Philips bfr93aw Datasheet

Page 1
DATA SH EET
DISCRETE SEMICONDUCTORS
BFR93AW
NPN 5 GHz wideband transistor
Product specification Supersedes data of November 1992
1995 Sep 18
Page 2
NXP Semiconductors Product specification
Marking code: R2.
Fig.1 SOT323
handbook, 2 columns
3
12
MBC870
Top view
NPN 5 GHz wideband transistor BFR93AW

FEATURES

High power gainGold metallization ensures
excellent reliability
SOT323 (S-mini) package.

APPLICATIONS

It is designed for use in RF amplifiers, mixers and oscillators with signal frequencies up to 1 GHz.

DESCRIPTION

Silicon NPN transistor encapsulated in a plastic SOT323 (S-mini) package. The BFR93AW uses the same crystal as the SOT23 version, BFR93A.

PINNING

PIN DESCRIPTION
1base 2emitter 3 collector

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
CBO
V
CEO
I
C
P
tot
h
FE
C
re
f
T
G
UM
Fnoise figure I
T
j
collector-base voltage open emitter 15 V collector-emitter voltage open base 12 V collector current (DC) 35 mA total power dissipation up to Ts=93C; note 1 300 mW DC current gain IC=30mA; VCE=5V 40 90 feedback capacitance IC=0; VCE= 5 V; f = 1 MHz;
=25C
T
amb
0.6 pF
transition frequency IC=30mA; VCE=5V; f=500MHz 4 5 GHz maximum unilateral power
gain
IC=30mA; VCE=8V; f=1GHz; T
=25C
amb
=30mA; VCE=8V; f=2GHz;
I
C
=25C
T
amb
=5mA; VCE= 8 V; f = 1 GHz;
C
=
s
opt
13 dB
8 dB
1.5 dB
junction temperature 150 C
Note
1. T
is the temperature at the soldering point of the collector pin.
s
Page 3
NXP Semiconductors Product specification
Fig.2 Power derating curve.
0 50 100 200
200
0
MLB540
150
T ( C)
o
s
P
tot
(mW)
300
400
100
NPN 5 GHz wideband transistor BFR93AW

LIMITING VALUES

In accordance with the Absolu te Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITION MIN. MAX. UNIT
V
CBO
V
CEO
V
EBO
I
C
P
tot
T
stg
T
j

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITION VALUE UNIT
R
th j-s
collector-base voltage open emitter 15 V collector-emitter voltage open base 12 V emitter-base voltage open collector 2V collector current (DC) 35 mA total power dissipation up to Ts=93C; see Fig.2; note 1 300 mW storage temperature 65 +150 C junction temperature 150 C
thermal resistance from junction to
up to Ts=93C; note 1 190 K/W
soldering point
Note to the Limiting values and Thermal characteristics
is the temperature at the soldering point of the collector pin.
1. T
s
Page 4
NXP Semiconductors Product specification
G
UM
10
s
21
2
1s
11
2
–1s
22
2
–
--------------------------------------------------------
dB.log=
NPN 5 GHz wideband transistor BFR93AW

