Philips 37PF1600T Schematic

Published by JH 6P72 TV Service Printed in the Netherlands Subject to modification EN 3122 785 16330

©

rieval system or transmitted, in any form or by any means, electronic,

mecha

nical, photocopying, or otherwise without the prior permission of Philips.

Colour Television Chassis

MQC2.0A LA

Part 1 32PF1600T/96 Part 2 37PF1600T/96

Published by JH 6P72 TV Service Printed in the Netherlands Subject to modification EN 3122 785 16330

©

rieval system or transmitted, in any form or by any means, electronic,

mecha

nical, photocopying, or otherwise without the prior permission of Philips.

Colour Television Chassis

MQC2.0A LA

Part 1 32PF1600T/96

Contents Page

1. Technical Specifications, Connections, and Chassis Overview

2. Safety Instructions, Warnings, and Notes

3. Directions for Use

4. Mechanical Instructions

5. Service Modes, Faultfinding

6. Block Diagrams

7.Circuit diagrams

8. Alignments

9. IC data sheet

10. Space Parts list . Revision List

11

1 3 3

4 16 38 42 85 87 88 90

EN 1

Technical Specifications, Connections, and Chassis Overview

1.

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1. Technical Specifications, Connections, and Chassis Overview

Index of this chapter:

1.1 Technical Specifications

1.2 Connections

1.3 Chassis Overvie

e: Figures below can deviate slightly from the actual

Not

situation, due to the different set

w

executions.

1.1 Technical Specifications

1.1.1 Vision

Display type : LCD (AUO)

reen size : 31.51inches (800.85 mm) diagonal

Sc Resolution Cont

rast ratio : 800:1(Typical) Light output (cd/m2) : 500 Cd/m²(Typical) Response Viewing

angle : 85° (L) / 85° (R), 85° (U) / 85° (D) TV color systems : NTSC Video playback : NTSC, PAL, SECAM Suppo

rted inputs : 480i

: 1366x768

time (ms) : 16ms

: 576i : 480p : 576p : 1080i : 720p

VGA:Video RGB In

Figure 1-2 VGA Connector

1 - Video Red 0.7 VPP / 75 ohm 2 - Video Green 0.7 V 3 - Video Blue 0.7 VPP / 75 ohm 4 – n.c 5 –Ground Gnd 6 -Ground Red Gnd 7 -Ground

en Gnd

Gre 8 -Ground Blue Gnd 9 - +5V_DC +5V 10 -Gnd Sync Gnd 11

- n.c.

12

- DDC_SDA DDC data

- H-sync 0 - 5V

13 14

- V-sync 0 - 5V

15

- DDC_SCL DDC clock

HDMI:

Digital Video In

PP / 75 ohm

DC

Sound

1.1.2

Sound

systems : MTS (NTSC), FM-FM

Internal

speaker : 10 W x 2 stereo, volume adjustable

1.1.3 Miscellaneous

Po

wer supply:

ower voltage (VAC) : 90-264V

-AC P

-AC Power frequency (Hz) : 47~63Hz

Ambient conditions:

-Temp

erature range : 0~35°C

- Maximum humidity : 10%~90%

Po

wer consumption

- Normal operation : 185 W

- Stand Dimensions Weight (kg) :19.5Kg

-by: < 2 W (WxHxD mm) :600*980*252

1.2 Connections

1.

2.1 Rear I/O connections

Technical Specifications, Connections, and Chassis Overview

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1.2.2 Right I/O Connections

RF_Analog 75ohm Unbalance F-type connector RF_Digital 75ohm Unbalance F-type connector AV1-S1/AV2-S2: S-Video 1Fh Y/C-In 1 -Ground Y Gnd 2 -Ground C Gnd 3 -Video Y 1Vpp/75 ohm 4 -Video C 0.3Vpp/75 ohm AV1/AV2 Video In, Audio In 1 -Audio R 0.5 Vrms/10Kohm 2 -Gnd CVBS Gnd 3 -Video CVBS 1Vpp/75 ohm 4 -Audio L 0.5 Vrms/10Kohm

YPBPR1/YPBPR2

Wh….-Audio L 0.5 Vrms/10Kohm Rd….-Audio R 0.5 Vrms/10Kohm Bu Video Pb 0.7 Vpp/75 ohm Rd Video Pr 0.7 Vpp/75 ohm Gn Video Y 1Vpp/75 ohm

