Philips 37TA1800-93 Schematic

TFT WXGA LCD TV

Service

Chassis: TPT1.0A LA

37TA1800/93 42TA1800/93 37TA2000/93 42TA2000/93

Contents Page

1. Technical Specifications and Connections 2~4

2. Safety Instructions, Warnings and Notes 5

3. Directions for User 7

4. Mechanical Instructions 8~9

5. Wiring Diagram 10 Block Diagram 11~12

6. Circuits Diagrams & PWB Layouts Chassis Overview & Exploded View 13~14

Diagram PWB

Contents

DSUB/DVI

HDMI

TUNNER

AV CONNECTOR

CPU M30620SPGP

SVP-PX66-1

SVP-PX66-2

SVP-PX66-3

SVP-PX66-4

DDR 4Mx32

SOUND DELAY

AUDIO DECODER (Diagram S-B14)28 33~34

AUDIO AMP

POWER 1

POWER2

RESET

(Diagram S-A01)15 33~34

(Diagram S-A02)16 33~34

(Diagram S-A03)17 33~34

(Diagram S-A04)18 33~34

(Diagram S-A05)19 33~34

(Diagram S-A06)20 33~34

(Diagram S-A07)21 33~34

(Diagram S-A08)22 33~34

(Diagram S-A09)23 33~34

(Diagram S-A10)24 33~34

(Diagram S-B11)25 33~34

(Diagram S-B12)26 33~34

(Diagram S-B13)27 33~34

(Diagram S-B15)29 33~34

(Diagram S-B16)30 33~34

(Diagram S-B17)31 33~34

(Diagram S-B18)32 33~34

Contents Page

Power Board(37 (Diagram P)35 36~37

SIDE AV Board (Diagram A)38 39~40

IR Board (Diagram I)41 42~43

KEY Board (Diagram K)44 45

7. Alignments Electrical Instructions&Serial NO.Definition 46~50 S

oftware Updrade With ISPWriter 51~52

Circuit Descriptions and IC Data Sheets 53

Circuit Description 54 IC Data Sheets 55~60 Repair Flow Chart 61~62

9. Spare Parts List 63~73

10.42 Supplement Material

Power Board(42") (Diagram P)74 75 ~76

Exploded View(42

11.Different Parts List 78~84

12.Revision List 85

Diagram PWB

Subject to modification Feb. 09 , 2006 EN: 3138 106 50050

PHILIPS

TPT1.0A LA

1. Technical Specifications and Connections

Index of this chapter:

1.1 Technical Specifications

1.2 Connections

Notes:

Some models in this chassis range have a different mechanical construction. The information given here is therefore model specific. At the moment of writing, not all information was available (only the 37-inch TPT1.0A LA model was available). As soon as the other models are introduced, an update manual will be released.

Figures below can deviate slightly from the actual situation, due to the different set executions.

Specifications are indicative (subject to change).

1.1 Technical Specifications

1.1.1Vision

Panel Model CLAA370WA03 (Supplier CPT)

Display type : LCD Display area(mm) : 819.6(H) X 460.8(V)

Number of Pixels : 1366(H) x 768(V) Contrast ratio : Typical 1200:1 Light output (cd/m2) : >400 Response time (ms) : Trg:8,Tfg:8 (Gray to Gray) Viewing angle (HxV degrees): 170/170 (L/R,U/D) (CR >10)

Pitch ( mm ) : 0.6(H) X 0.6(V)(37")

Color pixel arrangement : RGB vertical stripe Display operating mode : Normally black Color depth : 16.7M colors(8bits) Brightness (cd/m^2) : 500(Center 1 points, Typ.) Surface treatment : Hard coating(3H), Electrical interface : LVDS Outline Dimension(mm):877(H)X516.8(V)X55.5(D)(Typ.)(37")

Module weight (g) : 12,000(Typ.) Backlight : 8 CCFL(37")

Horizontal scan : 30 ~ 63KHz Vertical scan : 50 ~ 75 Hz

2 Sound

1.1.

