Philips BFS520 Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
BFS520
NPN 9 GHz wideband transistor
Product specification File under Discrete Semiconductors, SC14
September 1995
NPN 9 GHz wideband transistor BFS520
FEATURES
High power gain
Low noise figure
High transition frequency
It is intended for wideband applications such as satellite TV tuners, cellular phones, cordless phones, pagers etc., with signal frequencies up to 2 GHz.
handbook, 2 columns
3
Gold metallization ensures excellent reliability
SOT323 envelope.
DESCRIPTION
NPN transistor in a plastic SOT323 envelope.
PINNING
PIN DESCRIPTION
Code: N2 1 base 2 emitter 3 collector
12
Top view
MBC870
Fig.1 SOT323.
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
CBO
V
CES
I
C
P
tot
h
FE
f
T
G
UM
F noise figure I
collector-base voltage open emitter −−20 V collector-emitter voltage RBE=0 −−15 V DC collector current −−70 mA total power dissipation up to Ts=118°C; note 1 −−300 mW DC current gain IC= 20 mA; VCE= 6 V; Tj=25°C 60 120 250 transition frequency IC= 20 mA; VCE= 6 V; f = 1 GHz;
T
=25°C
amb
maximum unilateral power gain Ic= 20 mA; VCE= 6 V; f = 900 MHz;
T
=25°C
amb
= 5 mA; VCE= 6 V; f = 900 MHz;
c
T
=25°C
amb
9 GHz
15 dB
1.1 1.6 dB
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V V V I P T T
CBO CES EBO
C
tot stg j
collector-base voltage open emitter 20 V collector-emitter voltage RBE=0 15 V emitter-base voltage open collector 2.5 V DC collector current 70 mA total power dissipation up to Ts=118°C; note 1 300 mW storage temperature 65 150 °C junction temperature 175 °C
Note
1. T
is the temperature at the soldering point of the collector tab.
s
September 1995 2
NPN 9 GHz wideband transistor BFS520
THERMAL RESISTANCE
SYMBOL PARAMETER CONDITIONS THERMAL RESISTANCE
R
th j-s
Note
is the temperature at the soldering point of the collector tab.
1. T
s
CHARACTERISTICS
=25°C, unless otherwise specified.
T
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
CBO
h
FE
C
e
C
c
C
re
f
T
G
UM
2
S
21
F noise figure Γ
P
L1
ITO third order intercept point note 2 26 dBm
thermal resistance from junction to
up to Ts=118°C; note 1 190 K/W
soldering point
collector cut-off current IE= 0; VCE=6 V −−50 nA DC current gain IC= 20mA; VCE= 6 V 60 120 250 emitter capacitance IC=ic= 0; VEB= 0.5 V; f = 1 MHz 1 pF collector capacitance IE=ie= 0; VCB= 6 V; f = 1 MHz 0.5 pF feedback capacitance IC= 0; VCB= 6 V; f = 1 MHz 0.4 pF transition frequency IC= 20 mA; VCE= 6 V; f = 1 GHz;
T
=25°C
amb
maximum unilateral power gain (note 1)
IC= 20 mA; VCE= 6 V; f = 900 MHz; T
=25°C
amb
= 20 mA; VCE= 6 V; f = 2 GHz;
I
C
T
=25°C
amb
insertion power gain IC= 20 mA; VCE= 6 V; f = 900 MHz;
T
=25°C
amb
output power at 1 dB gain compression
= Γ
s
f = 900 MHz; T
Γ
= Γ
s
f = 900 MHz; T
Γ
= Γ
s
f = 2 GHz; T Ic= 20 mA; VCE= 6 V; RL=50Ω;
f = 900 MHz; T
= 5 mA; VCE=6 V;
opt;IC
=25°C
amb
= 20 mA; VCE=6 V;
opt;IC
=25°C
amb
= 5 mA; VCE=6 V;
opt;IC
=25°C
amb
=25°C
amb
9 GHz
15 dB
9 dB
13 14 dB
1.1 1.6 dB
1.6 2.1 dB
1.9 dB
17 dBm
Notes
1. G
2. I
is the maximum unilateral power gain, assuming S12is zero and
UM
G
UM
= 20 mA; VCE= 6 V; RL=50Ω; f = 900 MHz; T
C
--------------------------------------------------------------
10 log

1S

fp= 900 MHz; fq= 902 MHz; measured at f
2
S
21
2

1S

11
22
dB.=
2
=25°C;
amb
= 898 MHz and at f
(2pq)
September 1995 3
(2qp)
= 904 MHz.
NPN 9 GHz wideband transistor BFS520
400
handbook, halfpage
P
tot
(mW)
300
200
100
0
0 50 100 200
150
Fig.2 Power derating curve.
MRC030 - 1
o
Ts(
C)
200
handbook, halfpage
h
FE
150
100
50
0
2
10
VCE= 6 V; Tj=25°C.
1
10
11010
MRC028
I
(mA)
C
Fig.3 DC current gain as a function of collector
current.
2
0.7
handbook, halfpage
C
re
(pF)
0.6
0.5
0.4
0.3
0.2
0.1
0
0246810
IC= 0; f= 1 MHz.
V (V)
CB
Fig.4 Feedback capacitance as a function of
collector-base voltage.
MRC021
12
handbook, halfpage
f
T
(GHz)
10
8
6
4
2
0
1 10 100
f = 1 GHz; T
amb
=25°C.
V
CE
= 8 V
3 V
IC(mA)
Fig.5 Transition frequency as a function of
collector current.
MRC022
September 1995 4
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