Philips BA792 Datasheet
DATA SH EET
Product specification
1996 Mar 13
DISCRETE SEMICONDUCTORS
BA792
Band-switching diode
ook, halfpage
M3D178
L8
1996 Mar 13 2
Philips Semiconductors Product specification
Band-switching diode BA792
FEATURES
• Ceramic SMD package
• Low diode capacitance:
max. 1.1 pF
• Low diode forward resistance:
max. 0.7 Ω.
APPLICATIONS
• Low loss band-switching in VHF
television tuners
• Surface mount high-speed
switching circuits.
DESCRIPTION
Planar, high performance
band-switching diode in a small
ceramic SOD110 SMD package.
Fig.1 Simplified outline (SOD110) and symbol.
Marking code: L8.
handbook, 4 columns
MAM139
ka
cathode mark
top viewside viewbottom view
ak
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER MIN. MAX. UNIT
V
R
continuous reverse voltage − 35 V
I
F
continuous forward current − 100 mA
T
stg
storage temperature −65 +150 °C
T
j
junction temperature − 150 °C
1996 Mar 13 3
Philips Semiconductors Product specification
Band-switching diode BA792
ELECTRICAL CHARACTERISTICS
T
j
= 25°C unless otherwise specified.
Note
1. Guaranteed on AQL basis: inspection level S4, AQL 1.0.
THERMAL CHARACTERISTICS
Note
1. Device mounted on a printed-circuit board measuring 11 × 25 × 1.6 mm.
SYMBOL PARAMETER CONDITIONS MAX. UNIT
V
F
forward voltage IF= 100 mA 1.1 V
I
R
reverse current VR= 20 V 10 nA
V
R
= 20 V; T
amb
=75°C1µA
C
d
diode capacitance VR= 3 V; f = 1 to 100 MHz; note 1 1.1 pF
r
D
diode forward resistance IF= 3 mA; f = 200 MHz; note 1 0.7 Ω
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-a
thermal resistance from junction to ambient note 1 315 K/W
MOUNTING
Reflow soldering
Follow standard reflow soldering techniques to ensure
correct application of solder paste and placement of the
SOD110 package (see Fig.2).
Dimensions in mm.
Fig.2 SOD110 reflow soldering pattern.
handbook, halfpage
MGC119
3.00
1.25
1.001.00
Wave soldering
Before wave soldering, attach SOD110 packages to the
printed-circuit boards using a small dot of thermo-setting
epoxy or UV-curing adhesive centred between the
soldering lands (see Fig.3).
Dimensions in mm.
Fig.3 SOD110 wave soldering pattern.
handbook, halfpage
MGC126
3.40
1.25
1.10
1.10
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