Sound systems : Stereo Maximum power :2x10W(37")

T420XW01 (Supplier AUO)(42")

(37")

930.25(H) x 523.01(V) (42")

178/178 (L/R,U/D) (CR >10)

0.68(H) X 0.68(V)(42")

983.0(H) x 576.0(V) x 54.2(D)(42")

16 CCFL(42")

(37")

(37") (42")

Operating: Temperature : 0 C to 40 C

Humidity : 10 to 90%(non condensing) Altitude : 0 to 1,2000 feet Air pressure : 645 mBAR (guaranteed optical performance) : 5 to 35 C (guaranteed functional performance) : 5 to 40 C

Storage

Temperature : -20 to 50 C

Humidity : 10 to 90% (non condensing ) Air pressure : 600 to 1100 mBAR ( non operating) Note: recommend at 0 to 35 C, Humidity less than 60 %

Shipping Temperature : -20 to 60 C

Humidity : 5 to 90% (non condensing ) Altitude : 0 to 40000 feet ( non operating ) Air pressure : 188 to 1100 ( non operating )

1.2 Connections

1.2.1Signal Connector(China model)

1 ). Tuner: PAL D/K for China model

Multi-standard for WE model 2 ) SPDIF OUT : Digital audio output (HDMI audio output) 3 ). PVR OUT : Composite video output (CVBS) and audio

R/L(RCA jack) 4 ). AV audio IN : AV1 and S-Video audio R/L(RCAjack) 5 ). AV1 IN : Composite video input (AV1) 6 ). S-Video 1 IN : S-video input (S-Video 1) 7 ). Comp video 1 IN : HDTV input with YPbPr format with audio R/L. 8 ). Comp video 2 IN : HDTV input with YPbPr format with audio R/L. 9 ). PC audio IN: audio R/L(mini-jack).

10). PC IN: VGA input (D-SUB connectors)

11). HDMI : digital video and audio input

12). speaker output : external speakers output connectors

13). earphone : earphone jack

14). AV2 IN : Composite video input (AV2 side)

15). AV audio IN : AV2 and S-Video side audio R/L(RCA jack)

16). S-Video IN : S-video input (S-Video side)

910

Fig1-1

1.1.

3 Miscellaneous

Power supply: AC-input : 90V ~ 264VAC,

50/60 2Hz

Power consumption : 170W/Max(at PC mode),170W/

Max(at TV mode) with Audio

250W/Max(at PC mode),250W/ Max(at TV mode) with Audio(42")

Auto power saving : < 2W Power cord length : 1.8M Power cord type : European type and China type Power indicator : LED (On: Blue ,Sleeping

mode: Amber )

(37")

1516

Fig1-2

1.2.2 Input signal

1.2.2.1 Signal type

1.2.2.1.1PC mode signal type: a.Analog Video: 15 pin D-sub ,0.7 Vp-p linear, positive

polarity&separate sync.( TTL level, positive or negative polarity)

b.Audio signal : 3.5mm stereo mini-jack

Level: Nominal : 0.5 V rms.

- Maximum : 1.5 V rms.

-Impedance > 10 k .

c.Signal source: Pattern generator format as attachment table

1to12. Reference generator: CHROMA 2200 or QuantumData 802R

1. Technical Specifications and Connections

1.2.2.1.2TV mode signal type

RF Signal : Aerial input / 10mV(30-100dBuV)

Video signal : CVBS input ( RCA jack) / 1Vpp (300mV-sync,

700mV-video.)

S video input / 1VppY-signal, +/-300mV C-signal

SCART input: CVBS

Comp video in(YPbPr input)/ 1Vpp Y signal, +/-350mV Pb,Pr signal

HDMI:Digital interface with 4 channels TMDS signal

CVBS output ( RCA jack) / 1Vpp (300mV-sync, 700mV-video.)

