Philips 1PS89SB74 Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
M3D425
1PS89SB74
Schottky barrier double diode
Product specification 2001 Apr 20
Philips Semiconductors Product specification

FEATURES

PINNING

Low forward voltage
High breakdown voltage
Guard ring protected
Ultra small plastic SMD package
Low capacitance.

APPLICATIONS

page
Ultra high-speed switching
Voltage clamping
Protection circuits
Blocking diodes.
Marking code: S7.

DESCRIPTION

Fig.1 Simplified outline (SOT490; SC-89) and Planar Schottky barrier diode encapsulated in a SOT490 (SC-89) ultra small plastic SMD package.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).
PIN DESCRIPTION
1 anode (a 2 cathode (k 3 common (k
3
12
Top view
MBK837
)
1
)
2
)
1,a2
3
12
symbol.
MLC358
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Per diode unless otherwise specified
V I
F
I
FRM
I
FSM
P T T T
R
tot stg j amb
continuous reverse voltage 70 V continuous forward current 70 mA repetitive peak forward current tp≤ 1s;δ≤0.5 70 mA non-repetitive peak forward current tp<10ms 100 mA total power dissipation (per package) T
25 °C 200 mW
amb
storage temperature 65 +150 °C junction temperature +150 °C operating ambient temperature 65 +150 °C
2001 Apr 20 2
Philips Semiconductors Product specification
Schottky barrier double diode 1PS89SB74

ELECTRICAL CHARACTERISTICS

T
=25°C unless otherwise specified.
amb
SYMBOL PARAMETER CONDITIONS MAX. UNIT
Per diode
V
F
I
R
C
d
Note
1. Pulse test: t
continuous forward voltage see Fig.2;
I
= 1 mA 410 mV
F
I
= 10 mA 750 mV
F
I
=15mA 1 V
F
continuous reverse current VR= 50 V; see Fig.3; note 1 100 nA
V
= 70 V; see Fig.3; note 1 10 µA
R
diode capacitance VR= 0; f = 1 MHz; see Fig.4 2 pF
300 µs; δ≤0.02.
p

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-a
thermal resistance from junction to ambient note 1 500 K/W
Note
1. Refer to SOT490 (SC-89) standard mounting conditions.
2001 Apr 20 3
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