Philips bfq540_n Datasheet

Page 1
BFQ540
NPN wideband transistor
Rev. 04 — 25 September 2007 Product data sheet
IMPORTANT NOTICE
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depending on the version)
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NXP Semiconductors
Page 2
NXP Semiconductors Product specification
Rev. 04 - 25 September 2007
2 of 8
NPN wideband transistor BFQ540

FEATURES

• High gain
• High output voltage

DESCRIPTION

NPN wideband transistor inaSOT89 plastic package.
• Low noise
• Gold metallization ensures
excellent reliability
• Low thermal resistance.

PINNING

PIN DESCRIPTION
1 emitter
321
2 collector

APPLICATIONS

3 base
• VHF, UHF and CATV amplifiers.
Marking code: N4.
Fig.1 SOT89.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
CBO
V
CES
V
EBO
I
C
P
tot
h
FE
f
T
s
21
F noise figure I
collector-base voltage open emitter −−20 V collector-emitter voltage RBE=0 −−15 V collector-base voltage open collector −−2V collector current (DC) −−120 mA total power dissipation Ts≤ 60 °C; note 1 −−1.2 W DC current gain IC= 40 mA; VCE=8V; Tj=25°C 100 120 250 transition frequency IC= 40 mA; VCE= 8 V; f = 1 GHz;
T
=25°C
amb
insertion power gain I
2
= 40 mA; VCE=8V;
C
f = 900 MHz; T
= 40 mA; VCE=8V;
C
amb
f = 900 MHz; ΓS= Γ
=25°C
opt
− 9 − GHz
12 13 − dB
− 1.9 2.4 dB
Note
1. T
is the temperature at the soldering point of the collector pin.
s
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NXP Semiconductors Product specification
Rev. 04 - 25 September 2007
3 of 8
NPN wideband transistor BFQ540

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CES
V
EBO
I
C
P
tot
T
stg
T
j

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-s
collector-base voltage open emitter − 20 V collector-emitter voltage RBE=0 − 15 V emitter-base voltage open collector − 2V collector current (DC) − 120 mA total power dissipation Ts≤ 60 °C − 1.2 W storage temperature −65 +150 °C operating junction temperature − 175 °C
thermal resistance from junction
Ts≤ 60 °C; P
= 1.2 W 95 K/W
tot
to soldering point
1.4
P
tot
(W)
1.2
1.0
0.8
0.6
0.4
0.2
0
0 50 100 200
VCE≤ 9V.
Fig.2 Power derating curve.
150
Tj (
MBG241
o
C)
3
10
handbook, halfpage
I
C
(mA)
2
10
10
1
10 10
Fig.3 SOAR.
VCE (V)
MBG244
2
Page 4
NXP Semiconductors Product specification
Rev. 04 - 25 September 2007
4 of 8
NPN wideband transistor BFQ540

