Philips 1PS70SB16, 1PS70SB15, 1PS70SB14, 1PS70SB10 Datasheet

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Philips 1PS70SB16, 1PS70SB15, 1PS70SB14, 1PS70SB10 Datasheet

DISCRETE SEMICONDUCTORS

DATA SHEET

ok, halfpage

M3D102

1PS70SB10; 1PS70SB14; 1PS70SB15; 1PS70SB16

Schottky barrier (double) diodes

Product specification

 

1999 Apr 26

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Philips Semiconductors

Product specification

 

 

Schottky barrier (double) diodes

1PS70SB10; 1PS70SB14; 1PS70SB15; 1PS70SB16

FEATURES

Low forward voltage

Guard ring protected

Very small plastic SMD package.

APPLICATIONS

Ultra high-speed switching

Voltage clamping

Protection circuits

Blocking diodes.

DESCRIPTION

Planar Schottky barrier diodes encapsulated in a SOT323 very small plastic SMD package. Single diodes and double diodes with different pinning are available.

MARKING

TYPE NUMBER

MARKING

CODE (1)

 

1PS70SB10

7 0

 

 

1PS70SB14

7 4

 

 

1PS70SB15

7 5

 

 

1PS70SB16

7 6

 

 

Note

1.= -: Made in Hong Kong.= t: Made in Malaysia.

PINNING

PIN

 

1PS70SB..

 

 

 

 

 

 

 

 

10

14

 

 

15

16

 

 

 

 

 

 

 

 

 

 

 

1

a1

a1

 

a1

k1

2

n.c.

k2

 

a2

k2

3

k1

k1, a2

 

k1, k2

a1, a2

 

 

 

 

 

 

 

halfpage

 

 

 

 

3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

 

 

 

2

 

 

 

 

 

Top view

MGD765

Fig.1 Simplified outline SOT323 (SC-70) and pin configuration.

 

3

1

2

n.c.

MLC357

Fig.2 1PS70SB10 single diode configuration (symbol).

3

1 2

MLC358

Fig.3 1PS70SB14 diode configuration (symbol).

3

1 2

MLC359

Fig.4 1PS70SB15 diode configuration (symbol).

3

1 2

MLC360

Fig.5 1PS70SB16 diode configuration (symbol).

1999 Apr 26

2

Philips Semiconductors Product specification

Schottky barrier (double) diodes

1PS70SB10; 1PS70SB14;

1PS70SB15; 1PS70SB16

 

 

 

 

 

 

 

 

LIMITING VALUES

 

 

 

 

In accordance with the Absolute Maximum Rating System (IEC 134).

 

 

 

 

 

 

 

 

 

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

 

 

 

 

 

 

Per diode

 

 

 

 

 

 

 

 

 

 

 

VR

continuous reverse voltage

 

30

V

IF

continuous forward current

 

200

mA

IFRM

repetitive peak forward current

tp 1 s; δ ≤ 0.5

300

mA

IFSM

non-repetitive peak forward current

tp < 10 ms

600

mA

Ptot

total power dissipation (per package)

Tamb < 25 °C

200

mW

Tstg

storage temperature

 

65

+150

°C

Tj

junction temperature

 

125

°C

Tamb

operating ambient temperature

 

65

+125

°C

ELECTRICAL CHARACTERISTICS

Tamb = 25 °C unless otherwise specified.

SYMBOL

PARAMETER

CONDITIONS

MAX.

UNIT

 

 

 

 

 

Per diode

 

 

 

 

 

 

 

 

 

VF

continuous forward voltage

see Fig.6

 

 

 

 

IF = 0.1 mA

240

mV

 

 

IF = 1 mA

320

mV

 

 

IF = 10 mA

400

mV

 

 

IF = 30 mA

500

mV

 

 

IF = 100 mA

800

mV

IR

continuous reverse current

VR = 25 V; note 1; see Fig.7

2

μA

Cd

diode capacitance

VR = 1 V; f = 1 MHz; see Fig.8

10

pF

Note

1. Pulse test: tp = 300 μs; δ = 0.02.

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

 

 

 

 

 

Rth j-a

thermal resistance from junction to ambient

note 1

625

K/W

Note

 

 

 

 

1. Refer to SOT323 (SC70) standard mounting conditions.

1999 Apr 26

3

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