Philips BLF2022-125 Technical data

DISCRETE SEMICONDUCTORS
DATA SH EET
M3D792
BLF2022-125
UHF power LDMOS transistor
Objective specification Supersedes data of 2002 April 02
2003 Mar 07
Philips Semiconductors Objective specification
UHF power LDMOS transistor BLF2022-125
FEATURES
Typical W-CDMA performance at a supply voltage of 28 V and IDQ of 1 A
– Output power = 20 W (AV) – Gain = 12 dB – Efficiency = 19% – ACPR = 42 dBc at 3.84 MHz
Easy power control
Excellent ruggedness
High power gain
Excellent thermal stability
Designed for broadband operation (2000 to 2200 MHz)
Internally matched for ease of use.
APPLICATIONS
RF power amplifiers for W-CDMA base stations and multicarrier applications in the 2000 to 2200 MHz frequency range
DESCRIPTION
PINNING - SOT634A
PIN DESCRIPTION
1 drain 2 gate 3 source, connected to flange
Top view
Fig.1 Simplified outline.
1
3
2
MBL367
125 W LDMOS power transistor for base station applications at frequencies from 2000 to 2200 MHz.
QUICK REFERENCE DATA
RF performance at Th=25°C in a common source test circuit; single-carrier W-CDMA test model 1, 64 channels,
3.84 MHz channel bandwidth; Peak/Average = 9.8 dB at 0.01% probability on CCDF.
MODE OF OPERATION
f
(MHz)
V
(V)
DS
P
(W)
Lavg
G
(dB)
p
η
D
(%)
d
im
(dBc)
single carrier W-CDMA 2110 to 2170 28 30 typ 12 typ 19 typ 42
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER MIN. MAX. UNIT
V
DS
V
GS
I
D
T
stg
T
j
drain-source voltage 65 V gate-source voltage −±15 V drain current (DC) tbd A storage temperature 65 +150 °C junction temperature 200 °C
CAUTION
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B.
2003 Mar 07 2
Philips Semiconductors Objective specification
UHF power LDMOS transistor BLF2022-125
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-c
Note
1. Thermal resistance is determined under specified RF operating conditions.
CHARACTERISTICS
T
=25°C unless otherwise specified.
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)DSS
V
GSth
I
DSS
I
GSS
g
fs
R
DSon
C
rss
thermal resistance from junction to case note 1 0.55 K/W
drain-source breakdown voltage VGS= 0; ID= 2.5 mA 65 −−V gate-source threshold voltage VDS=10V; ID= 240 mA 4.5 5.5 V drain-source leakage current VGS= 0; VDS=26V −−10 µA gate leakage current VGS= ±15 V; VDS=0 −−40 nA forward transconductance VDS=10V; ID=16A 9.5 S drain-source on-state resistance VGS=V
+9V; ID=8A 0.07 −Ω
GSth
feedback capacitance VGS= 0; VDS=26V; f=1MHz tbd pF
2003 Mar 07 3
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