Audio signal : Audio (1) R/L for AV IN(AV and S-Video).

Level: - Nominal : 0.5 V rms.

Audio (2) R/L for SCART IN Level: - Nominal : 0.5 V rms.

Audio (3) R/L for Comp video IN.

Level: - Nominal : 0.5 V rms.

Audio (4) digital audio for HDMI Video IN.

1.2.2.1.3 PVR (CVBS) output: Video: CVBS output 1Vpp / Impedance : 75

Audio: R/L output (from CVBS)

Level: - Nominal : 0.5 V rms.

- Maximum : 1.5 V rms.

- Impedance < 1 k

1.2.2.1.4 Scart output: ( for WE model only)

Video: CVBS output 1Vpp / Impedance : 75

Audio: R/L output (from CVBS)

Level: - Nominal : 0.5 V rms.

- Maximum : 1.5 V rms.

- Impedance < 1 k

1.2.2.1.5 SPDIF output: Serial digital audio output when input is HDMI.

1.2.2.1.6 Headphone

Audio: R/L output -10mW at 32

3.5mm stereo jack with switch

Impedance is between 8 and 600

1.2.2.2 TV system signal mode:

RF support:

China : PAL(D,K)

WE : PAL and SECAM(France).

CVBS/S-video: Support PAL, NTSC and SECAM colour system.

Comp video IN(YpbPr) : SDTV and HDTV, including 480i/p, 576i/p,

HDMI IN : 480P, 576P ,720P/50Hz , 720P/60Hz , 1080i/50Hz ,

1080i/60Hz

PVR (CVBS out) : Support PAL, NTSC and SECAM colour system.

1.2.2.3 Signal cab le

1.2.2.3.1 VGA s ignal cable The input signals are applied to display through D-sub cable. Length: 1.8 M +/- 50 mm (fixed) Connector type: D-sub male.

15-pin D-sub VGA connector of the signal cable:

S SRGB signal ( for WE model only)

- Maximum : 1.5 V rms.

- Impedance > 10 k

- Maximum : 1.5 V rms.

- Impedance > 10 k

-Maximum : 1.5 V rms.

- Impedance > 10 k

720p 50/60Hz, 1080i 50/60Hz.

With DDC_2B pin assignments. Blue connector thumb-operated jackscrews

TPT1.0A LA

1 Red video input 2 Green video input /SOG 3 Blue video input 4 GND 5 GND- cable detect 6 Red video ground 7 Green video ground 8 Blue video ground

9 DDC +3.3V (or 5V) 10 Logic ground 11 GND 12 Serial data line (SDA) 13 H. Sync / H+V 14 V. Sync 15 Data clock line (SCL)

1.2.2.3.2 HDMI for digital Video / Audio interface with pin assignment as follows:

Pin No. Description

1RX2+

2GND

3RX2-

4RX1+

5GND

6RX1-

7RX0+

8GND

9RX0-

10 RXC+

11 GND

12 RXC-

13 CEC

14 NC

15 DDC clock

16 DDC data

17 GND

18 +5V POWER

19 Hot Plug Detect

1.2.2.3.3 CVBS

The input signals are applied to display through CVBS cable

Pin assignment

PIN NO. SIGNAL

1GND

2 CVBS

3 CVBS

4 CVBS

1.2.2.3.4 S-Video

The input signals are applied to display through S-Video cable

Pin assignment

PIN NO. SIGNAL

1GND

2GND

3GND

4GND

5GND

6LUMA

8 CHROMA

1.2.2.3.5 Component Video

1.2.2.3.6 SCART

TPT1.0A LA

The input signals are applied to display through Component Video RCA Jack pin assignment

PIN NO. SIGNAL

1GND

2Redà Pr

3GND

4Blueà Pb

5GND

6GreenàY

Scart connector is only used in WE model. The Scart (Syndicat

des Constructeurs d'Appareils Radiorécepteurs et Televiseurs)

connector is used for combined audio and video connections.

