Philips BAS35, BAS31, BAS29 Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
ook, halfpage
M3D088
BAS29; BAS31; BAS35
General purpose controlled avalanche (double) diodes
Product specification Supersedes data of 1996 Sep 10
1999 May 21
Philips Semiconductors Product specification
General purpose controlled avalanche (double) diodes
FEATURES
Small plastic SMD package
Switching speed: max. 50 ns
General application
Continuous reverse voltage:
max. 90 V
Repetitive peak reverse voltage: max. 110 V
Repetitive peak forward current: max. 600 mA
Repetitive peak reverse current: max. 600 mA.
APPLICATIONS
General purpose switching in e.g. surface mounted circuits.
DESCRIPTION
General purpose switching diodes fabricated in planar technology, and encapsulated in small rectangular plastic SMD SOT23 packages. The BAS29 consists of a single diode. The BAS31 has two diodes in series. The BAS35 has two diodes with a common anode.
MARKING
PINNING
PIN
1 anode anode cathode (k1) 2 not connected cathode cathode (k2) 3 cathode common connection common anode
handbook, halfpage
a. Simplified outline. c. BAS31 diode.
2
n.c.
b. BAS29 diode. d. BAS35 diode.
BAS29; BAS31; BAS35
DESCRIPTION
BAS29 BAS31 BAS35
21
12
3
3
1
3
3
12
MAM233
TYPE NUMBER
MARKING
CODE
BAS29 L20 BAS31 L21 BAS35 L22
Fig.1 Simplified outline (SOT23) and symbols.
1999 May 21 2
Philips Semiconductors Product specification
General purpose controlled avalanche
BAS29; BAS31; BAS35
(double) diodes
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Per diode
V
RRM
V
R
I
F
I
FRM
I
FSM
P
tot
I
RRM
E
RRM
T
stg
T
j
repetitive peak reverse voltage 110 V continuous reverse voltage 90 V continuous forward current single diode loaded; see Fig.2;
250 mA
note 1 double diode loaded; see Fig.2;
150 mA
note 1 repetitive peak forward current 600 mA non-repetitive peak forward current square wave; Tj=25°C prior to
surge; see Fig.4
t=1µs 10 A t = 100 µs 4A t=1s 0.75 A
total power dissipation T
=25°C; note 1 250 mW
amb
repetitive peak reverse current 600 mA repetitive peak reverse energy tp≥ 50 µs; f ≤ 20 Hz; Tj=25°C 5mJ storage temperature 65 +150 °C junction temperature 150 °C
Note
1. Device mounted on an FR4 printed-circuit board.
1999 May 21 3
Philips Semiconductors Product specification
General purpose controlled avalanche
BAS29; BAS31; BAS35
(double) diodes
ELECTRICAL CHARACTERISTICS
=25°C unless otherwise specified.
T
j
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Per diode
V
I
R
V
C t
rr
F
(BR)R
d
forward voltage see Fig.3
=10mA 750 mV
I
F
I
=50mA 840 mV
F
= 100 mA 900 mV
I
F
I
= 200 mA 1V
F
I
= 400 mA 1.25 V
F
reverse current see Fig.5
=90V 100 nA
V
R
V
=90V; Tj= 150 °C 100 µA
R
reverse avalanche breakdown
IR= 1 mA 120 170 V voltage
diode capacitance f = 1 MHz; VR= 0; see Fig.6 35 pF reverse recovery time when switched from IF= 30 mA to
50 ns IR= 30 mA; RL= 100 ; measured at IR= 3 mA; see Fig.7
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R R
th j-tp th j-a
thermal resistance from junction to tie-point 360 K/W thermal resistance from junction to ambient note 1 500 K/W
Note
1. Device mounted on an FR4 printed-circuit board.
1999 May 21 4
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