The BF1206F is a combination of two different dual gate MOSFET amplifiers with shared
source and gate2 leads.
The source and substrate are interconnected. Internal bias circuits enable Direct Current
(DC) stabilization and a very good cross-modulation performance during Automatic Gain
Control (AGC).Integrateddiodesbetweenthegatesandsourceprotectagainstexcessive
input voltage surges. The transistor is encapsulated in a SOT666 micro-miniature plastic
package.
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features
■ Two low noise gain controlled amplifiers in a single package
■ Superior cross-modulation performance during AGC
■ High forward transfer admittance
■ High forward transfer admittance to input capacitance ratio
■ Suited for 3 volt applications
1.3 Applications
■ Gain controlled low noise amplifiers for Very High Frequency (VHF) and Ultra High
Frequency (UHF) applications with 3 V supply voltage, such as digital and analog
television tuners
Page 2
Philips Semiconductors
1.4 Quick reference data
Table 1:Quick reference data
Per MOSFET unless otherwise specified.
Symbol ParameterConditionsMin Typ Max Unit
V
DS
I
D
|forward transfer admittanceID=4mA
|y
fs
C
iss(G1)
NFnoise figureI
Xmodcross modulationinput level for k = 1 % at
BF1206F
Dual N-channel dual gate MOSFET
drain-source voltage (DC)--6V
drain current (DC)--30mA
amplifier A172232mS
amplifier B172232mS
input capacitance at gate1ID= 4 mA; f = 100 MHz
amplifier A-2.42.9pF
amplifier B-1.72.2pF
= 4 mA
D
amplifier A; f = 400 MHz-1.01.6dB
amplifier B; f = 800 MHz-1.01.6dB
40 dB AGC
amplifier A9297-dBµV
amplifier B9398-dBµV
2.Pinning information
Table 2:Discrete pinning
PinDescriptionSimplified outlineSymbol
1gate1 (AMP A)
2source
3gate1 (AMP B)
4drain (AMP B)
5drain (AMP A)
6gate2
Product data sheetRev. 01 — 30 January 20062 of 20
Page 3
Philips Semiconductors
4.Marking
Table 4:Marking
Type numberMarking code
BF1206F2N
5.Limiting values
Table 5:Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
SymbolParameterConditionsMinMaxUnit
Per MOSFET
V
DS
I
D
I
G1
I
G2
P
tot
T
stg
T
j
[1] Tsp is the temperature at the solder point of the source lead.
BF1206F
Dual N-channel dual gate MOSFET
drain-source voltage (DC)-6V
drain current (DC)-30mA
gate1 current-±10mA
gate2 current-±10mA
total power dissipationTsp≤ 107 °C
storage temperature−65+150°C
junction temperature-150°C
Product data sheetRev. 01 — 30 January 200618 of 20
Page 19
Philips Semiconductors
12. Data sheet status
BF1206F
Dual N-channel dual gate MOSFET
Level Data sheet status
IObjective dataDevelopmentThis data sheet contains data from the objective specification for product development. Philips
IIPreliminary dataQualificationThis data sheet contains data from the preliminary specification. Supplementary data will be published
IIIProduct dataProductionThis data sheet contains data from the product specification. Philips Semiconductors reserves the
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
[1]
Product status
13. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
makes no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
[2] [3]
Definition
Semiconductors reserves the right to change the specification in any manner without notice.
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makesnorepresentations or warrantiesthat theseproducts are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
15. Trademarks
14. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
Notice — All referenced brands, product names, service names and
trademarks are the property of their respective owners.
16. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: [email protected]
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Published in The Netherlands
Date of release: 30 January 2006
BF1206F_1
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