Philips BFQ256A, BFQ256 Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
BFQ256; BFQ256A
PNP video transistors
Product specification Supersedes data of November 1992 File under Discrete Semiconductors, SC05
1997 Oct 02
Philips Semiconductors Product specification
PNP video transistors BFQ256; BFQ256A

FEATURES

High breakdown voltages
Low output capacitance
High gain bandwidth

DESCRIPTION

PNP video transistor in a SOT223 plastic package. NPN complements: BFQ236 and BFQ236A.
age
4
Good thermal stability
Gold metallization ensures
excellent reliability
Surface mounting.

APPLICATIONS

Buffer/driver in high-resolution colour graphics monitors.

PINNING

PIN DESCRIPTION
1 emitter 2 base 3 emitter 4 collector
123
Top view
MSB002 - 1
Fig.1 Simplified outline
(SOT223).

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
CBO
collector-base voltage open emitter
BFQ256 −−−100 V BFQ256A −−−115 V
V
CER
collector-emitter voltage RBE= 100
BFQ256 −−−95 V BFQ256A −−−110 V
I
C
P
tot
h
FE
f
T
collector current (DC) −−−300 mA total power dissipation Ts≤ 115 °C; note 1 −−2W DC current gain IC= 50 mA; VCE= 10 V 20 30 transition frequency IC= 50 mA; VCE= 10 V; f = 100 MHz
BFQ256 1 1.3 GHz BFQ256A 0.8 1.2 GHz
Note
is the temperature at the soldering point of the collector lead.
1. T
s
Philips Semiconductors Product specification
PNP video transistors BFQ256; BFQ256A

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
CER
V
EBO
I
C
P
tot
T
stg
T
j
collector-base voltage open emitter
BFQ256 −−100 V BFQ256A −−115 V
collector-emitter voltage open base
BFQ256 −−65 V BFQ256A −−95 V
collector-emitter voltage RBE= 100
BFQ256 −−95 V
BFQ256A −−110 V emitter-base voltage open collector −−3V collector current (DC) −−300 mA total power dissipation Ts≤ 115 °C; note 1; see Fig.3 2W storage temperature 65 +150 °C junction temperature 175 °C
Note
is the temperature at the soldering point of the collector lead.
1. T
s

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-s
thermal resistance from junction to soldering point Ts≤ 115 °C; P
=2W;
tot
30 K/W
notes 1 and 2
Notes
1. Ts is the temperature at the soldering point of the collector lead.
2. Device mounted on a printed-circuit board measuring 40 × 40 × 1 mm (collector pad 35 × 17 mm).
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