Philips 0031357 User Manual

CLASS NO.

Philips Innovation Services

3000 003 1359

1

2017-06-08

2

2017-06-29

WiFi HW reference Design 1.0

Approved

NAME

Wim van den Dungen

SUPERS

None

28

190 1 10 A4

DATA FMT

PDF

Tmpl v2.0

CHECK

DATE

2017-02-15

 KONINKLIJKE PHILIPS N.V. 2017

3000 003 13562

FCC ID: 2AALC0031357

IC: 22799-0031357

HVIN:

3000 003

13592

Philips Innovation Services

PInS WiFi reference design

Datasheet PInS WiFi module Draft

PRELIMINARY

COMPONENT FOR PHILIPS PRODUCT USE ONLY

Philips Innovation Services

Datasheet WiFi module

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TABLE OF CONTENT

COMPONENT FOR PHILIPS PRODUCT USE ONLY 1
DOCUMENT CHANGE HISTORY 4
1 INTRODUCTION 5

1.1 INTRODUCTION 5

1.2 OVERVIEW SPECIFICATIONS 6

1.3 FUNCTIONAL BLOCK DIAGRAM 7

1.4 OPEN POINTS 8

1.5 DEFINITIONS, ACRONYMS & ABBREVIATIONS 8
2 APPLICATIONS 9
3 INTERFACE 10

3.1 4 MAIN INTERFACES 10
4 ANTENNAS 11

4.1.1 APPROVED ANTENNA 11

5 OPERATION, STORAGE AND TRANSPORT CONDITIONS 11

5.1 OPERATIONAL CONDITIONS NORMAL OPERATION 11

5.2 OPERATIONAL CONDITIONS STORAGE 12

5.3 OPERATIONAL CONDITIONS TRANSPORT 12

5.4 ADDITIONAL CONDITIONAL SPECIFICATIONS 12

5.5 ENVIRONMENTAL 12
6 ARCHITECTURAL CHOICES AND CONSTRAINTS 13

6.1 STRATEGIC INTERFACES 13

6.2 STRATEGIC MODULE SIZE 13
7 GENERAL, SAFETY, LEGAL & SECURITY STANDARDS 14

7.1 GENERAL STANDARDS 14

7.2 CONTAMINATION 14

7.3 FCC, IC, SRRC, ETSI COMPLIANCE 14

4.1 EXTERNAL ANTENNA 11

7.3.1 IC COMPLIANCE 14

7.3.2 CONFORMITÉ AUX NORMES D’INDUSTRIE CANADA 14

7.3.3 FCC STATEMENT 15

7.4 INSTALLATION INSTRUCTION 15

7.5 LABEL REQUIREMENTS FOR END PRODUCT 16

7.6 UL COMPLIANCE 16
8 SPECIFICATIONS 16

8.1 MECHANICAL 16

8.2 ELECTRICAL 18

8.3 TYPICAL VALUES 18

8.4 COMMUNICATION 18

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8.5 ABSOLUTE MAXIMUM RATINGS 19

8.6 MODULE LEVEL RECOMMENDED MAXIMUM RATINGS 19

8.7 ELECTROSTATIC DISCHARGE SPECIFICATIONS 20
9 RF CHARACTERISTICS 21
10 RELIABILITY 22
11 REFLOW PROFILE 22

11.1 TYPICAL PROFILE 22

11.2 MEASURED REFLOW PROFILE DURING TEST RUNS 22
12 FOOTPRINT DETAILS 23
13 ORDERING INFORMATION 26

13.1 ORDERING VARIANT OF MODULE, PRODUCT SPECIFIC 26

13.2 COMMON PINS HW VARIANT, PCBA 12NC ORDERING INFORMATION 26

13.3 MODULE LABELING 27
14 REFERENCES 28

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Date

Person

Version

Reason

15-02-2017

Wim van den Dungen

0.1

First draft

29-03-2017

Wim van den Dungen

0.2

Cleanup and added details

31-03-2017

Wim van den Dungen

0.9

Proposed for release

03-04-2017

Wim van den Dungen

0.91

Added footprint information

14-04-2017

Wim van den Dungen

0.92

Minor updates MSL level, Footprint

14-04-2017

Wim van den Dungen

0.93

Minor updates, explaining MSL level and WoW

02-06-2017

Ioannis Pappous

0.94

Added information about standards compliance.
Update labeling, added external antenna
information. Layout schematics included. Added
missing information. Document reorganized

21-06-2017

Luc Tan

1.0

Release the document

 Add country settings.
 State that China regulation is under

development.

