Philips blf6g22-45 Datasheet

BLF6G22-45

Power LDMOS transistor

Rev. 02 — 21 April 2008 Product data sheet

1. Product profile

1.1 General description

45 W LDMOS power transistor for base station applications at frequencies from
2000 MHz to 2200 MHz.

Table 1. Typical performance

RF performance at T

Mode of operation f V

2-carrier W-CDMA 2110 to 2170 28 2.5 18.5 13 −49

[1] Test signal: 3GPP; test model 1; 64 DPCH; PAR =7.5 dB at 0.01 % probability on CCDF per carrier;

case

carrier spacing 5 MHz.

= 25°C in a common source class-AB production test circuit.

DS

(MHz) (V) (W) (dB) (%) (dBc)

P

L(AV)

G

p

η

D

ACPR

[1]

CAUTION

This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.

1.2 Features

n Typical 2-carrier W-CDMAperformance at frequencies of 2110 MHz and 2170 MHz, a

supply voltage of 28 V and an IDq of 405 mA:

u Average output power = 2.5 W
u Power gain = 18.5 dB (typ)
u Efficiency = 13 %

u ACPR = −49 dBc
n Easy power control
n Integrated ESD protection
n Excellent ruggedness
n High efficiency
n Excellent thermal stability
n Designed for broadband operation (2000 MHz to 2200 MHz)
n Internally matched for ease of use
n Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances

(RoHS)

NXP Semiconductors

1.3 Applications

n RF power amplifiers for W-CDMA base stations and multicarrier applications in the

2000 MHz to 2200 MHz frequency range

2. Pinning information

Table 2. Pinning

Pin Description Simplified outline Graphic symbol

1 drain
2 gate
3 source

[1] Connected to flange.

3. Ordering information

BLF6G22-45

Power LDMOS transistor

1

[1]

3

2

2

sym112

1

3

Table 3. Ordering information

Type number Package

BLF6G22-45 - flanged ceramic package; 2 mounting holes; 2 leads SOT608A

4. Limiting values

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

V

DS

V

GS

T

stg

T

j

drain-source voltage - 65 V
gate-source voltage −0.5 +13 V
storage temperature −65 +150 °C
junction temperature - 225 °C

5. Thermal characteristics

Table 5. Thermal characteristics

Symbol Parameter Conditions Typ Unit

R

th(j-case)

thermal resistance from junction
to case

Name Description Version

T

=80°C;

case

P

= 12.5 W (CW)

L

1.7 K/W

BLF6G22-45_2 © NXP B.V. 2008. All rights reserved.

Product data sheet Rev. 02 — 21 April 2008 2 of 10

NXP Semiconductors

6. Characteristics

Table 6. Characteristics

Tj = 25°C per section; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

V

(BR)DSS

V

GS(th)

V

GSq

I

DSS

I

DSX

I

GSS

g

fs

R

DS(on)

BLF6G22-45

Power LDMOS transistor

drain-source breakdown
voltage

gate-source threshold voltage VDS= 10 V; ID= 72 mA 1.4 1.9 2.4 V
gate-source quiescent voltage VDS=28V;ID= 300 mA 1.65 2.15 2.65 V
drain leakage current VGS=0V; VDS=28V - - 1.5 µA
drain cut-off current VGS=V

gate leakage current VGS= 11 V; VDS= 0 V - - 150 nA
forward transconductance VDS=10V; ID= 3.5 A - 5 - S
drain-source on-state

resistance

VGS=0V; ID= 0.5 mA 65 - - V

V

=10V

DS

VGS=V
I

= 2.5 A

D

GS(th)

GS(th)

+ 3.75 V;

+ 3.75 V;

- 12.5 - A

- 0.2 - Ω

7. Application information

Table 7. Application information

Mode of operation: 2-carrier W-CDMA; PAR 7.5 dB at 0.01 % probability on CCDF; 3GPP test
model 1; 1 to 64 PDPCH; f
RF performance at V
class-AB production test circuit.

Symbol Parameter Conditions Min Typ Max Unit

P

L(AV)

G

p

η

D

ACPR adjacent channel power ratio P

7.1 Ruggedness in class-AB operation

The BLF6G22-45 is capable of withstanding a load mismatch corresponding to
VSWR = 10 : 1 through all phases under the following conditions: VDS=28V;
IDq= 405 mA; PL = 45 W (CW); f = 2170 MHz.

average output power - 2.5 - W
power gain P
drain efficiency P

= 2112.5 MHz; f2 = 2117.5 MHz; f3 = 2162.5 MHz; f4 = 2167.5 MHz;

1

= 28 V; IDq = 405 mA; T

DS

= 25°C; unless otherwise specified; in a

case

= 2.5 W 17.3 18.5 19.7 dB

L(AV)

= 2.5 W 10.5 13 - %

L(AV)

= 2.5 W - −49 −46 dBc

L(AV)

BLF6G22-45_2 © NXP B.V. 2008. All rights reserved.

