Philips BLF247B Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
BLF247B
VHF push-pull power MOS transistor
Product specification
Philips Semiconductors
August 1994
Philips Semiconductors Product specification
VHF push-pull power MOS transistor BLF247B

FEATURES

High power gain
Easy power control
Good thermal stability
Withstands full load mismatch.

APPLICATIONS

Large signal applications in the VHF frequency range.

DESCRIPTION

Silicon N-channel enhancement mode vertical D-MOS push-pull transistor encapsulated in a 4-lead, SOT262A1 balanced flange type package with two ceramic caps. The mounting flange provides the common source connection for the transistor.

PINNING - SOT262A1

PIN CONFIGURATION

12
d
g g
55
Top view
34
MAM098
s
d
Fig.1 Simplified outline and symbol.
CAUTION
The device is supplied in a antistatic package. The gate-source input must be protected against static charge during transport or handling.
WARNING
PIN DESCRIPTION
1 drain 1 2 drain 2 3 gate 1 4 gate 2 5 source
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO discs are not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste.

QUICK REFERENCE DATA

RF performance at T
MODE OF OPERATION
= 25 °C in a common source test circuit.
h
f
(MHz)
V
(V)
DS
P
(W)
L
G
(dB)
p
(%)
CW, class-B 225 28 150 12 55
η
D
Philips Semiconductors Product specification
VHF push-pull power MOS transistor BLF247B

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Per transistor section
V
DS
V
GS
I
D
P
tot
T
stg
T
j

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-mb
R
th mb-h
drain-source voltage (DC) 65 V gate-source voltage −±20 V drain current (DC) 13 A total power dissipation up to Tmb= 25 °C; total device;
280 W
both sections equally loaded storage temperature 65 +150 °C operating junction temperature +200 °C
thermal resistance from junction to mounting base
thermal resistance from mounting base to heatsink
total device; both sections equally
loaded
total device; both sections equally
loaded
0.63 K/W
0.15 K/W
2
10
I
D
(A)
(1) (2)
10
1
Total device; both sections equally loaded. (1) Current in this area may be limited by R (2) Tmb=25°C.
101
Fig.2 DC SOAR.
V (V)
DS
.
DSon
MBD287
400
P
tot
(W)
300
(2)
200
(1)
100
2
10
0
040
Total device; both sections equally loaded. (1) Continuous operation. (2) Short-time operation during mismatch.
80 120 160
MBD288
o
T ( C)
h
Fig.3 Power derating curves.
Philips Semiconductors Product specification
VHF push-pull power MOS transistor BLF247B

CHARACTERISTICS

T
=25°C unless otherwise specified.
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Per transistor section
V
(BR)DSS
I
DSS
I
GSS
V
GSth
g
fs
R
DSon
I
DSX
C
is
C
os
C
rs
drain-source breakdown voltage
drain-source leakage current VGS= 0; VDS=28V −−2.5 mA gate-source leakage current VGS= ±20 V; VDS=0 −−1µA gate-source threshold voltage ID= 50 mA; VDS=10V 2 4.5 V forward transconductance ID= 5 A; VGS=10V 3 4.2 S drain-source on-state
resistance drain cut-off current VGS= 10 V; VDS=10V 22 A input capacitance VGS= 0; VDS=28V; f=1MHz 225 pF output capacitance VGS= 0; VDS=28V; f=1MHz 180 pF reverse transfer capacitance VGS= 0; VDS=28V; f=1MHz 25 pF
ID= 50 mA; VGS=0 65 −−V
ID= 5 A; VGS=10V 0.2 0.3
handbook, halfpage
1
TC
(mV/K)
0
1
2
3
4
5
10
VDS=10V.
2
1
10
110
Fig.4 Temperature coefficient of gate-source
voltage as a function of drain current, typical values per section.
I (A)
D
MBD298
15
MBD299
V (V)
GS
40
I
D
(A)
30
20
10
0
0 5 10 20
VDS=10V.
Fig.5 Drain current as a function of gate-source
voltage, typical values per section.
Philips Semiconductors Product specification
VHF push-pull power MOS transistor BLF247B
400
handbook, halfpage
R
DSon
()
300
200
100
0
050
ID= 5A; VGS=10V.
100
Fig.6 Drain-source on-state resistance as a
function of junction temperature, typical values per section.
MBD297
o
T ( C)
j
150
C
MRA930
is
DS
(V)V
800
C
(pF)
600
C
os
400
200
0
010203040
VGS= 0; f = 1 MHz.
Fig.7 Input and output capacitance as functions
of drain-source voltage, typical values per section.
300
C
rs
(pF)
200
100
0
0
VGS= 0; f = 1 MHz.
10 20 30 40
MBD296
V (V)
DS
Fig.8 Reverse transfer capacitance as a
function of drain-source voltage, typical values per section.
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