1. Technical Specifications and Connections

Pin TV SCART

1 N/C

2 Right audio input

3 N/C

4 Audio ground

5 Blue ground

6 Left audio input

7 Blue output

0-2.5 volts (low) when: TV output

4.5-7.5 volts (High-t o-6v) when :

-inputting picture format setting is '16:9',

9-12 volts (high -to-12v) wh en:

-inputing picture format setting is '4:3'

9 Green ground

10 N/C

11 Green output

12 N/C

13 Red ground

14 N/C

15 Red output

0volt (low)when:-pin8oftheTVscartis low or when:

- Composite video signal

1-3 volts (high ) when:

- video input setting is 'RGB',

17 Composite video output ground

18 Composite video input ground

19 N/C

20 Composite video input

21 Ground

2. Safety Instructions, Warnings and Notes

TPT1.0A LA

index of this chapter:

2.1 Safety Instructions

2.2 Warnings

2.3 Notes

2.1 Safety Instructions

Safety regulations require that during a repair:

Connect the set to the AC Power via an isolation transformer (> 800 VA).

Replace safety components, indicated by the symbol , only by components identical to the original ones. Any other component substitution (other than original type) may increase risk of fire or electrical shock hazard.

Safety regulations require that after a repair, the set must be returned in its original condition. Pay in particular attention to the following points:

Route the wire trees correctly and fix them with the mounted cable clamps.

Check the insulation of the AC Power lead for external damage.

Check the strain relief of the AC Power cord for proper function.

Check the electrical DC resistance between the AC Power plug and the secondary side (only for sets which have a AC

Power isolated power supply):

1. Unplug the AC Power cord and connect a wire between the two pins of the AC Power plug.

2. Set the AC Power switch to the "on" position (keep the

AC Power cord unplugged!).

3. Measure the resistance value between the pins of the

AC Power plug and the metal shielding of the tuner or the aerial connection on the set. The reading should be between 4.5 Mohm and 12 Mohm.

4. Switch "off" the set, and remove the wire between the two pins of the AC Power plug.

Check the cabinet for defects, to avoid touching of any inner parts by the customer.

2.2 Warnings

All ICs and many other semiconductors are susceptible to electrostatic discharges (ESD ). Careless handling during repair can reduce life drastically. Make sure that, during repair, you are connected with the same potential as the mass of the set by a wristband with resistance. Keep components and tools also at this same potential.

Be careful during measurements in the high voltage section.

Never replace modules or other components while the unit is switched "on".

When you align the set, use plastic rather than metal tools. This will prevent any short circuits and the danger of a circuit becoming unstable.

2.3 Notes

2.3.1 General

··

Measure the voltages and waveforms with regard to the chassis (= tuner) ground ( ), or hot ground ( ), depending on the tested area of circuitry. The voltages and waveforms shown in the diagrams are indicative. Measure them in the Service Default Mode (see chapter 5) with a color bar signal and stereo sound (L: 3 kHz, R: 1 kHz unless stated otherwise) and picture carrier at 475.25 MHz for PAL, or

61.25 MHz for NTSC (channel 3).

··

Where necessary, measure the waveforms and voltages with ( ) and without ( ) aerial signal. Measure the voltages in the power supply section both in normal operation ( ) and in stand-by ( ). These values are indicated by means of the appropriate symbols. The semiconductors indicated in the circuit diagram and in

··

the parts lists, are interchangeable per position with the semiconductors in the unit, irrespective of the type indication on these semiconductors.

Manufactured under license from Dolby Laboratories. "Dolby" and the "double-D symbol", are trademarks of Dolby Laboratories.

2.3.2 Schematic Notes

All resistor values are in ohms and the value multiplier is

often used to indicate the decimal point location (e.g. 2K2 indicates 2.2 kohm).