1.3 Chassis overview

1.2.3 Left I/O Connections

Line-out

1 Audio R 0.5 Vrms/10Kohm 2 Audio L 0.5 Vrms/10Kohm

Line-in

1 Audio R 0.5 Vrms/10Kohm 2 Audio L 0.5 Vrms/10Kohm

HDMI

1 Video coding: RGB 4.4.4,YCbCr 4.2.2,YCbCr 4.4.4

2.Audio format supported(minimum) 2 channel L-PCM

3.Using an IEC 6095 subpacket structure Sampling rate 32KHz,44.1Khz,48Khz

M/B

AD6 CPU/B

Power/B

IR/B

Keypad/B

Translation/BTranslation/B HDMI

EN 3

Safety Instructions, Warnings, and Notes

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2. Safety Instructions, Warnings, and Notes

2.1 Safety Instructions

Safety regulations require that during a repair:

• Connect the set to the AC Power via an isolation transformer (> 800 VA).

• Replace safety components, indicated by the symbol only by components identical to the original ones. Any other component substitution (other than original type) may increase risk of fire or electrical shock hazard. Safety regulations require that after a repair, the set must be returned in its original condition. Pay in particular attention to the following points:

• Route the wire trees correctly and fix them with the mounted cable clamps.

• Check the insulation of the AC Power lead for external damage.

• Check the strain relief of the AC Power cord for proper function.

• Check the electrical DC resistance between the AC Power plug and the secondary side (only for sets which have a AC Power isolated power supply):

1. Unplug the AC Power cord and connect a wire

between the two pins of the AC Power plug.

2. Set the AC Power switch to the "on" position (keep the

AC Power cord unplugged!).

3. Measure the resistance value between the pins of the

AC Power plug and the metal shielding of the tuner or the aerial connection on the set. The reading should be between 4.5 Mohm and 12 Mohm.

4. Switch "off" the set, and remove the wire between the

two pins of the AC Power plug.

• Check the cabinet for defects, to avoid touching of any inner parts by the customer.

,

2.2 Warnings

• All ICs and many other semiconductors are susceptible to electrostatic discharges (ESD

during repair can reduce life drastically. Make sure that, during repair, you are connected with the same potential as the mass of the set by a wristband with resistance. Keep components and tools also at this same potential. Available ESD protection equipment: – Complete kit ESD3 (small tablemat, wristband,

connection box, extension cable and earth cable) 4822 310 10671.

– Wristband tester 4822 344 13999.

• Be careful during measurements in the high voltage section.

• Never replace modules or other components while the unit is switched "on".

• When you align the set, use plastic rather than metal tools. This will prevent any short circuits and the danger of a circuit becoming unstable.

). Careless handling

2.3 Notes

2.3.1 General

• Measure the voltages and waveforms with regard to the chassis (= tuner) ground ( ), or hot ground ( ), depending on the tested area of circuitry. The voltages and waveforms shown in the diagrams are indicative. Measure them in the Service Default Mode (see chapter 5) with a color bar signal and stereo sound (L: 3 kHz, R: 1 kHz unless stated otherwise) and picture carrier at 475.25 MHz for PAL, or

61.25 MHz for NTSC (channel 3).

• Where necessary, measure the waveforms and voltages with ( ) and without ( ) aerial signal. Measure the voltages in the power supply section both in normal operation ( ) and in stand-by ( ). These values are indicated by means of the appropriate symbols.

• The semiconductors indicated in the circuit diagram and in the parts lists, are interchangeable per position with the semiconductors in the unit, irrespective of the type indication on these semiconductors.

• Manufactured under license from Dolby Laboratories. “Dolby” and the “double-D symbol”, are trademarks of Dolby Laboratories.

2.3.2 Schematic Notes

• All resistor values are in ohms and the value multiplier is

often used to indicate the decimal point location (e.g. 2K2 indicates 2.2 Kohm).

• Resistor values with no multiplier may be indicated with either an "E" or an "R" (e.g. 220E or 220R indicates 220 ohm).

• All capacitor values are given in micro-farads (µ= x10 nano-farads (n= x10

• Capacitor values may also use the value multiplier as the decimal point indication (e.g. 2p2 indicates 2.2 pF).

