Philips blv100 DATASHEETS

DISCRETE SEMICONDUCTORS
DATA SH EET
BLV100
UHF power transistor
Product specification
March 1993
Philips Semiconductors Product specification

FEATURES

Internal input matching to achieve high power gain
Ballasting resistors for an optimum temperature profile
Gold metallization ensures excellent reliability.

DESCRIPTION

NPN silicon planar epitaxial transistor in a SOT171 envelope, intended for common emitter, class-AB operation in radio transmitters for the 960 MHz communications band. The transistor has a 6-lead flange envelope with a ceramic cap. All leads are isolated from the flange.

PINNING - SOT171

PIN DESCRIPTION
1 emitter 2 emitter 3 base 4 collector 5 emitter 6 emitter

PIN CONFIGURATION

lfpage
1
3 5
Top view
2
4 6
MBA931 - 1
handbook, halfpage
MBB012
c
b
e
Fig.1 Simplified outline and symbol.
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste.

QUICK REFERENCE DATA

RF performance up to T
MODE OF OPERATION
= 25 °C in a common emitter class-AB test circuit.
h
f
(MHz)
V
(V)
CE
P
(W)
L
G
P
(dB)
(%)
c.w. class-AB 960 24 8 > 8 > 50
March 1993 2
η
c
Philips Semiconductors Product specification

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CESM
V
CEO
V
EBO
I
C
I
CM
P
tot
T
stg
T
j
collector-emitter voltage peak value;
50 V
VBE=0 collector-emitter voltage open base 30 V emitter-base voltage open collector 4V collector current DC or average value 2.25 A collector current peak value
3.5 A
f > 1 MHz total power dissipation f > 1 MHz;
31 W
Tmb=25°C storage temperature range 65 150 °C junction operating temperature 200 °C
10
handbook, halfpage
I
C
(A)
1
1
10
110
(1) Second breakdown limit (temperature independent).
Th = 70 °C
Tmb = 25 °C
V
Fig.2 DC SOAR.

THERMAL RESISTANCE

Dissipation = 31 W; T
mb
=25°C.
(1)
CE
(V)
MDA538
60
handbook, halfpage
P
tot
(W)
40
(2)
(1)
20
2
10
0
0
(1) RF operation. (2) Short time operation during mismatch.
40
80 160
MDA540
120
Th (°C)
Fig.3 Power/temperature derating curve.
SYMBOL PARAMETER MAX. UNIT
R
th j-mb(RF)
R
th mb-h
from junction to mounting base 5.6 K/W from mounting base to heatsink 0.4 K/W
March 1993 3
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