Resistor values with no multiplier may be indicated with

either an "E" or an "R" (e.g. 220E or 220R indicates 220 ohm).

All capacitor values are given in micro-farads (u= x10 ),

nano-farads (n= x10 ), or pico-farads (p= x10 ).

Capacitor values may also use the value multiplier as the

decimal point indication (e.g. 2p2 indicates 2.2 pF).

An "asterisk" (*) indicates component usage varies. Refer

to the diversity tables for the correct values.

The correct component values are listed in the Electrical Replacement Parts List. Therefore, always check this list when there is any doubt.

-9

-12

-6

2.3.3 Rework on BGA (Ball Grid Array) Ics

General Although (LF)BGA assembly yields are very high, there may still be a requirement for component rework. By rework, we mean the process of removing the component from the PWB and replacing it with a new component. If an (LF)BGA is removed from a PWB, the solder balls of the component are deformed drastically so the removed (LF)BGA has to be discarded.

Device Removal As is the case with any component that, it is essential when removing an (LF)BGA, the board, tracks, solder lands, or surrounding components are not damaged. To remove an(LF)BGA, the board must be uniformly heated to a temperature close to the reflow soldering temperature. A uniform temperature reduces the chance of warping the PWB.To do this, we recommend that the board is heated until it is certain that all the joints are molten. Then carefully pull the component off the board with a vacuum nozzle. For the appropriate temperature profiles, see the IC data sheet.

Area Preparation When the component has been removed, the vacant IC area must be cleaned before replacing the (LF)BGA.Removing an IC often leaves varying amounts of solder on the mounting lands. This excessive solder can be removed with either a solder sucker or solder wick. The remaining flux can be removed with a brush and cleaning agent.After the board is properly cleaned and inspected, apply flux on the solder lands and on the connection balls of the (LF)BGA. Note: Do not apply solder paste, as this has shown to result in problems during re-soldering.

Device Replacement

The last step in the repair process is to solder the new component on the board. Ideally, the (LF)BGAshould be aligned under a microscope or magnifying glass. If this is not possible, try to align the (LF)BGA with any board markers. To reflow the solder, apply a

temperature profile according to the IC data sheet. So as not to damage neighbouring components, it may be necessary to reduce some temperatures and times.

More Information

For more information on how to handle BGA devices, visit this

URL: (needs subscription,

www.atyourservice.ce.philips.com

not available for all regions). After login, "select Magazine", then go to "Workshop Information". Here you will find Information on how to deal with BGA-ICs.

TPT1.0A LA

2. Safety Instructions, Warnings and Notes

2.3.4 Lead Free Solder

Philips CE is going to produce lead-free sets (PBF) from

1.1.2005 onwards. Lead-free sets will be indicated by the PHILIPS-lead-free logo on the Printed Wiring Boards (PWB):

In case of doubt whether the board is lead-free or not (or with mixed technologies), you can use the following method:

Always use the highest temperature to solder, when using

SAC305 (see also instructions below).

De-solder thoroughly (clean solder joints to avoid mix of

two alloys).

Caution must

which is coupled to the 12NC. For an overview of these profiles, visit the website (needs subscription, but is not available for all regions) You will find this and more technical information within the "Magazine", chapter "Workshop information". For additional questions please contact your local repair help desk.

: For BGA-ICs, you use the correct temperatureprofile,

www.atyourservice.ce.philips.com

Fig 2-1 Lead-free logo

This sign normally has a diameter of 6 mm, but if there is less space on a board also 3 mm is possible. In case of doubt wether the board is lead-free or not (or with mixed technologies), you can use the following method:

Always use the highest temperature to solder, when using

SAC305 (see also instructions below).

De-solder thoroughly (clean solder joints to avoid mix of

two alloys).

Caution

Due to lead-free technology some rules have to be respected by the workshop during a repair:

is required,please contact the manufacturer of your soldering equipment. In general, use of solder paste within workshops should be avoided because paste is not easy to store and to handle.

soldering tin. The solder tool must be able

-To reach at least a solder-tip temperature of 400 C.

