Philips BCX55-16 Datasheet
DISCRETE SEMICONDUCTORS
DATA SH EET
ok, halfpage
M3D109
BCX54; BCX55; BCX56
NPN medium power transistors
Product specification
Supersedes data of 1997 Mar 24
1999 Apr 19
Philips Semiconductors Product specification
NPN medium power transistors BCX54; BCX55; BCX56
FEATURES
• High current (max. 1 A)
• Low voltage (max. 80 V).
APPLICATIONS
• Driver stages of audio and video amplifiers.
DESCRIPTION
NPN medium power transistor in a SOT89 plastic
package. PNP complements: BCX51, BCX52 and BCX53.
MARKING
TYPE
NUMBER
MARKING
CODE
TYPE
NUMBER
MARKING
CODE
BCX54 BA BCX55-16 BM
BCX54-10 BC BCX56 BH
BCX54-16 BD BCX56-10 BK
BCX55 BE BCX56-16 BL
BCX55-10 BG
PINNING
PIN DESCRIPTION
1 emitter
2 collector
3 base
handbook, halfpage
123
Bottom view
MAM296
Fig.1 Simplified outline (SOT89) and symbol.
2
3
1
1999 Apr 19 2
Philips Semiconductors Product specification
NPN medium power transistors BCX54; BCX55; BCX56
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL P ARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
BM
P
tot
T
stg
T
j
T
amb
collector-base voltage open emitter
BCX54 − 45 V
BCX55 − 60 V
BCX56 − 100 V
collector-emitter voltage open base
BCX54 − 45 V
BCX55 − 60 V
BCX56 − 80 V
emitter-base voltage open collector − 5V
collector current (DC) − 1A
peak collector current − 1.5 A
peak base current − 0.2 A
total power dissipation T
≤ 25 °C; note 1 − 1.3 W
amb
storage temperature −65 +150 °C
junction temperature − 150 °C
operating ambient temperature −65 +150 °C
Note
1. Device mounted on a printed-circuit board, single sided copper, tinplated, mounting pad for collector 6 cm
For other mounting conditions, see
“Thermal considerations for SOT89 in the General Part of associated Handbook”.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
R
th j-a
th j-s
thermal resistance from junction to ambient note 1 94 K/W
thermal resistance from junction to soldering point 14 K/W
Note
1. Device mounted on a printed-circuit board, single sided copper, tinplated, mounting pad for collector 6 cm2.
For other mounting conditions, see
“Thermal considerations for SOT89 in the General Part of associated Handbook”.
2
.
1999 Apr 19 3
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