Product specification
Supersedes data of November 1992
1995 Sep 18
Page 2
NXP SemiconductorsProduct specification
Marking code: R2.
Fig.1 SOT323
handbook, 2 columns
3
12
MBC870
Top view
NPN 5 GHz wideband transistorBFR93AW
FEATURES
High power gain
Gold metallization ensures
excellent reliability
SOT323 (S-mini) package.
APPLICATIONS
It is designed for use in RF amplifiers,
mixers and oscillators with signal
frequencies up to 1 GHz.
DESCRIPTION
Silicon NPN transistor encapsulated
in a plastic SOT323 (S-mini) package.
The BFR93AW uses the same crystal
as the SOT23 version, BFR93A.
PINNING
PINDESCRIPTION
1base
2emitter
3collector
QUICK REFERENCE DATA
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
CBO
V
CEO
I
C
P
tot
h
FE
C
re
f
T
G
UM
Fnoise figureI
T
j
collector-base voltageopen emitter15V
collector-emitter voltageopen base12V
collector current (DC)35mA
total power dissipationup to Ts=93C; note 1300mW
DC current gainIC=30mA; VCE=5V4090
feedback capacitanceIC=0; VCE= 5 V; f = 1 MHz;
=25C
T
amb
0.6pF
transition frequencyIC=30mA; VCE=5V; f=500MHz45GHz
maximum unilateral power
gain
IC=30mA; VCE=8V; f=1GHz;
T
=25C
amb
=30mA; VCE=8V; f=2GHz;
I
C
=25C
T
amb
=5mA; VCE= 8 V; f = 1 GHz;
C
=
s
opt
13dB
8dB
1.5dB
junction temperature150C
Note
1. T
1995 Sep 182
is the temperature at the soldering point of the collector pin.
s
Page 3
NXP SemiconductorsProduct specification
Fig.2 Power derating curve.
050100200
200
0
MLB540
150
T ( C)
o
s
P
tot
(mW)
300
400
100
NPN 5 GHz wideband transistorBFR93AW
LIMITING VALUES
In accordance with the Absolu te Maximum Rating System (IEC 134).
SYMBOLPARAMETERCONDITIONMIN.MAX.UNIT
V
CBO
V
CEO
V
EBO
I
C
P
tot
T
stg
T
j
THERMAL CHARACTERISTICS
SYMBOLPARAMETERCONDITIONVALUEUNIT
R
th j-s
collector-base voltageopen emitter15V
collector-emitter voltageopen base12V
emitter-base voltageopen collector2V
collector current (DC)35mA
total power dissipationup to Ts=93C; see Fig.2; note 1300mW
storage temperature65+150C
junction temperature150C
thermal resistance from junction to
up to Ts=93C; note 1190K/W
soldering point
Note to the Limiting values and Thermal characteristics
is the temperature at the soldering point of the collector pin.
is the maximum unilateral power gain, assuming s12 is zero and
UM
1995 Sep 184
Page 5
NXP SemiconductorsProduct specification
Fig.3DC current gain as a function of collector
current; typical values.
VCE=5V.
handbook, halfpage
0102030
120
0
40
80
MCD087
h
FE
I (mA)
C
Fig.4Feedback capacitance as a function of
collector-base voltage; typical values.
IC=0; f=1MHz.
0
1
0
MBG203
48
C
re
(pF)
0.8
0.6
0.4
0.2
1216
VCB (V)
Fig.5Transition frequency as a function
of collector current; typical values.
VCE= 5 V; f = 500 MHz; T
amb
=25C.
4
2
0
MBG204
6
10
2
101
f
T
(GHz)
IC (mA)
NPN 5 GHz wideband transistorBFR93AW
1995 Sep 185
Page 6
NXP SemiconductorsProduct specification
Fig.6Gain as a function of collector current;
typical values.
VCE=8V; f=500MHz.
0
30
20
10
0
1020
MBG202
30
G
UM
MSG
IC (mA)
gain
(dB)
Fig.7Gain as a function of collector current;
typical values.
VCE=8V; f=1GHz.
0
30
20
10
0
1020
MBG201
30
MSG
G
UM
gain
(dB)
IC (mA)
Fig.8Gain as a function of frequency;
typical values.