-To stabilise the adjusted temperature at the solder-tip.

-To exchange solder-tips for different applications.

- 380 C is reached and stabilised at the solder joint. Heating time of the solder-joint should not exceed~4sec. Avoid temperatures above 400 C, otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips, switch "off" unused equipment or reduce heat.

tin/parts is possible but PHILIPS recommends strongly to

avoid mixed regimes. If not to avoid, clean carefully the

solder-joint from old tin and re-solder with new tin.

Not listed standard material (commodities) has to be

purchased at external companies.

delivered in so-called "dry-packaging" to protect the IC

against moisture. This packaging may only be opened

short before it is used (soldered). Otherwise the body of the

IC gets "wet" inside and during the heating time the

structure of the IC will be destroyed due to high (steam-)

pressure inside the body. If the packaging was opened

before usage, the IC has to be heated up for some hours

(around 90C)fordrying (think of ESD-protection !).

Do not re-use BGAs at all!

soldering tin and components, all needed spare parts will

be available till the end of the service period. For the repair

of such sets nothing changes.

: For BGA-ICs, you must use the correct temperatureprofile,

www.atyourservice.ce.philips.com

Use only lead-free soldering tin . If lead-free solder paste

Use only adequate solder tools applicable for lead-free

Adjust your solder tool so that a temperature around 360 C

Mix of lead-free soldering tin/parts with leaded soldering

Use only original spare-parts listed in the Service-Manuals.

Special information for lead-free BGAICs: these ICs will be

For sets produced before 1.1.2005, containing leaded

2.3.5 Practical Service Precautions

It makes sense to avoid exposure to electrical shock.

While some sources are expected to have a possible dangerous impact, others of quite high potential are of limited current and are sometimes held in less regard.

Always respect voltages.

dangerous in themselves, they can cause unexpected reactions - reactions that are best avoided. Before reaching into a powered TV set, it is best to test the high voltage insulation. It is easy to do, and is a good service precaution.

While some may not be

3. Directions for Use

You can download this information from the following websites:

http://www.philips.com/support

http://www.p4c.philips.com

TPT1.0A LA

4. Mechanical Instructions

Index of this chapter:

4.1 Assy/Panel Removal

4.2 Set Re-assembly

4.1 Assy/Panel Removal

Front view

Back view

4. Mechanical Instructions

Fig.5

Step 3. Remove IR, Side AV, Key board and Main shield assy as Fig.6~8.

a. Remove the 4 screws to remove the as Fig.6 b. Remove the 1 cable and 2 screws to remove Side AV board as Fig.7 c. Remove the 1 cable and 2 screws to remove IR board as Fig.7 d. Remove the 1 cable to remove Key board as Fig.7 e. Remove the the other 2 cables and 6 screws to remove the Main

shield assy as Fig.7~8

Fig.1

Fig.2

Step 1. Remove the stand and speaker.

a. Remove the 2 screws to remove the stand as Fig.3

Fig.3

b. Remove the 4 screws and 2 cables to remove the speaker as Fig.4

Fig.6

Fig.7

Fig.8

Step 4. Remove the Scaler and Power board.

a. Remove the 11 screws as Fig. 9 b. Remove the 12 screws to remove the Scaler and Power board as

Fig10~11

Step 2. Remove the Back cover as Fig.5.

Remove the 20 screws to remove the Back cover as Fig.5

Fig.9

Fig.4

Fig. 10

4. Mechanical Instructions

4.2 Set Re-assembly

To re-assemble the whole set, execute all processes in reverse order.

Notes:

a. While re-assembling, make sure that all cables are placed

and connected in their original position.

b. Pay special attention not to damage the EMC foams at the

SSB shielding. Check that EMC foams are put correctly on

Fig. 11

their places.

