Philips BDV65B, BDV64B Service Manual

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BDV65B(NPN), BDV64B(PNP)
Complementary Silicon Plastic Power Darlingtons
amplifier applications.
High DC Current Gain HFE = 1000 (min.) @ 5 Adc
Monolithic Construction with Builtin Base Emitter Shunt Resistors
PbFree Packages are Available*
MAXIMUM RATINGS
Rating
CollectorEmitter Voltage
CollectorBase Voltage
EmitterBase Voltage
Collector Current Continuous
Peak
Base Current
Total Device Dissipation @ TC = 25_C Derate above 25_C
Operating and Storage Junction Temperature Range
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Case
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
Symbol
V
CEO
V
CB
V
EB
I
C
I
B
P
D
TJ, T
stg
Symbol
R
q
JC
Max
100
100
5.0
10 20
0.5
125
1.0
65 to
+150
Max
1.0
Unit
Vdc
Vdc
Vdc
Adc
Adc
W
W/_C
_C
Unit
_C/W
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10 AMPERE DARLINGTON
COMPLEMENTARY SILICON
POWER TRANSISTORS
6080100120 VOLTS,
125 WATTS
NPN PNP
COLLECTOR 2,4
BASE
1
EMITTER 3
MARKING DIAGRAM
AYWW
BDV6xBG
BASE
1
1
2
COLLECTOR 2
EMITTER 3
BDV65B BDV64B
SOT93
(TO218)
CASE 340D
3
© Semiconductor Components Industries, LLC, 2008
September, 2008 − Rev. 13
A = Assembly Location Y = Year WW = Work Week G=Pb−Free Package BDV6xB = Device Code
x = 4 or 5
ORDERING INFORMATION
Device Package Shipping
BDV65B SOT93 30 Units / Rail
BDV65BG SOT93
(PbFree)
BDV64B SOT93 30 Units / Rail
BDV64BG SOT93
(PbFree)
1 Publication Order Number:
30 Units / Rail
30 Units / Rail
BDV65B/D
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1.0
0.8
0.6
0.4
DERATING FACTOR
0.2
ELECTRICAL CHARACTERISTICS
Characteristic
OFF CHARACTERISTICS
CollectorEmitter Sustaining Voltage (1)
(I
= 30 mAdc, IB = 0)
C
Collector Cutoff Current
(V
= 50 Vdc, IB = 0)
CE
Collector Cutoff Current
(V
= 100 Vdc, IE = 0)
CB
Collector Cutoff Current
(V
= 50 Vdc, IE = 0, TC = 150_C)
CB
Emitter Cutoff Current
(V
= 5.0 Vdc, IC = 0)
BE
ON CHARACTERISTICS
DC Current Gain
(I
= 5.0 Adc, VCE = 4.0 Vdc)
C
CollectorEmitter Saturation Voltage
(I
= 5.0 Adc, IB = 0.02 Adc)
C
BaseEmitter Saturation Voltage
(I
= 5.0 Adc, VCE = 4.0 Vdc)
C
BDV65B (NPN), BDV64B (PNP)
0
0 25 50 100 125 150
TC, CASE TEMPERATURE (°C)
Figure 1. Power Derating
75
Symbol
V
CEO(sus)
I
CEO
I
CBO
I
CBO
I
EBO
h
FE
V
CE(sat)
V
BE(on)
Min
100
1000
Max
1.0
0.4
2.0
5.0
2.0
2.5
Unit
Vdc
mAdc
mAdc
mAdc
mAdc
Vdc
Vdc
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2
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BDV65B (NPN), BDV64B (PNP)
NPN PNP
VCE = 4 V
10K
10K
1K
, DC CURRENT GAIN
FE
h
1K
4
0.1 1
Figure 2. DC Current Gain
10
1
V, VOLTAGE (V)
0.1
0.1
V
BE(sat)
IC, COLLECTOR CURRENT (A)
@ IC/IB = 250
1
I
, COLLECTOR CURRENT (A)
C
Figure 4. “On” Voltages
, DC CURRENT GAIN
FE
h
10
1
0.1 1 I
, COLLECTOR CURRENT (A)
C
10
Figure 3. DC Current Gain
10
1
V, VOLTAGE (V)
0.1
10
0.1 101
V
BE(sat)
@ IC/IB = 250
I
, COLLECTOR CURRENT (A)
C
Figure 5. “On” Voltages
100
50
20
10
, COLLECTOR CURRENT (A)
C
I
5
1
1
SECONDARY BREAKDOWN LIMITED @ T THERMAL LIMIT @ T BONDING WIRE LIMIT
V
, COLLECTOR-EMITTER VOLTAGE (V)
CE
v 150°C
J
= 25°C
C
BDV65B, BDV64B
10 50 100
5.0 ms
dc
Figure 6. Active Region Safe Operating Area
100 μs
1.0 ms
a transistor: average junction temperature and second breakdown. Safe operating area curves indicate I
C
V
CE
limits of the transistor that must be observed for reliable operation i.e., the transistor must not be subjected to greater dissipation than the curves indicate.
There are two limitations on the power handling ability of
The data of Figure 6 is based on T
= 150_C, TC is
J(pk)
variable depending on conditions. Second breakdown pulse limits are valid for duty cycles to 10% provided T v 150_C. T
may be calculated from the data in
J(pk)
J(pk)
Figure 7. At high case temperatures, thermal limitations will reduce the power that can be handled to values less than the
30
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limitations imposed by second breakdown.
3
Page 4
1.0
0
0.5
BDV65B (NPN), BDV64B (PNP)
D = 0.5
0.2
0.1
(NORMALIZED)
0.05
0.03
r(t), TRANSIENT THERMAL RESISTANCE
0.01
0.2
0.05
0.02
0.01
0.1
(SINGLE PULSE)
P
(pk)
t
1
t
2
DUTY CYCLE, D = t1/t
Z
= r(t) R
θ
JC(t)
R
θ
JC
θ
JC
= 1.0°C/W MAX
D CURVES APPLY FOR POWER PULSE TRAIN SHOWN
2
READ TIME AT t T
- TC = P
J(pk)
1
(pk)
Z
θ
0.01 0.05 0.1 0.5 1.0 5 10 50 100 100 t, TIME (ms)
Figure 7. Thermal Response
PACKAGE DIMENSIONS
SOT93 (TO−218)
CASE 340D02
ISSUE E
C
B
U
L
S
K
4
123
Q
E
A
D
J
H
V
G
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
DIM MIN MAX MIN MAX
A --- 20.35 --- 0.801 B 14.70 15.20 0.579 0.598 C 4.70 4.90 0.185 0.193 D 1.10 1.30 0.043 0.051 E 1.17 1.37 0.046 0.054
G 5.40 5.55 0.213 0.219
H 2.00 3.00 0.079 0.118 J 0.50 0.78 0.020 0.031 K 31.00 REF 1.220 REF L --- 16.20 --- 0.638
Q 4.00 4.10 0.158 0.161
S 17.80 18.20 0.701 0.717 U 4.00 REF 0.157 REF V 1.75 REF 0.069
INCHESMILLIMETERS
JC(t)
500
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BDV65B/D
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