Product data sheet Rev. 02 — 21 April 2008 3 of 10

NXP Semiconductors

BLF6G22-45

Power LDMOS transistor

G

(dB)

G

(dB)

22

p

20

18

16

14

12

001aah604

0604020 503010

η

D

G

p

PL (W)

60

η

D

(%)

50

40

30

20

10

VDS=28V; IDq= 405 mA; f = 2170 MHz.

Fig 1. One-tone CW power gain and drain efficiency as functions of load power; typical

values

20

p

19

18

17

16

G

p

η

D

001aah605

60

η

D

(%)

50

40

30

20

−10

IMD

(dBc)

−20

−30

−40

−50

001aah606

IMD3

IMD5

IMD7

15

14

060704020 503010

P

L(PEP)

10

0

(W)

VDS=28V; IDq= 405 mA; f1= 2170 MHz;
f2= 2170.1 MHz.

Fig 2. Two-tone CW power gain and drain efficiency

as functions of peak envelope load power;

−60

−70

060704020 503010

P

L(PEP)

(W)

VDS= 28 V; IDq= 405 mA; f1= 2170 MHz;
f2= 2170.1 MHz.

Fig 3. Intermodulation distortion as a function of

peak envelope load power; typical values

typical values

BLF6G22-45_2 © NXP B.V. 2008. All rights reserved.

Product data sheet Rev. 02 — 21 April 2008 4 of 10

NXP Semiconductors

BLF6G22-45

Power LDMOS transistor

η

D

G

p

001aah607

P

(W)

L(AV)

G

(dB)

p

20

19

18

17

16

15

0108462

VDS=28V; IDq= 405 mA; f1= 2162.5 MHz;
f2= 2167.5 MHz; carrier spacing 5 MHz.

Fig 4. 2-carrier W-CDMA power gain and drain

efficiency as functions of average load power;
typical values

8. Test information

30

η

D

(%)

25

20

15

10

5

−30

ACPR

(dBc)

−35

−40

−45

−50

−55

−60

0108462

001aah608

P

(W)

L(AV)

VDS= 28 V; IDq= 405 mA; f1= 2162.5 MHz;
f2= 2167.5 MHz; carrier spacing 5 MHz.

Fig 5. 2-carrier W-CDMA adjacent power channel

ratio as a function of average load power;
typical values

V

GG

C3

input
50 Ω

C4

C2

C1

C5 C6

R1

C10

C7 C8 C9

See Table8 for list of components.

Fig 6. Test circuit for operation at 2110 MHz and 2170 MHz

C11 C12 C13 C14

C18

C17

C15

V

DD

C16

output

50 Ω

001aah609

BLF6G22-45_2 © NXP B.V. 2008. All rights reserved.

Product data sheet Rev. 02 — 21 April 2008 5 of 10

NXP Semiconductors

BLF6G22-45

Power LDMOS transistor

C16

C3

C4

C5

C2

C1

C6

R1

C12C11 C13

C7

C8

C15

C14C10

C9

C18

C17

001aah610

Striplines are on a double copper-clad Rogers Duroid 5880 Printed-Circuit Board (PCB) with

εr= 2.2 and thickness = 0.79 mm.

See Table8 for list of components.

Fig 7. Component layout for 2110 MHz and 2170 MHz test circuit

Table 8. List of components

For test circuit, see Figure 6 and Figure 7.

Component Description Value Remarks

C1, C2, C17, C18 multilayer ceramic chip capacitor 6.8 pF

[1]

C3, C15 tantalum capacitor 10 µF
C4, C5 multilayer ceramic chip capacitor 1.5 µF
C6, C12 multilayer ceramic chip capacitor 10 pF
C7 multilayer ceramic chip capacitor 0.5 pF
C8 multilayer ceramic chip capacitor 1.2 pF
C9 multilayer ceramic chip capacitor 1.0 pF

[2]
[2]
[2]
[2]

C10, C11 multilayer ceramic chip capacitor 100 nF
C13 multilayer ceramic chip capacitor 220 nF
C14 multilayer ceramic chip capacitor 4.7 µF
C16 electrolytic capacitor 220 µF, 63 V
R1 chip resistor 5.6 Ω

[1] American technical ceramics type 100A or capacitor of same quality.
[2] American technical ceramics type 100B or capacitor of same quality.