CHARACTERISTICS

Tj=25°C unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)CBO
V
(BR)CES
V
(BR)EBO
I
CBO
I
EBO
h
FE
f
T
C
e
C
re
s
21
V
o
d
2
F noise figure I
collector-base breakdown voltage open emitter; IC=10µA; IE=0 20 −−V collector-emitter breakdown voltage RBE= 0; IC=40µA15−−V emitter-base breakdown voltage IE= 100 µA; IC=0 2 −−V collector-base leakage current VCB=8V; IE=0 −−50 nA emitter-base leakage current VCB=1V; IC=0 −−200 nA DC current gain IC= 40 mA; VCE= 8 V 100 120 250 transition frequency IC= 40 mA; VCE=8V;
− 9 − GHz
fm= 1 GHz emitter capacitance IC=ie= 0; VEB= 0.5 V; f = 1 MHz − 2 − pF feedback capacitance IC= 0; VCE=8V; f=1MHz − 0.9 − pF insertion power gain I
2
= 40 mA; VCE=8V;
C
f = 900 MHz; T
amb
=25°C
12 13 − dB
output voltage note 1 − 500 − mV
note 2 − 350 − mV second order intermodulation
note 3 −−−53 dB distortion
= 40 mA; VCE=8V;
C
f = 900 MHz; ΓS= Γ
opt
− 1.9 2.4 dB
Notes
1. d
= −60 dB (DIN45004B); VCE= 8 V; IC= 40 mA; RL=50Ω;
im
Vp=Vo; Vq=Vo−6 dB; Vr=Vo−6 dB; fp= 795.25 MHz; fq= 803.25 MHz; fr= 805.5 MHz; measured at fp+fq−fr= 793.25 MHz.
2. dim= −60 dB (DIN 45004B); IC= 40 mA; VCE= 8 V; RL=50Ω; Vp=Vq=Vo; fp= 806 MHz; fq= 810 MHz; measured at 2fp− fq= 802 MHz.
3. IC= 40 mA; VCE= 8 V; RL=50Ω; Vp=Vq= 225 mV; fp= 250 MHz; fq= 560 MHz; measured at fp+fq= 810 MHz.
Page 5
NXP Semiconductors Product specification
Rev. 04 - 25 September 2007
5 of 8
NPN wideband transistor BFQ540
1.0
handbook, halfpage
C
re
(pF)
0.8
0.6
0.4
0.2
0
04812
IC= 0; f = 1 MHz.
VCB (V)
Fig.4 Feedback capacitance as a function of
collector-base voltage; typical values.
MRA688
12
handbook, halfpage
f
T
(GHz)
8
4
0
−1
10
f = 1 GHz; T
amb
11010
=25°C.
IC (mA)
Fig.5 Transition frequency as a function of
collector current; typical values.
MRA689
V
= 8V
CE
VCE = 4V
2
20
handbook, halfpage
d
im
(dB)
30
40
50
60
70
10 60
VCE= 8 V; Vo= 475 mV; RL=50Ω. fp+fq−fr= 793.25 MHz; T
20 30 40 50
amb
=25°C.
MBG242
IC (mA)
Fig.6 Intermodulation distortion as a function of
collector current; typical values.
20
handbook, halfpage
d
2
(dB)
30
40
50
60
70
10 60
VCE= 8 V; Vo= 225 mV; RL=50Ω; fp+fq= 810 MHz;
=25°C.
T
amb
20 30 40 50
MBG243
IC (mA)
Fig.7 Second order intermodulation distortion as
a function of collector current; typical values.
Page 6
NXP Semiconductors Product specification
Rev. 04 - 25 September 2007
6 of 8
NPN wideband transistor BFQ540

PACKAGE OUTLINE

Plastic surface-mounted package; collector pad for good heat transfer; 3 leads SOT89
w M
D
b
p3
123
b
p2
B
b
p1
e
1
e
B
A
E
L
p
H
E
c
DIMENSIONS (mm are the original dimensions)
UNIT
mm
OUTLINE VERSION
SOT89 TO-243 SC-62
1.6
1.4
0 2 4 mm
scale
A
p1
0.48
0.35
p2
0.53
0.40
IEC JEDEC JEITA
1.8
1.4
p3
c
0.44
0.23
D
4.6
4.4
REFERENCES
b
b
b
2.6
2.4
e
3.0
e
1.5
H
1
E
4.25
3.75
E
L
1.2
0.8
w
p
0.13
EUROPEAN
PROJECTION
ISSUE DATE
06-03-16 06-08-29
Page 7
NXP Semiconductors
Rev. 04 - 25 September 2007
7 of 8

Legal information

Data sheet status

BFQ540
NPN wideband transistor
Document status
Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s)described in this document may havechanged since this document was published and maydiffer in case of multiple devices. The latest product status
information is available on the Internet at URL
[1][2]
Product status
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title.A short data sheet is intended for quickreference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

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General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.
Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
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[3]
http://www.nxp.com.
Definition
malfunction ofa NXP Semiconductors product canreasonably be expectedto result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.
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Page 8
NXP Semiconductors
BFQ540
NPN wideband transistor

Revision history

Revision history
Document ID Release date Data sheet status Change notice Supersedes
BFQ540_N_4 20070925 Product data sheet - BFQ540_3 Modifications: BFQ540_3
(9397 750 07064) BFQ540_2
(9397 750 04296) BFQ540_1 19950904 Product specification - -
• Fig. 1 and package outline updated
20000523 Product specification - BFQ540_2
19980827 Product specification - BFQ540_1
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007. All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected]
Date of release: 25 September 2007
Document identifier: BFQ540_N_4
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