DISCRETE SEMICONDUCTORS
DATA SHEET
M3D425
1PS89SS04; 1PS89SS05; 1PS89SS06
High-speed double diodes
Preliminary specification |
|
1999 Jun 08 |
|||||
Supersedes data of 1999 Mar 01 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Philips Semiconductors |
Preliminary specification |
|
|
High-speed double diodes
1PS89SS04; 1PS89SS05; 1PS89SS06
FEATURES
∙Power dissipation comparable to SOT23
∙Ultra small plastic SMD package
∙High switching speed: max. 4 ns
∙Continuous reverse voltage: max. 80 V
∙Repetitive peak reverse voltage: max. 85 V
∙Repetitive peak forward current: max. 500 mA.
APPLICATIONS
∙High speed switching in e.g. surface mounted circuits.
DESCRIPTION
Two high-speed switching diodes in planar technology, with different configurations, in an ultra small SC-89 (SOT490) plastic SMD package.
LIMITING VALUES
PINNING
PIN |
1PS89SS.. |
||||
|
|
|
|
|
|
04 |
05 |
|
06 |
||
|
|
||||
|
|
|
|
|
|
1 |
a1 |
|
a1 |
|
k1 |
2 |
k2 |
|
a2 |
|
k2 |
3 |
k1, a2 |
k1, k2 |
|
a1, a2 |
|
|
|
|
|
|
|
page |
|
3 |
|
|
|
|
1 |
2 |
|
|
|
|
Top view |
|
MBK837 |
||
Fig.1 |
Simplified outline |
||||
|
(SC-89; SOT490) and |
||||
|
pin configuration. |
||||
|
|
|
|
|
|
MARKING |
|
|
|
|
|
|
|
|
|
||
TYPE NUMBER |
|
MARKING |
|||
|
|
CODE |
|||
|
|
|
|
||
|
|
|
|
||
1PS89SS04 |
|
|
S4 |
||
|
|
|
|
||
1PS89SS05 |
|
|
S5 |
||
|
|
|
|
||
1PS89SS06 |
|
|
S6 |
||
|
|
|
|
|
|
3
1 2
MGL550
Fig.2 1PS89SS04 diode configuration (symbol).
3
1 2
MGL551
Fig.3 1PS89SS05 diode configuration (symbol).
3
1 2
MGL552
Fig.4 1PS89SS06 diode configuration (symbol).