BLF6G22-45_2 © NXP B.V. 2008. All rights reserved.

Product data sheet Rev. 02 — 21 April 2008 6 of 10

NXP Semiconductors

BLF6G22-45

Power LDMOS transistor

9. Package outline

Flanged ceramic package; 2 mounting holes; 2 leads SOT608A

D

A

3

D

1

F

U

1

q

B

C

1

H

U

2

A

DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)

UNIT

mm

inches

A

4.62

3.76

0.182

0.148

7.24

6.99

0.285

0.275

c

0.15

0.10

0.006

0.004

Db

10.21

10.01

0.402

0.394

D

10.29

10.03

0.405

0.395

1

10.21

10.01

0.402

0.394

2

b

EE

1

10.29

10.03

0.405

0.395

w

M M

2

0 5 10 mm

scale

H

F

15.75

1.14

14.73

0.89

0.620

0.045

0.580

0.035

p

C

p

3.30

2.92

0.130

0.115

c

E

1

w

M M M

AB

1

Q

qw

Q

1.70

1.35

0.067

0.053

U

20.45

20.19

0.805

0.795

1

U

9.91

9.65

0.390

0.380

w

2

1

2

0.25 0.5115.24

0.010 0.0200.600

E

OUTLINE
VERSION

SOT608A

REFERENCES

IEC JEDEC EIAJ

EUROPEAN

PROJECTION

ISSUE DATE

01-02-22
02-02-11

Fig 8. Package outline SOT608A

BLF6G22-45_2 © NXP B.V. 2008. All rights reserved.

Product data sheet Rev. 02 — 21 April 2008 7 of 10

NXP Semiconductors

10. Abbreviations

Table 9. Abbreviations

Acronym Description

3GPP 3rd Generation Partnership Project
CCDF Complementary Cumulative Distribution Function
CW Continuous Waveform
DPCH Dedicated Physical CHannel
IMD InterModulation Distortion
LDMOS Laterally Diffused Metal-Oxide Semiconductor
PAR Peak-to-Average power Ratio
PDPCH transmission Power of the Dedicated Physical CHannel
RF Radio Frequency
VSWR Voltage Standing-Wave Ratio
W-CDMA Wideband Code Division Multiple Access

BLF6G22-45

Power LDMOS transistor

11. Revision history

Table 10. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BLF6G22-45_2 20080421 Product data sheet - BLF6G22-45_BLF6G22S-45_1
Modifications:

BLF6G22-45_BLF6G22S-45_1 20080219 Preliminary data sheet - -

• The combined data sheet is split up into two separate data sheets.

• Table 1 and Table 7: ACPR values changed.

BLF6G22-45_2 © NXP B.V. 2008. All rights reserved.

Product data sheet Rev. 02 — 21 April 2008 8 of 10

NXP Semiconductors

12. Legal information

12.1 Data sheet status

BLF6G22-45

Power LDMOS transistor

Document status

Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document mayhave changed since this document was published and maydiffer in case of multiple devices. The latest product status

information is available on the Internet at URL

[1][2]

Product status

12.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall haveno liability for the consequences of
use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title.A short data sheet is intended
for quick referenceonly and should not be relied upon to containdetailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.

12.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or
warranties, expressedor implied,as tothe accuracyor completeness ofsuch
information and shall have no liability for the consequences of use of such
information.

Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informationsupplied prior
to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or

[3]

http://www.nxp.com.

Definition

malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.

Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134)may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at

http://www.nxp.com/profile/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyanceor implication of any license under any copyrights, patents
or other industrial or intellectual property rights.

12.4 Trademarks

Notice: All referencedbrands, product names, service names and trademarks
are the property of their respective owners.

13. Contact information

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]

BLF6G22-45_2 © NXP B.V. 2008. All rights reserved.

Product data sheet Rev. 02 — 21 April 2008 9 of 10

NXP Semiconductors

14. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Thermal characteristics. . . . . . . . . . . . . . . . . . . 2

6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Application information. . . . . . . . . . . . . . . . . . . 3

7.1 Ruggedness in class-AB operation. . . . . . . . . . 3

8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 5

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7

10 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 8

11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8

12 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9

12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9

12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

12.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

13 Contact information. . . . . . . . . . . . . . . . . . . . . . 9

14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

BLF6G22-45

Power LDMOS transistor

Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.

© NXP B.V. 2008. All rights reserved.

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]

Date of release: 21 April 2008

Document identifier: BLF6G22-45_2