Philips BGA6489 User Manual

BGA6489
MMIC wideband medium power amplifier
Rev. 02 — 15 June 2009 Product data sheet
1. Product profile

1.1 General description

The BGA6489 is a silicon Monolithic Microwave Integrated Circuit (MMIC) wideband medium power amplifier with internal matching circuit in a 3-pin SOT89 plastic, low thermal resistance, SMD package.
The BGA6x89 series of medium power gain blocks are resistive feedback Darlington configured amplifiers. Resistive feedback provides large bandwidth with high accuracy.
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling.

1.2 Features

1.3 Applications

n Broadband medium power gain blocks n Small signal high linearity amplifiers n Variable gain and high output power in combination with the BGA2031 n Cellular, PCS and CDPD n IF/RF buffer amplifier n Wireless data SONET n Oscillator amplifier, final PA n Drivers for CATV amplifier
NXP Semiconductors

1.4 Quick reference data

Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
V
D
I
S
|
|s
21
NF noise figure f = 1950 MHz - 3.3 - dB P
L1dB
DC device voltage on pin 1; IS = 78 mA - 5.1 - V DC supply current VS = 8 V; R1 = 39 ;
2
insertion power gain f = 1950 MHz - 16 - dB
load power at 1 dB gain compression

2. Pinning information

Table 2. Pinning
Pin Description Simplified outline Graphic symbol
1 RF_OUT/BIAS 2 GND 3 RF_IN
BGA6489
MMIC wideband medium power amplifier
-78-mA
T
=25°C
j
f = 850 MHz - 20 - dBm f = 1950 MHz - 17 - dBm
13
2

3. Ordering information

Table 3. Ordering information
Type number Package
BGA6489 SC-62 plastic surface-mounted package; collector pad for

4. Marking

Table 4. Marking codes
Type number Marking code
BGA6489 4A
321
Name Description Version
good heat transfer; 3 leads
sym130
SOT89
BGA6489_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 15 June 2009 2 of 13
NXP Semiconductors

5. Limiting values

Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
D
I
S
P
tot
T
stg
T
j
P
D
[1] Tsp is the temperature at the solder point of the ground lead, pin 2.
DC device voltage on pin 1; RF input AC coupled - 6 V DC supply current - 150 mA total power dissipation Tsp≤ 70 °C storage temperature 65 +150 °C junction temperature - 150 °C maximum drive power - 15 dBm

6. Thermal characteristics

Table 6. Thermal characteristics
Symbol Parameter Conditions Typ Unit
R
th(j-sp)
[1] Tsp is the temperature at the solder point of the ground lead, pin 2.
thermal resistance from junction to solder point Tsp≤ 70 °C
BGA6489
MMIC wideband medium power amplifier
[1]
- 800 mW
[1]
100 K/W

7. Characteristics

Table 7. Static characteristics
VS = 8 V; Tj = 25°C; R
Symbol Parameter Conditions Min Typ Max Unit
V
D
I
S
[1] VS= DC operating supply voltage applied to R
Table 8. Characteristics
VS=8V;IS= 78 mA; T Z
L=ZS
Symbol Parameter Conditions Min Typ Max Unit
2
|
|s
21
R
LIN
R
LOUT
[1]
=39
bias
DC device voltage on pin 1; IS=78mA - 5.1 - V supply current 70 78 86 mA
; see Figure10
bias
=25°C; IP3
amb
tone spacing = 1 MHz; PL= 0 dB per tone,R
(out)
bias
=50Ω; unless otherwise specified; see Figure 10.
Insertion power gain f = 850 MHz - 20 - dB
f = 1950 MHz - 16 - dB f = 2500 MHz - 15 - dB
return losses input f = 850 MHz - 14 - dB
f = 1950 MHz - 16 - dB f = 2500 MHz - 19 - dB
return losses output f = 850 MHz - 16 - dB
f = 1950 MHz - 12 - dB f = 2500 MHz - 10 - dB
=39Ω;
BGA6489_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 15 June 2009 3 of 13
NXP Semiconductors
BGA6489
MMIC wideband medium power amplifier
Table 8. Characteristics
VS=8V;IS= 78 mA; T Z
=50Ω; unless otherwise specified; see Figure 10.
L=ZS
…continued
=25°C; IP3
amb
tone spacing = 1 MHz; PL= 0 dB per tone,R
(out)
bias
=39Ω;
Symbol Parameter Conditions Min Typ Max Unit
NF noise figure f = 850 MHz - 3.1 - dB
f = 1950 MHz - 3.3 - dB f = 2500 MHz - 3.4 - dB
K stability factor f = 850 MHz - 1.2 -
f = 2500 MHz - 1.3 -
P
L1dB
load power at 1 dB gain compression f = 850 MHz - 20 - dBm
f = 1950 MHz - 17 - dBm
IP3
input intercept point f = 850 MHz - 13 - dBm
(in)
f = 2500 MHz - 12 - dBm
IP3
output intercept point f = 850 MHz - 33 - dBm
(out)
f = 2500 MHz - 27 - dBm
+0.5
90°
+1
+2
45°135°
1.0
0.8
0.6
+0.2
0
180°
0.2
IS = 78 mA; VS = 8 V; PD = 30 dBm; ZO = 50 .
0.50.2
2.6 GHz
0.5
200 MHz
1
90°
2
Fig 1. Input reflection coefficient (s11); typical values
2
+5
5
10
5
45°135°
mgx400
0.4
0.2
0°
0
1.0
BGA6489_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 15 June 2009 4 of 13
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