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
MAX. |
UNIT |
|
|
|
|
|
|
Per diode unless otherwise specified |
|
|
|
|
|
|
|
|
|
|
|
VRRM |
repetitive peak reverse voltage |
|
− |
85 |
V |
VR |
continuous reverse voltage |
|
− |
80 |
V |
IF |
continuous forward current |
Tamb = 25 °C; note 1; see Fig.5 |
|
|
|
|
|
single diode loaded |
− |
200 |
mA |
|
|
both diodes loaded |
− |
125 |
mA |
|
|
|
|
|
|
IFRM |
repetitive peak forward current |
|
− |
500 |
mA |
IFSM |
non-repetitive peak forward current |
square wave; Tj = 25 °C prior to |
|
|
|
|
|
surge; see Fig.7 |
|
|
|
|
|
t = 1 μs |
− |
4 |
A |
|
|
t = 1 s |
− |
0.5 |
A |
|
|
|
|
|
|
1999 Jun 08 |
2 |
Philips Semiconductors Preliminary specification
High-speed double diodes |
|
1PS89SS04; 1PS89SS05; |
||||
|
|
|
1PS89SS06 |
|||
|
|
|
|
|
||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
SYMBOL |
PARAMETER |
CONDITIONS |
|
MIN. |
MAX. |
UNIT |
|
|
|
|
|
|
|
Ptot |
total power dissipation (per package) |
Tamb ≤ 25 °C; note 1 |
|
− |
250 |
mW |
Tstg |
storage temperature |
|
|
−65 |
+150 |
°C |
Tj |
junction temperature |
|
|
− |
+150 |
°C |
Note
1. Refer to SC-89 (SOT490) standard mounting conditions.
ELECTRICAL CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL |
PARAMETER |
CONDITIONS |
TYP. |
MAX. |
UNIT |
|
|
|
|
|
|
|
|
Per diode |
|
|
|
|
|
|
|
|
|
|
|
|
|
VF |
forward voltage |
see Fig.6 |
|
|
|
|
|
|
IF = 1 mA |
|
610 |
− |
mV |
|
|
IF = 10 mA |
|
740 |
− |
mV |
|
|
IF = 50 mA |
|
− |
1 |
V |
|
|
IF = 100 mA |
|
− |
1.2 |
V |
IR |
reverse current |
see Fig.8 |
|
|
|
|
|
|
VR = 25 V |
|
− |
30 |
nA |
|
|
VR = 80 V |
|
− |
0.5 |
μA |
|
|
VR = 25 V; Tj = 150 °C |
− |
30 |
μA |
|
|
|
VR = 80 V; Tj = 150 °C |
− |
100 |
μA |
|
Cd |
diode capacitance |
f = 1 MHz; VR = 0; see Fig.9 |
|
|
|
|
|
1PS89SS04 |
|
|
− |
1.5 |
pF |
|
1PS89SS05 |
|
|
− |
1.5 |
pF |
|
1PS89SS06 |
|
|
− |
2 |
pF |
|
|
|
|
|
|
|
trr |
reverse recovery time |
switched from IF = 10 mA to IR = 10 mA; |
− |
4 |
ns |
|
|
|
RL = 100 Ω; measured at IR = 1 mA; |
|
|
|
|
|
|
see Fig.10 |
|
|
|
|
|
|
|
|
|
|
|
Vfr |
forward recovery voltage |
switched to IF = 10 mA; tr = 20 ns; |
− |
1.75 |
V |
|
|
|
see Fig.11 |
|
|
|
|
|
|
|
|
|
|
|
THERMAL CHARACTERISTICS |
|
|
|
|
|
|
|
|
|
|
|
||
SYMBOL |
PARAMETER |
CONDITIONS |
VALUE |
UNIT |
||
|
|
|
|
|
|
|
Rth j-s |
thermal resistance from junction to soldering point |
both diodes loaded |
|
|
|
|
|
1PS89SS04 |
|
|
|
55 |
K/W |
|
1PS89SS05 |
|
|
|
70 |
K/W |
|
1PS89SS06 |
|
|
|
70 |
K/W |
|
|
|
|
|
|
|
Rth j-a |
thermal resistance from junction to ambient |
note 1 |
|
500 |
K/W |
Note
1. Refer to SC-89 (SOT490) standard mounting conditions.
1999 Jun 08 |
3 |
Philips Semiconductors |
Preliminary specification |
|
|
High-speed double diodes
1PS89SS04; 1PS89SS05; 1PS89SS06
GRAPHICAL DATA
MGL553
300
IF (mA)
(1)
200
(2)
100
0
0 |
50 |
100 |
150 |
200 |
|
|
|
Tamb (°C) |
(1)One diode loaded.
(2)Both diodes loaded.
Fig.5 Maximum permissible continuous forward current as a function of the ambient temperature.
MBG382
300 handbook, halfpage
IF (mA)
(1) |
(2) |
(3) |
200
100
0
0 |
1 |
VF |
(V) |
2 |
|
|
|
(1)Tj = 150 °C; typical values.
(2)Tj = 25 °C; typical values.
(3)Tj = 25 °C; maximum values.
Fig.6 Forward current as a function of forward voltage.
MBG704
102 handbook, full pagewidth
IFSM
(A)
10
1
10−1
1 |
10 |
102 |
103 |
tp (μs) |
104 |
|
|
|
|
|
Based on square wave currents.
Tj = 25 °C prior to surge.
Fig.7 Maximum permissible non-repetitive peak forward current as a function of pulse duration.
1999 Jun 08 |
4 |