• An "asterisk" (*) indicates component usage varies. Refer to the diversity tables for the correct values.

• The correct component values are listed in the Electrical Replacement Parts List. Therefore, always check this list when there is any doubt.

2.3.3 Rework on BGA (Ball Grid Array) ICs

General

Although (LF)BGA assembly yields are very high, there may still be a requirement for component rework. By rework, we mean the process of removing the component from the PWB and replacing it with a new component. If an (LF)BGA is removed from a PWB, the solder balls of the component are deformed drastically so the removed (LF)BGA has to be discarded.

Device Removal

As is the case with any component that, it is essential when removing an (LF)BGA, the board, tracks, solder lands, or surrounding components are not damaged. To remove an (LF)BGA, the board must be uniformly heated to a temperature close to the reflow soldering temperature. A uniform temperature reduces the chance of warping the PWB. To do this, we recommend that the board is heated until it is certain that all the joints are molten. Then carefully pull the component off the board with a vacuum nozzle. For the appropriate temperature profiles, see the IC data sheet.

Area Preparation

When the component has been removed, the vacant IC area must be cleaned before replacing the (LF)BGA. Removing an IC often leaves varying amounts of solder on the mounting lands. This excessive solder can be removed with either a solder sucker or solder wick. The remaining flux can be removed with a brush and cleaning agent. After the board is properly cleaned and inspected, apply flux on the solder lands and on the connection balls of the (LF)BGA. Note: Do not apply solder paste, as this has shown to result in problems during re-soldering.

-9

), or pico-farads (p= x10

-6

-12

),

).

Directions for Use

Device Replacement

The last step in the repair process is to solder the new component on the board. Ideally, the (LF)BGA should be aligned under a microscope or magnifying glass. If this is not possible, try to align the (LF)BGA with any board markers. To reflow the solder, apply a temperature profile according to the IC data sheet. So as not to damage neighboring components, it may be necessary to reduce some temperatures and times.

More Information

For more information on how to handle BGA devices, visit this URL: www.atyourservice.ce.philips.com not available for all regions). After login, select “Magazine”, then go to “Workshop Information”. Here you will find Information on how to deal with BGA-ICs.

2.3.4 Lead Free Solder

Philips CE is going to produce lead-free sets (PBF) from

1.1.2005 onwards. Lead-free sets will be indicated by the PHILIPS-lead-free logo on the Printed Wiring Boards (PWB):

Figure 2-1 Lead-free logo

This sign normally has a diameter of 6 mm, but if there is less space on a board also 3 mm is possible.

In case of doubt wether the board is lead-free or not (or with mixed technologies), you can use the following method:

• Always use the highest temperature to solder, when using SAC305 (see also instructions below).

• De-solder thoroughly (clean solder joints to avoid mix of two alloys).

Caution: For BGA-ICs, you must use the correct temperature profile,which is coupled to the 12NC. For an overview of these profiles, visit the website http://www.atyourservice.ce.philips.com/ You will find this and more technical information within the "Magazine", chapter "Workshop information". For additional questions please contact your local repair-helpdesk.

(needs subscription,

Due to lead-free technology some rules have to be respected by the workshop during a repair:

• Use only lead-free soldering tin Philips SAC305 with order code 0622 149 00106. If lead-free solder paste is required, please contact the manufacturer of your soldering equipment. In general, use of solder paste within workshops should be avoided because paste is not easy to store and to handle.

• Use only adequate solder tools applicable for lead-free soldering tin. The solder tool must be able – To reach at least a solder-tip temperature of 400°C. – To stabilise the adjusted temperature at the solder-tip. – To exchange solder-tips for different applications.

• Adjust your solder tool so that a temperature around 360°C

-380°C is reached and stabilised at the solder joint. Heating time of the solder-joint should not exceed ~ 4 sec. Avoid temperatures above 400°C, otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips, switch “off” unused equipment or reduce heat.

• Mix of lead-free soldering tin/parts with leaded soldering tin/parts is possible but PHILIPS recommends strongly to avoid mixed regimes. If not to avoid, clean carefully the solder-joint from old tin and re-solder with new tin.