CHARACTERISTICS

T
=25C (unless otherwise specified).
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
CBO
h
FE
C
c
C
e
C
re
f
T
G
UM
F noise figure I
collector leakage current IE=0; VCB=5V 50 nA DC current gain IC=30mA; VCE=5V 40 90 collector capacitance IE=ie=0; VCB=5V; f=1MHz 0.7 pF emitter capacitance IC=ic=0; VEB=0.5V;
2.3 pF
f=1MHz feedback capacitance IC=0; VCE=5V; f=1MHz 0.6 pF transition frequency IC=30mA; VCE=5V;
45 GHz
f=500MHz maximum unilateral power
gain; note 1
IC=30mA; VCE=8V;
f=1GHz; T
=30mA; VCE=8V;
I
C
f=2GHz; T
=5mA; VCE=8V;
C
f=1GHz;
=5mA; VCE=8V;
I
C
f=2GHz;
amb
amb
s
s
=
=
=25C
=25C
opt
opt
13 dB
8 dB
1.5 dB
2.1 dB
Note
1. G
is the maximum unilateral power gain, assuming s12 is zero and
UM
Page 5
NXP Semiconductors Product specification
Fig.3 DC current gain as a function of collector
current; typical values.
VCE=5V.
handbook, halfpage
0102030
120
0
40
80
MCD087
h
FE
I (mA)
C
Fig.4 Feedback capacitance as a function of
collector-base voltage; typical values.
IC=0; f=1MHz.
0
1
0
MBG203
48
C
re
(pF)
0.8
0.6
0.4
0.2
12 16
VCB (V)
Fig.5 Transition frequency as a function
of collector current; typical values.
VCE= 5 V; f = 500 MHz; T
amb
=25C.
4
2
0
MBG204
6
10
2
101
f
T
(GHz)
IC (mA)
NPN 5 GHz wideband transistor BFR93AW
Page 6
NXP Semiconductors Product specification
Fig.6 Gain as a function of collector current;
typical values.
VCE=8V; f=500MHz.
0
30
20
10
0
10 20
MBG202
30
G
UM
MSG
IC (mA)
gain (dB)
Fig.7 Gain as a function of collector current;
typical values.
VCE=8V; f=1GHz.
0
30
20
10
0
10 20
MBG201
30
MSG
G
UM
gain (dB)
IC (mA)
Fig.8 Gain as a function of frequency;
typical values.
VCE=8V; IC=10mA.
handbook, halfpage
50
0
10
MBG200
10
2
10
3
10
4
10
20
30
40
f (MHz)
G
UM
G
max
MSG
gain (dB)
Fig.9 Gain as a function of frequency;
typical values.
VCE=8V; IC=30mA.
handbook, halfpage
50
0
10
MBG207
10
2
10
3
10
4
10
20
30
40
f (MHz)
G
UM
G
max
MSG
gain (dB)
NPN 5 GHz wideband transistor BFR93AW
Page 7
NXP Semiconductors Product specification
Fig.10 Minimum noise figure as a function of
collector current; typical values.
VCE=8V.
handbook, halfpage
2
4
2
0
10
MGC901
101
6
1 GHz
500 MHz
f = 2 GHz
F
(dB)
IC (mA)
Fig.11 Minimum noise figure as a function of
collector current; typical values.
VCE=8V.
handbook, halfpage
4
2
0
MGC900
6
f (MHz)
10
4
10
3
10
2
IC = 30 mA
10 mA
5 mA
F
(dB)
Fig.12 Common emitter noise figure circles; typical values.
f=500MHz; VCE=8V; IC=10mA; Zo=50
handbook, full pagewidth
MGC879
00
o
0.2
0.6
0.4
0.8
1.0
1.0
45
o
90
o
135
o
45
o
90
o
135
o
0.5
0
0.2
0.5
1
2
5
2
F = 4 dB
F = 3 dB
F = 2 dB
opt
Γ
F = 1.4 dB
min
0.2
2
1 5
5
o
180
0.2 0.5
1
NPN 5 GHz wideband transistor BFR93AW
Page 8
NXP Semiconductors Product specification
Fig.13 Common emitter noise figure circles; typical values.
f=1GHz; VCE=8V; IC=10mA; Zo=50
handbook, full pagewidth
MGC880
00
o
0.2
0.6
0.4
0.8
1.0
1.0
45
o
90
o
135
o
45
o
90
o
135
o
1
0.5
1
2
5
21 5
180
o
2
5
0.5
0.50.2
0.2
F = 2.5 dB
F = 3 dB
F = 4 dB
0.2
opt
Γ
F = 2 dB
min
0
G = 13 dB
ms
Γ
G = 13.8 dB
max
G = 12 dB
G = 11 dB
f=2GHz; VCE=8V; IC=10mA; Zo=50
Fig.14 Common emitter noise figure circles; typical values.
handbook, full pagewidth
MGC881
00
o
0.2
0.6
0.4
0.8
1.0
1.0
45
o
90
o
135
o
45
o
90
o
135
o
1
0.5
1
2
5
21 5
180
o
2
5
0.5
0.2
0.2
(4)
(3)
(2)
(5)
(6)
(7)
(8)
(1)
0.2
0
0.5
(1)
opt
; F
min
=3dB. (2) F = 3.5 dB. (3) F = 4 dB. (4) F = 5 dB. (5)
ms;Gmax