VCE=8V; IC=10mA.
handbook, halfpage
50
0
10
MBG200
10
2
10
3
10
4
10
20
30
40
f (MHz)
G
UM
G
max
MSG
gain
(dB)
Fig.9Gain as a function of frequency;
typical values.
VCE=8V; IC=30mA.
handbook, halfpage
50
0
10
MBG207
10
2
10
3
10
4
10
20
30
40
f (MHz)
G
UM
G
max
MSG
gain
(dB)
NPN 5 GHz wideband transistorBFR93AW
1995 Sep 186
Page 7
NXP SemiconductorsProduct specification
Fig.10 Minimum noise figure as a function of
collector current; typical values.
VCE=8V.
handbook, halfpage
2
4
2
0
10
MGC901
101
6
1 GHz
500 MHz
f = 2 GHz
F
(dB)
IC (mA)
Fig.11 Minimum noise figure as a function of
collector current; typical values.
VCE=8V.
handbook, halfpage
4
2
0
MGC900
6
f (MHz)
10
4
10
3
10
2
IC = 30 mA
10 mA
5 mA
F
(dB)
Fig.12 Common emitter noise figure circles; typical values.
f=500MHz; VCE=8V; IC=10mA; Zo=50
handbook, full pagewidth
MGC879
00
o
0.2
0.6
0.4
0.8
1.0
1.0
45
o
90
o
135
o
45
o
90
o
135
o
0.5
0
0.2
0.5
1
2
5
2
F = 4 dB
F = 3 dB
F = 2 dB
opt
Γ
F = 1.4 dB
min
0.2
2
15
5
o
180
0.20.5
1
NPN 5 GHz wideband transistorBFR93AW
1995 Sep 187
Page 8
NXP SemiconductorsProduct specification
Fig.13 Common emitter noise figure circles; typical values.
f=1GHz; VCE=8V; IC=10mA; Zo=50
handbook, full pagewidth
MGC880
00
o
0.2
0.6
0.4
0.8
1.0
1.0
45
o
90
o
135
o
45
o
90
o
135
o
1
0.5
1
2
5
215
180
o
2
5
0.5
0.50.2
0.2
F = 2.5 dB
F = 3 dB
F = 4 dB
0.2
opt
Γ
F = 2 dB
min
0
G = 13 dB
ms
Γ
G = 13.8 dB
max
G = 12 dB
G = 11 dB
f=2GHz; VCE=8V; IC=10mA; Zo=50
Fig.14 Common emitter noise figure circles; typical values.
handbook, full pagewidth
MGC881
00
o
0.2
0.6
0.4
0.8
1.0
1.0
45
o
90
o
135
o
45
o
90
o
135
o
1
0.5
1
2
5
215
180
o
2
5
0.5
0.2
0.2
(4)
(3)
(2)
(5)
(6)
(7)
(8)
(1)
0.2
0
0.5
(1)
opt
; F
min
=3dB.
(2) F = 3.5 dB.
(3) F = 4 dB.
(4) F = 5 dB.
(5)
ms;Gmax
=8.1dB.
(6) G = 7 dB.
(7) G = 6 dB.
(8) G = 5 dB.
NPN 5 GHz wideband transistorBFR93AW
1995 Sep 188
Page 9
NXP SemiconductorsProduct specification
Fig.15 Common emitter input reflection coefficient (s11); typical values.
VCE=8V; IC=30mA; Zo=50.
handbook, full pagewidth
MGC878
00
o
0.2
0.6
0.4
0.8
1.0
1.0
45
o
90
o
135
o
45
o
90
o
135
o
1
0.5
0.2
0.5
1
2
5
2
0.2
2
5
5
o
180
0.21
0
0.5
40 MHz
3 GHz
VCE=8V; IC=30mA.
Fig.16 Common emitter forward transmission coefficient (s21); typical values.
handbook, full pagewidth
MGC898
0
o
90
o
135
o
180
o
90
o
5040302010
45
o
135
o
45
o
40 MHz
3 GHz
NPN 5 GHz wideband transistorBFR93AW
1995 Sep 189
Page 10
NXP SemiconductorsProduct specification
Fig.17 Common emitter reverse transmission coefficient (s12); typical values.