• Use only original spare-parts listed in the Service-Manuals. Not listed standard material (commodities) has to be purchased at external companies.

• Special information for lead-free BGA ICs: these ICs will be delivered in so-called "dry-packaging" to protect the IC against moisture. This packaging may only be opened short before it is used (soldered). Otherwise the body of the IC gets "wet" inside and during the heating time the structure of the IC will be destroyed due to high (steam)pressure inside the body. If the packaging was opened before usage, the IC has to be heated up for some hours (around 90°C) for drying (think of ESD-protection !). Do not re-use BGAs at all!

• For sets produced before 1.1.2005, containing leaded soldering tin and components, all needed spare parts will be available till the end of the service period. For the repair of such sets nothing changes.

2.3.5 Practical Service Precautions

• It makes sense to avoid exposure to electrical shock. While some sources are expected to have a possible dangerous impact, others of quite high potential are of limited current and are sometimes held in less regard.

• Always respect voltages. While some may not be dangerous in themselves, they can cause unexpected reactions - reactions that are best avoided. Before reaching into a powered TV set, it is best to test the high voltage insulation. It is easy to do, and is a good service precaution.

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3.

EN 4

3. Directions for Use

You can download this information from the following websites:

http://www.philips.com/support http://www.p4c.philips.com

Mechanical Instructions

EN 5

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4. Mechanical Instructions

Index of this chapter:

4.1 Cable Dressing

4.2 Foam Bars

4.3 Panel/PCBA Removal

4.4 Disassemblyt and Re-assembly

4.1 Cable Dressing

4.2 Service Positions

4.2.2 Stands

4.2.1 Foam Bars

The foam bars (order code 3122 785 90580 for two pieces) can

be used for all types and sizes of Flat TVs. By laying the TV face down on the (ESD protective) foam bars, a stable situation is created to perform measurements and alignments. By placing a mirror under the TV, you can monitor the screen.

The stands can be mounted with the back cover removed or still left on. So, the stand can be used to store products or to do measurements. It is also very suitable to perform duration tests without taking much space, without having the risk of overheating ,or the risk of products falling. The stands can be mounted and removed quick and easy with use of the delivered screws that can be tightened and loosened manually without the use of tools. See figure above.

Note: Only use the delivered screws to mount the monitor to the stands

Figure 4-3 Stands

Mechanical Instructions

4.3 Panel/PCBA removal

4.3.1 IO/Sub IO

Warning: Disconnect the AC Power cord before you open the set.

1. Place the TV set upside down on a table top, using the

foam bars (see part "Foam Bars"). Caution: do not put pressure on the display, but let the monitor lean on the speakers or the Front cover.

2. Remove M3*5(4 pieces) from Left/Right I/O Box of rear side.

4.3.2 I/O plate/Back cover/ R&L Speaker

2. Remove screw T4*12 16pcs,M3*5 3 pcs from the Back cover. . 3. Lift the back cover from the set. Make sure that wires and

4. Remove screw T3*12 8 pcs from L/R speaker

1.. Remove screw M3*8 4pcs,M3*5 8 pcs and I/O nut*2 from I/O plate.

flat foils are not damaged during the back cover removal.

4.3.3 ESD TOP

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4.3.4 Main Board & Translation Board

1. Disconnect all cable from Base unit

2. Remove the fixation screws

3. Take out the Translation/B & Main Board

4.3.5 AD6 CPU Board & Translation Board

1. Remove the fixation screws

2. Take out the Ttanslation/B & Main Board

4.3.6 Power Board

1. Remove the fixation screws

2. Take out the Power/B.

4.3.7 Button Board

1. Remove the fixation screws

2. Take out Button/B.

4.3.8 IR Board

1. Remove the fixation screws

2. Take out IR/B.

4.3.9 LCD Panel

1. Remove the fixation screws from

PCB-Holder ass’y

2. Take out PCB-Holder ass’y

3. Remove the fixation screws from LCD chassis

4. Lift the panel from LCD bezel

1. Remove screw M3*5 8pcs from ESD TOP.

2. Lift the ESD TOP from chassis.

EN 7

Mechanical Instructions

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Disassembly process

4.4.1

4.4.2

Mechanical Instructions

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4.4.3

4.4.4

Mechanical Instructions

4.4.5

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4.4.6

Mechanical Instructions

4.4.7

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4.4.8

Mechanical Instructions

4.4.9

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4.4.10

Mechanical Instructions

4.4.11

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4.4.12

Mechanical Instructions

4.4.13

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4.4.14

Mechanical Instructions

4.4.15

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4.4.16

Mechanical Instructions

4.4.17

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4.4.18 Re-assembly

To re-assemble the LCD panel, execute all processes in reverse order.