TPT1.0A LA

Step 5. Remove the Bezel assy as Fig.12~Fig.15 .

Remove the 5 screws

a. as Fig.12 b. Remove the 4 screws as Fig.13 c. Remove the 4 screws as Fig.14 d . as Fig.15

Remove the Bezel assy

In warranty, it is not allowed to disassembly the LCD panel, even the

backlight unit defect.

Out of warranty, the replacment of backlight unit is a correct way

when the defect is cused by backlight (CCFL,Lamp).

Fig. 12

Fig. 13

Fig. 14

Fig. 15

TPT1.0A LA

5. Block Diagram

Index of this chapter:

5.1

Wiring Diagram

5.2 Block Diagram

5.1 Wiring Diagram

5. Block Diagram

3138 14723781

PHILIPS

COMPONENT SIDE

16308P1630

COMPONENT

1921 2P1921

10PIN

CN109

6PIN

CN114

2PIN

CN113

19076P1907

CN112

3PIN

CN117

10PIN

COMPONENT SIDE

1089 10P1089 10P

1064

1063 12P1063 12P

1071

1088 12P1088 12P

5.2 Block Diagram

Connector

HDMI

5. Block Diagram

Function block of scaler Board

Connector

DSUB

TPT1.0A LA

COMP1 R/L

COMP2 R/L

DSUB R/L

HDMI R/L

74HC4052D

+5V

SC3_IN_R

SC3_IN_L

SW4

CVBS2 R/L

SW3

CVBS1 R/L

SIF_OUT

RX5V1_DD

C_SCL

5V_SB

REMOTE_3V

HP_DET

KEYA

HDMI1_RX0/

1/2/3/C+-

RX5V1_DD

C_SDA

M24C02

POWER_ON

DDC_5V

HDMI_HOTPLUG

DETECT_VGA

PC_R/G/BIN

M24C02

SDA

SCL

24LC64

3.3V_SB

DDC_WP

SDAE

SCLE

DDCSDA

74LV4053PW

DDC_5V

ISP_SW

E_PAGE

DDCSCL

VGA_VSIN

VGA_HSIN

74LVC14ADT

5V_SB

PC_HSIN

PC_VSIN

PC_HSIN

PC_VSIN

3.3V_SB

3V_SDA

3V_SCL

1/2/3/C+-

CPU_RESET

PCA9512

3.3V_SB

HDMI1_RX0/

YPbPr1_Y/Pb/Pr

YPbPr2_Y/Pb/Pr

5V_SDA

5V_SCL

SIF_OUT

SV1_Y/C_MP

SV2_Y/C_MP

PC_R/G/BIN

CVBS2_MP

SVP-PX66

FQ1256

+5V

CVBS1_MP

TV_CVBS

HDMI_SPDIF

+5V

MSP3410G

HP_R_OUT

HP_L_OUT

TDA1308T

+5V

HP_ROUT

HP_LOUT

AR_DACM

AL_DACM

TPA3008D2

+16V

ROUT+/-

LOUT+/-

MSP_INT

5V_SDA

5V_SCL

SOUND_EN

SB_PWR

PANEL_PWR

INVERTER_ON_OFF

CPU_RESET

8051_RD#

8051_WR#

RY_BY

SST39VF088

FLASH

M30620SPGP

SRAM_ENABLE

8051_RD#

(NI)

for TT

8051_WR#

AD0-AD7

IS61LV256-12T

3.3V_SB

SRAM

AD0-AD7

A0-A19

CE#

3.3V_SB

RESET_H

PX_INT#

3V_SCL

3V_SDA

8051_ALE

8051_WR#

8051_RD#

8051_CS2PX

8051_A0-7

8051_AD0-7

SW4

SW3

A0-A14

PX_HMMI33

HDMI_MCLK

BRIGHT_ADJ

HDMI_SD0

CS4344

+5V

PX_VL18

PX_MCK0/0#

HDMI_SCK

HDMI_WS

PX_VD33

PX_VA18

PX_RAS#/CAS#

PX_CS0#

PX_WE#

PX_CLKE

K4D263238G-VC33

(2.5V)

