 15. Forward bias safe operating area

7. Package information

Epoxy meets requirements of UL94 V-0 at1⁄8 inch.
9397 750 14195 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 01 — 14 December 2004 7 of 12
Page 8
Philips Semiconductors

8. Package outline

BUJ103AD
Silicon diffused power transistor
Plastic single-ended surface mounted package (D-PAK); 3 leads (one lead cropped)
y
E
b
2
L
2
2
13
A
mounting base
D
1
H
D
L
L
1
A
A
1
SOT428
E
1
D
2
b
1
e
DIMENSIONS (mm are the original dimensions)
UNIT
mm
OUTLINE VERSION
SOT428 SC-63
A
Ab
1
0.93
2.38
2.22
0.73
0.89
0.71
b
e
1
b
bcD
IEC JEDEC JEITA
1.1
0.9
2
1
5.46
5.00
Fig 16. Package outline SOT428 (SC-63)
M
wA
0 5 10 mm
D
2
1
min
0.56
6.22
5.98
4.0
0.20
REFERENCES
TO-252
c
scale
E
1
Ee
min
6.73
4.45
6.47
2.285 4.57
0.2
y
max
0.2
L
e
H
1
D
10.4
2.95
9.6
2.55
EUROPEAN
PROJECTION
1
Lw
min
0.5
L
2
0.9
0.5
ISSUE DATE
01-12-11 04-10-14
9397 750 14195 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 01 — 14 December 2004 8 of 12
Page 9
Philips Semiconductors

9. Mounting

BUJ103AD
Silicon diffused power transistor
7.0
7.0
2.15
2.5
Dimensions in mm.
1.5
4.57
001aab021
Fig 17. SOT428 soldering pattern for surface mounting
9397 750 14195 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 01 — 14 December 2004 9 of 12
Page 10
Philips Semiconductors
Silicon diffused power transistor
BUJ103AD

10. Revision history

Table 6: Revision history
Document ID Release date Data sheet status Change notice Doc. number Supersedes
BUJ103AD_1 20041214 Product data sheet - 9397 750 14195 -
9397 750 14195 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 01 — 14 December 2004 10 of 12
Page 11
Philips Semiconductors

11. Data sheet status

BUJ103AD
Silicon diffused power transistor
Level Data sheet status
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
II Preliminary data Qualification Thisdata sheet contains data from the preliminary specification. Supplementary data will be published
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
[1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
[1]
Product status
12. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make norepresentation or warranty thatsuch applications will be suitable for the specified use without further testing or modification.
[2] [3]
Definition
Semiconductors reserves the right to change the specification in any manner without notice.
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product.
right to make changes at any time in order to improve the design, manufacturing and supply.Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).

13. Disclaimers

Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makesno representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.

14. Contact information

For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: [email protected]
9397 750 14195 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 01 — 14 December 2004 11 of 12
Page 12
Philips Semiconductors

15. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Package information . . . . . . . . . . . . . . . . . . . . . 7
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
9 Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
11 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 11
12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
14 Contact information . . . . . . . . . . . . . . . . . . . . 11
BUJ103AD
Silicon diffused power transistor
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Published in The Netherlands
Date of release: 14 December 2004
Document number: 9397 750 14195
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