Note: .While re-assemble, make sure that all are placed and

And connected in their original position. See figure

“Cable dressing” .Pay special attention not to damage the EMC foams at the SSB shielding. Check that EMC foams are put correctly on their places.

Service mode, Fault Finding

5 Service mode and Fault Finding

Index if this chapter:

5.1 Service Modes for ATV

5.2 Service Modes for DTV

5.3 Fault Finding

5.1 Service Mode (update ATV BIOS) Purpose

. To update new version ATV BIOS

Tools

. ISP Board . RS232 cable . VGA cable . Software (Pixlworks)

5.2 Service Mode (update DTV BIOS)

Purpose

. To update new vers ion DTV BIOS

Tools

EN 16

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Setup

1. Off TV Pow e r

2. Process Pixlworks program

3. Choose appcode.inf

4. Check connection. Should be in serial

5. Check COM Port of R232

6. Check Baud Rate

7. Click Flash

8. Turn on the TV .The program will automatic

9. After few seconds, then screen will showing flash completed. TV will power on itself

Service mode, Fault Finding Setup

EN 17

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Service mode, Fault Finding

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Service mode, Fault Finding

5.3 Fault Finding

Purpose

To find the fault

How to find fault

EN 19

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A

Service mode, Fault Finding

EN 20

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Power cable

Plug-in?

LED bright?

LCD panel can

Display?

TV source can

Display?

Check Power cable

Replace P/B or P/B to M/B

Power cable

Replace M/B

LCD panel can

Display?

Replace I/O board

Replace I/V to power cable

or LVDS cable

Speaker have sound

Output?

TV source can

Display?

Replace Audio/B Audio/B or I/O

Audio/B cable

Replace Tuner/B

EN 21

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Service mode, Fault Finding

DVBT/ATSC source

can display

END

B

Inverter power cable

Plug in?

LCD back light

Bright?

Replace DVBT/ATSC board

Change inverter power cab le

Replace Power board

LCD back light

Bright?

END

Replace LCD Inverter boa rd

LCD back light

Bright?

Replace M/B

C

Service mode, Fault Finding

EN 22

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Remote control have

Battery?

IR board cable

Plug in?

Press remote menu key

OSD can display?

Change battery

Check IR/B cable or replace

IR/B cable

Replace IR/B

Press remote menu key

OSD can display?

Replace M/B

END

EN 23

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D

Service mode, Fault Finding

Key board cable

plug in

Press Menu key Check function?

Check K/B cable or replace

K/B cable

Replace K/B cable

Press Menu key Check function?

Replace K/B cable

ENDEND

Service mode, Fault Finding

E

EN 24

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RF cable Plug in?

CVBS1 can’t

display

Replace I/O board

RF can display

Check RF cable or replace

RF cable

Replace Tuner board

Replace M/B

Replace I/O board

END

EN 25

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F

Service mode, Fault Finding

Component cable

Plug in?

Replace I/O board

Component can

Display?

END

Check component cable or

Replace component cable

Replace M/B

Service mode, Fault Finding

G

EN 26

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S-video cable

Plug in?

Replace I/O board

S-video can

display

END

Check S-video cable or replace

S-video cable

Replace M/B

EN 27

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H

Service mode, Fault Finding

CVBS cable

Plug in?

Replace I/O board

CVBS can

display

END

Check CVBS cable or replace

CVBS cable

Replace M/B

L

Service mode, Fault Finding

EN 28

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Audio R/L cable

Plug in?

Video can display?

Mute turn-off,volume=30

Earphone remove

Speaker R/L cable

Plug in?

Speaker have sound

output

Check Audio R/L cable or

Replace Audio R/L cabl e

Check video cable or replace

Video cable

L1

Check speaker cable or replace

Speaker cable

Replace I/O to Audio/B cable

And Audio/B

END

Speaker have sound

output

Replace I/O board