=8.1dB. (6) G = 7 dB. (7) G = 6 dB. (8) G = 5 dB.
NPN 5 GHz wideband transistor BFR93AW
Page 9
NXP Semiconductors Product specification
Fig.15 Common emitter input reflection coefficient (s11); typical values.
VCE=8V; IC=30mA; Zo=50.
handbook, full pagewidth
MGC878
00
o
0.2
0.6
0.4
0.8
1.0
1.0
45
o
90
o
135
o
45
o
90
o
135
o
1
0.5
0.2
0.5
1
2
5
2
0.2
2
5
5
o
180
0.2 1
0
0.5
40 MHz
3 GHz
VCE=8V; IC=30mA.
Fig.16 Common emitter forward transmission coefficient (s21); typical values.
handbook, full pagewidth
MGC898
0
o
90
o
135
o
180
o
90
o
50 40 30 20 10
45
o
135
o
45
o
40 MHz
3 GHz
NPN 5 GHz wideband transistor BFR93AW
Page 10
NXP Semiconductors Product specification
Fig.17 Common emitter reverse transmission coefficient (s12); typical values.
VCE=8V; IC=30mA.
handbook, full pagewidth
MGC899
0
o
90
o
135
o
180
o
90
o
0.5 0.4 0.3 0.2 0.1
45
o
135
o
45
o
40 MHz
3 GHz
VCE=8V; IC=30mA; Zo=50.
Fig.18 Common emitter output reflection coefficient (s22); typical values.
handbook, full pagewidth
MGC877
00
o
0.2
0.6
0.4
0.8
1.0
1.0
45
o
90
o
135
o
180
o
45
o
90
o
135
o
1
0.5
0
0.2
0.5
1
2
0.2 0.5 2
40 MHz
3 GHz
0.2
1 5
5
2
5
NPN 5 GHz wideband transistor BFR93AW
1995 Sep 18 10
Page 11
NXP Semiconductors Product specification
UNIT
A
1
max
b
p
cD
E
e1HEL
p
Qwv
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.1
1.1
0.8
0.4
0.3
0.25
0.10
2.2
1.8
1.35
1.15
0.65
e
1.3
2.2
2.0
0.23
0.13
0.20.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15
SOT323 SC-70
w M
b
p
D
e
1
e
A
B
A
1
L
p
Q
detail X
c
H
E
E
v M
A
AB
y
0 1 2 mm
scale
A
X
12
3
Plastic surface-mounted package; 3 leads SOT323
04-11-04 06-03-16
NPN 5 GHz wideband transistor BFR93AW

PACKAGE OUTLINE

1995 Sep 18 11
Page 12
NXP Semiconductors Product specification
NPN 5 GHz wideband transistor BFR93AW

DATA SHEET STATUS

DOCUMENT
STATUS
Objective data sheet Development This document contains data from the objective specification for product
Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) desc ribed in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
DEFINITIONS Product specification The information and data
provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
DISCLAIMERS Limited warranty and liability Information in this
document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.
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Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.
(1)
PRODUCT
STATUS
(2)
DEFINITION
development.
Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication he reof.
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Applications Applications that ar e described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the ris ks associated with their applications and products.
1995 Sep 18 12
Page 13
NXP Semiconductors Product specification
NPN 5 GHz wideband transistor BFR93AW
NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applicat ions and products using NXP Semiconductors products in or de r to avoid a default of the applications and the prod ucts or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.
Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Rec ommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.
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1995 Sep 18 13
Page 14
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Printed in The Netherlands R77/02/pp14 Date of release: 1995 Sep 18
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