DDR

PX_VDDMQ

PX_VD18

PX_DQS0-3

PX_MA0-11

PX_BA0-1

PX_VDDMQ

PX_VDDM

PX_MD0-31

TPT1.0A LA

90 ~ 264V

AC Input

5. Block Diagram

Function block of power Board

AC Inlet

TCET1103(G)

Photo-coupler

FILTER

EMI

AC to DC

KBU8J

STW26NM60

PFC control

L6562 &

Control interface

Feedback

Protect /

network

TCET1103(G)

Photo-coupler

MBRF10H100CT

AC to DC

Transformer

EQ40

STW18NK80Z

PWM control

TEA1507P &

AC to DC

STPS40H100CW

Control from

scalerboard

16V 2.5A

Panel/scalar/

Audio

24V 7A_37”

Inverter board

24V 9A_42”

6.Circuit Diagram & PWB Layouts

Index of this chapter:

6.1 Chassis Overview

6.2 Exploded View

6.3 Scaler Board Schematic Diagram & Layouts

6.4 Power Board Schematic Diagram & Layouts

6.5 SIDE AV Schematic Diagram & Layouts

6.6 IR Schematic Diagram & Layouts

6.7 KEY Schematic Diagram & Layouts

Board

6.1 Chassi Overview

TPT1.0A LA

Power Board

IR Board

Key Board

Scaler Board

Side AV Board

6.2 37 Exploded View"

090

313815761281

MAIN SHIELD ASSY

TPT1.0A LA

6.Circuit Diagram & PWB Layouts

313815761291

BACK COVER ASSY

1054

313815864961

POWER PCB ASSY

1053

996500039547

SCALER BOARD_VISION-D

1050

823827720921

CPT CLAA370WA03

1055

96500039542

SIDE_AV_BOARD_VISION_D

BASE ASSY

313815761451

IR ASSY

996500039543

1056

996500039544

313815761441

FRONT BEZEL ASSY

1057

KEY BOARD

6.3.1 Scaler Schematic Diagram-ContentsBoard

S-01

6.Circuit Diagrams and PWB Layouts

TPT1.0A LA

6.3.2 Scaler Schematic Diagram - DSUB/DVIBoard

S-02

6. Circuit Diagrams and PWB Layouts

6.3.3 Scaler Schematic Diagram - HDMIBoard

S-03

6.Circuit Diagrams and PWB Layouts

TPT1.0A LA

6.3.4 Scaler Schematic Diagram - TUNNERBoard

S-04

6. Circuit Diagrams and PWB Layouts

6.3.5 Scaler Schematic Diagram - AV CONNECTORBoard

S-05

6.Circuit Diagrams and PWB Layouts

TPT1.0A LA

6.3.6 Scaler Schematic Diagram - IOBoard

S-06

6. Circuit Diagrams and PWB Layouts

6.3.7 Scaler Schematic Diagram - CPU M30620SPGPBoard

S-07

6.Circuit Diagrams and PWB Layouts

TPT1.0A LA

6.3.8 Scaler Schematic Diagram - SVP-PX66-1Board

S-08

6. Circuit Diagrams and PWB Layouts

6.3.9 Scaler Schematic Diagram - SVP-PX66-2Board

S-09

6.Circuit Diagrams and PWB Layouts

TPT1.0A LA

6.3.10 Scaler Schematic Diagram - SVP-PX66-3Board

6. Circuit Diagrams and PWB Layouts

S-10

6.3.11 Scaler Schematic Diagram - SVP-PX66-4Board

S-11

6.Circuit Diagrams and PWB Layouts

TPT1.0A LA

6.3.12 Scaler Schematic Diagram - DDR 4Mx32Board

S-12

6. Circuit Diagrams and PWB Layouts

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