VCE=8V; IC=30mA.
handbook, full pagewidth
MGC899
0
o
90
o
135
o
180
o
90
o
0.50.40.30.20.1
45
o
135
o
45
o
40 MHz
3 GHz
VCE=8V; IC=30mA; Zo=50.
Fig.18 Common emitter output reflection coefficient (s22); typical values.
handbook, full pagewidth
MGC877
00
o
0.2
0.6
0.4
0.8
1.0
1.0
45
o
90
o
135
o
180
o
45
o
90
o
135
o
1
0.5
0
0.2
0.5
1
2
0.20.52
40 MHz
3 GHz
0.2
15
5
2
5
NPN 5 GHz wideband transistorBFR93AW
1995 Sep 1810
Page 11
NXP SemiconductorsProduct specification
UNIT
A
1
max
b
p
cD
E
e1HEL
p
Qwv
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.1
1.1
0.8
0.4
0.3
0.25
0.10
2.2
1.8
1.35
1.15
0.65
e
1.3
2.2
2.0
0.23
0.13
0.20.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15
SOT323SC-70
w M
b
p
D
e
1
e
A
B
A
1
L
p
Q
detail X
c
H
E
E
v M
A
AB
y
012 mm
scale
A
X
12
3
Plastic surface-mounted package; 3 leadsSOT323
04-11-04
06-03-16
NPN 5 GHz wideband transistorBFR93AW
PACKAGE OUTLINE
1995 Sep 1811
Page 12
NXP SemiconductorsProduct specification
NPN 5 GHz wideband transistorBFR93AW
DATA SHEET STATUS
DOCUMENT
STATUS
Objective data sheetDevelopmentThis document contains data from the objective specification for product
Preliminary data sheetQualificationThis document contains data from the preliminary specification.
Product data sheetProductionThis document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) desc ribed in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DEFINITIONS
Product specification The information and data
provided in a Product data sheet shall define the
specification of the product as agreed between NXP
Semiconductors and its customer, unless NXP
Semiconductors and customer have explicitly agreed
otherwise in writing. In no event however, shall an
agreement be valid in which the NXP Semiconductors
product is deemed to offer functions and qualities beyond
those described in the Product data sheet.
DISCLAIMERS
Limited warranty and liability Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or consequential
damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any
other legal theory.
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial sale of NXP Semiconductors.
(1)
PRODUCT
STATUS
(2)
DEFINITION
development.
Right to make changes NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication he reof.
Suitability for use NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critical systems or
equipment, nor in applications wher e failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inc l usion and/or use is at
the customer’s own risk.
Applications Applications that ar e described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of customer’s third
party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the ris ks
associated with their applications and products.
1995 Sep 1812
Page 13
NXP SemiconductorsProduct specification
NPN 5 GHz wideband transistorBFR93AW
NXP Semiconductors does not accept any liability related
to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications
or products, or the application or use by customer’s third
party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applicat ions and
products using NXP Semiconductors products in or de r to
avoid a default of the applications and the prod ucts or of
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this
respect.
Limiting values Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operation of the device at these or any other
conditions above those given in the Rec ommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.
Terms and conditions of commercial sale NXP
Semiconductors products are sold subject to the general
terms and conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In cas e an
individual agreement is concluded only the terms and
conditions of the respective agreement shall apply. NXP
Semiconductors hereby expressly objects to applying the
customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Export control This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
Quick reference data The Quick reference data is an
extract of the product data given in t he Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Non-automotive qualified products Unless this data
sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
product is not suitable for automotive use. It is neither
qualified nor tested in accordance with auto motive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified products in automotive equipment or
applications.
In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and
specifications, and (b) whenever customer uses the
product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at
customer’s own risk, and (c) customer fully indemnifies
NXP Semiconductors for any liability, damages or failed
product claims resulting from cus tom er d esign and use o f
the product for automotive applications beyond NXP
Semiconductors’ standard warranty and NXP
Semiconductors’ product specifications.
No offer to sell or license Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights .
1995 Sep 1813
Page 14
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: [email protected]
The information presented in this document does not form part of any quotation or contract, is b elieve d to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property right s.
Printed in The NetherlandsR77/02/pp14Date of release: 1995 Sep 18
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