Philips bt258b DATASHEETS
Philips Semiconductors Product specification
Thyristors BT258B series
logic level
GENERAL DESCRIPTION QUICK REFERENCE DATA
Glass passivated, sensitive gate SYMBOL PARAMETER MAX. MAX. MAX. UNIT
thyristors in a plastic envelope
suitable for surface mounting, BT258B- 500R 600R 800R
intended for use in general purpose V
switching and phase control V
applications. These devices are I
intended to be interfaced directly to I
microcontrollers, logic integrated I
circuits and other low power gate current
trigger circuits.
PINNING - SOT404 PIN CONFIGURATION SYMBOL
, Repetitive peak off-state 500 600 800 V
DRM
RRM
T(AV)
T(RMS)
TSM
voltages
Average on-state current 5 5 5 A
RMS on-state current 8 8 8 A
Non-repetitive peak on-state 75 75 75 A
PIN DESCRIPTION
mb
1 cathode
ak
2 anode
3 gate
mb anode
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
, V
DRM
I
T(AV)
I
T(RMS)
I
TSM
I2tI
dIT/dt Repetitive rate of rise of ITM = 10 A; IG = 50 mA; - 50 A/µs
I
GM
V
GM
V
RGM
P
GM
P
G(AV)
T
stg
T
j
Repetitive peak off-state - 5001600
RRM
voltages
Average on-state current half sine wave; Tmb ≤ 111 ˚C - 5 A
RMS on-state current all conduction angles - 8 A
Non-repetitive peak half sine wave; Tj = 25 ˚C prior to
on-state current surge
t = 10 ms - 75 A
2
t for fusing t = 10 ms - 28 A2s
t = 8.3 ms - 82 A
on-state current after dIG/dt = 50 mA/µs
triggering
Peak gate current - 2 A
Peak gate voltage - 5 V
Peak reverse gate voltage - 5 V
Peak gate power - 5 W
Average gate power over any 20 ms period - 0.5 W
Storage temperature -40 150 ˚C
Operating junction - 125
temperature
2
13
g
-500R -600R -800R
1
2
800 V
˚C
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the thyristor may
switch to the on-state. The rate of rise of current should not exceed 15 A/µs.
2 Note: Operation above 110˚C may require the use of a gate to cathode resistor of 1kΩ or less.
September 1997 1 Rev 1.100
Philips Semiconductors Product specification
Thyristors BT258B series
logic level
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R
th j-mb
R
th j-a
STATIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
GT
I
L
I
H
V
T
V
GT
ID, I
R
Thermal resistance - - 2.0 K/W
junction to heatsink
Thermal resistance minimum footprint, FR4 board - 55 - K/W
junction to ambient
Gate trigger current VD = 12 V; IT = 0.1 A - 50 200 µA
Latching current VD = 12 V; IGT = 0.1 A - 0.4 10 mA
Holding current VD = 12 V; IGT = 0.1 A - 0.3 6 mA
On-state voltage IT = 16 A - 1.3 1.5 V
Gate trigger voltage VD = 12 V; IT = 0.1 A - 0.4 1.5 V
Off-state leakage current VD = V
VD = V
; IT = 0.1 A; Tj = 110 ˚C 0.1 0.2 - V
DRM(max)
DRM(max)
; VR = V
; Tj = 125 ˚C - 0.1 0.5 mA
RRM(max)
DYNAMIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
dVD/dt Critical rate of rise of VDM = 67% V
off-state voltage exponential waveform; RGK = 100 Ω
t
gt
t
q
Gate controlled turn-on ITM = 10 A; VD = V
time dIG/dt = 0.2 A/µs
Circuit commutated VD = 67% V
turn-off time ITM = 12 A; VR = 24 V; dITM/dt = 10 A/µs;
dVD/dt = 2 V/µs; RGK = 1 kΩ
DRM(max)
; Tj = 125 ˚C; 50 100 - V/µs
DRM(max)
; IG = 5 mA; - 2 - µs
DRM(max)
; Tj = 125 ˚C; - 100 - µs
September 1997 2 Rev 1.100
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