Philips BCX53-16, BCX53-10, BCX53, BCX52-10, BCX51-16 Datasheet
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DISCRETE SEMICONDUCTORS
DATA SH EET
ook, halfpage
M3D109
BCX51; BCX52; BCX53
PNP medium power transistors
Product specification
Supersedes data of 1997 Jul 04
1999 Apr 19
Philips Semiconductors Product specification
PNP medium power transistors BCX51; BCX52; BCX53
FEATURES
• High current (max. 1 A)
• Low voltage (max. 80 V).
APPLICATIONS
• Medium power general purposes
• Driver stages of audio amplifiers.
DESCRIPTION
PNP medium power transistor in a SOT89 plastic
package. NPN complements: BCX54, BCX55 and BCX56.
MARKING
TYPE
NUMBER
MARKING
CODE
TYPE
NUMBER
MARKING
CODE
BCX51 AA BCX52-16 AM
BCX51-10 AC BCX53 AH
BCX51-16 AD BCX53-10 AK
BCX52 AE BCX53-16 AL
BCX52-10 AG
PINNING
PIN DESCRIPTION
1 emitter
2 collector
3 base
handbook, halfpage
123
Bottom view
MAM297
Fig.1 Simplified outline (SOT89) and symbol.
2
3
1
1999 Apr 19 2
Philips Semiconductors Product specification
PNP medium power transistors BCX51; BCX52; BCX53
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL P ARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
BM
P
tot
T
stg
T
j
T
amb
collector-base voltage open emitter
BCX51 −−45 V
BCX52 −−60 V
BCX53 −−100 V
collector-emitter voltage open base
BCX51 −−45 V
BCX52 −−60 V
BCX53 −−80 V
emitter-base voltage open collector −−5V
collector current (DC) −−1A
peak collector current −−1.5 A
peak base current −−200 mA
total power dissipation T
≤ 25 °C; note 1 − 1.3 W
amb
storage temperature −65 +150 °C
junction temperature − 150 °C
operating ambient temperature −65 +150 °C
Note
1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 6 cm
For other mounting conditions, see
“Thermal considerations for SOT89 in the General Part of associated Handbook”.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
R
th j-a
th j-s
thermal resistance from junction to ambient note 1 94 K/W
thermal resistance from junction to soldering point note 1 14 K/W
Note
1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 6 cm2.
For other mounting conditions, see
“Thermal considerations for SOT89 in the General Part of associated Handbook”.
2
.
1999 Apr 19 3
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