Philips BGF802-20 Technical data

DISCRETE SEMICONDUCTORS
DATA SH EET
M3D737
BGF802-20
CDMA800 power module
Product specification Supersedes data of 2002 Nov 12
2003 Feb 24
Philips Semiconductors Product specification
CDMA800 power module BGF802-20

FEATURES

Typical CDMAIS95 performance at a supply voltage of 28 V:
– Output power = 3 W – Gain = 30 dB – Efficiency = 18% – ACPR < -53 dBc at 750 kHz and BW = 30 kHz – ACPR < -69 dBc at 1.98 MHz and BW = 30 kHz.
Low distortion to CDMA signals
Excellent 2-tone performance
Low die temperatures using copper flange
Integrated temperature compensated bias
50 input/output system
Flat gain over frequency range.

APPLICATIONS

Base station RF power amplifiers in the 869 to 894 MHz frequency range
CDMA IS95, CDMA2000, multi carrier applications
Macrocell (driver stage) and Microcell (final stage).

PINNING - SOT365C

PIN DESCRIPTION
1 RF input 2V 3 RF output
Flange ground
Top view
Fig.1 Simplified outline.
S
1
23
MBL257

DESCRIPTION

25 W LDMOS power amplifier module for base station amplifier applications in the 869 to 894 MHz range.

QUICK REFERENCE DATA

Typical RF performance at Tmb=25°C.
MODE OF OPERATION
f
(MHz)
V
(V)
DS
P
(W)
L
G
(dB)
p
η
(%)
ACPR
(dBc)
EVM
(%)
CW 869 to 894 28 25 29 48 −− IS95 CDMA
(1)
869 to 894 28 3 30 18 53
GSM EDGE 869 to 894 26 2.5 30 16 65
69
(2) (3)
(4)
0.4
Notes
1. IS95 CDMA (Pilot, paging, sync and traffic codes 813).
2. ACPR 750 kHz at 30 kHz resolution bandwidth.
3. ACPR 1.98 MHz at 30 kHz resolution bandwidth.
4. ACPR 400 kHz at 30 kHz resolution bandwidth.
Philips Semiconductors Product specification
CDMA800 power module BGF802-20

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER MIN. MAX. UNIT
V
S
P
D
P
L
T
stg
T
mb

CHARACTERISTICS

Tmb=25°C; VS= 28 V; PL= 3.0 W; f = 869 to 894 MHz; ZS=ZL=50Ω; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
DQ
P
1dB
G
p
G
p freq
G
p pwr
∆ϕ
freq
G
OB
VSWR
in
H
2
H
3
IS95 CDMA (PL= 3 W average)
DC supply voltage 30 V input drive power 100 mW load power 30 W storage temperature 30 +100 °C operating mounting base temperature 20 +90 °C
quiescent current (pin 2) PD= 0 mW 245 280 320 mA load power at 1 dB gain compression 18 25 W power gain 28 30 32 dB gain flatness over
0.2 1.0 dB
frequency range gain flatness over power
PL= 30 mW up to 3 W 0.8 0.2 0.2 dB
band phase linearity over
0.2 deg
frequency range delay flatness 200 ps out of band gain small signal, PD= 0 dBm;
f < 869 MHz, f > 894 MHz
−−G
Pimax
+1
note 1
dB
input VSWR 1.6:1 2.0:1 second harmonic −−37 34 dBc third harmonic −−61 58 dBc stability VSWR 3 : 1 through all
phases; V
=25to28V
S2
ruggedness VSWR = 10 : 1 through all
phases; P
=5W
L
all spurious outputs more than 60 dB below desired signal
no degradation in output power
η efficiency 15 18 % ACPR ACPR
750 kHz
1.98 MHz
spectral regrowth; measured in 30 kHz RBW
−−53 −49 dBc
−−69 −66 dBc
Note
1. G
is small signal in-band gain.
Pi
Philips Semiconductors Product specification
CDMA800 power module BGF802-20
6
P
L (AV)
MBL762
(W)
30.4
handbook, halfpage
G
p
(dB)
30
29.6
29.2
28.8 024 8
f = 882 MHz.
G
p
η
Fig.2 IS95 power gain and efficiency as functions
of load power; typical values.
40
30
20
10
0
(%)
40
handbook, halfpage
ACPR
η
750 kHz
(dBc)
45
50
55
60
65
f = 882 MHz.
024 8
MBL763
6
P
L (AV)
(W)
Fig.3 ACPR at 750 kHz as a function of output
power; typical values.
6
P
L (AV)
MBL764
(W)
60
handbook, halfpage
ACPR
1.98 MHz
(dBc)
64
68
72
76
024 8
f = 882 MHz.
Fig.4 ACPR at 1.98 MHz as a function of output
power; typical values.
30.4
handbook, halfpage
G
p
(dB)
30
29.6
29.2
28.8
28.4
28
010203051525
f = 882 MHz.
G
p
MBL765
η
PL (W)
Fig.5 CW power gain and efficiency as functions
of load power; typical values.
60
50
40
30
20
10
0
(%)
η
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