 Update external antenna directivity.
 Update FCC ID and IC ID.
 Clarify the 12 variants
 Use full 12NC not 11NC+x
 Add HVIN:

DOCUMENT CHANGE HISTORY

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Datasheet WiFi module

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1 Introduction

1.1 Introduction

PInS WiFi module V1.0 is a PCB Wi-Fi module designed by Philips innovation services (PInS) and based

on the latest Cypress WiFI SoC. The design is based on an internal Philips study and is backwards
compatible with an already used Philips module called Philips YD (obsolete), Additional functionality is
added to optimize usability and a cost effective solution of adding connectivity to Philips products.
The design is aligned with Philips CDPP, PSSO, PInS, and multiple business and making fast and easy
integration possible.
See datasheet of CYW43903 WICED™™ IEEE 802.11 a/b/g/n SoC with an Embedded Applications

Processor [1] for detailed specifications.
General description of the CYW43903 SoC that forms the bases of the module reference design:
The Cypress CYW43903 embedded wireless system-on-a-chip (SoC) is uniquely suited for Internet-of­Things applications. It is IEEE 802.11n compliant and provides full IEEE 802.11 b/g legacy compatibility with
enhanced performance. The device includes an ARM Cortex-based applications processor, a single stream
IEEE 802.11n MAC/baseband/radio, a power amplifier (PA), and a receive low-noise amplifier (LNA). It also
supports optional antenna diversity for improved RF performance in difficult environments. The CYW43903 is
an optimized SoC targeting embedded Internet-of-Things applications in the industrial and medical sensor,
home appliance markets. Using advanced design techniques and process technology to reduce active and
idle power, the device is designed for embedded applications that require minimal power consumption and a
compact size. The device includes a PMU for simplifying system power topology and allows for direct
operation from a battery while maximizing battery life.

Figure 1: Block Diagram

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• Dual ARM clocked at 160 MHz

• 1 MB of SRAM and 640 KB ROM available for the

applications processor.

• 64Mb encrypted flash storage

• IEEE 802.11 b/g/n 1×1 2.4 GHz radio.

• Single- and dual-antenna support. PCB and

external including diversity.
The module supports the following standards:

• IEEE 802.11n

• IEEE 802.11b

• IEEE 802.11g

• IEEE 802.11d

• IEEE 802.11h

• IEEE 802.11i

• Security:
– WEP
– WPA Personal
– WPA2 Personal
– WMM
– WMM-PS (U-APSD)
– WMM-SA
– AES (hardware accelerator)
– TKIP (hardware accelerator)
– CKIP (software support)

Proprietary Protocols:

– CCXv2
– CCXv3
– CCXv4
– CCXv5
– WFAEC

The module supports the following additional
standards:

• IEEE 802.11r—Fast Roaming (between APs)

• IEEE 802.11w—Secure Management Frames

• IEEE 802.11 Extensions:
– IEEE 802.11e QoS enhancements (already

supported as per the WMM specification)

– IEEE 802.11i MAC enhancements
– IEEE 802.11k radio resource measurement

Supported countries:

- Europe (ETSI)

- United states

- Canada

- China (TBC)

1.2 Overview specifications

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• External Flash 8MB

• (1) PCB Trace antenna

• (2) Connector for external

antenna

• Antenna diversity

• (3) Castellation SMT solder

mounting

• (4) 10 pin wire connector

• 16 I/O (14 shared)

• I2C

• SPI

• Main UART

• Debug UART

• JTAG

• 3V3 supply voltage

• (5) High speed production

programming

• RF Shield

• FCC, ETSI, IC module certified

• SRCC TBC

• Wi- Fi Alliance certified

• 40mm * 22mm * 9mm

Figure 2: Module Design

1.3 Functional block diagram

Figure 3: Functional block diagram

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PInS

Philips Innovation Services

CDPP

Philips Connected Digital Platforms & Propositions

Wi-Fi

Wireless Fidelity

RF

Radio Frequency

IEEE

Institute of Electrical and Electronics Engineers

PCB

Printed Circuit Board

PCBA

Printed Circuit Board Assembly

MAC

Media Access Control

AP

Access Point

ARM

Semiconductor IP company

SMT

Surface Mount Technology

ESD

Electrostatic Discharge

EU

European Union

USA

United States of America

FCC

Federal Communications Commission

SRRC

State Radio Regulation of China

RSS

Radio Standards Specifications

ETSI

European Telecommunications Standard Institute

ISTA

International Safe Transit Association

PMU

Power Management Unit

IEC

International Electrotechnical Commission

MCU

Micro-Controller Units

MSL

Moisture Sensitive Level

CE

Conformity European

UL

Underwriters Laboratories (safety organization)

TLL

Transistor-Transistor Logic

UART

Universal Asynchronous Receiver/ Transmitter

I2C

Inter-Integrated Circuit

SPI

Serial Peripheral Interface

JTAG

Joint Test Action Group (electronics industry association)

I/O

Input/ Output

RX

Receiver

FW

FirmWare

HW

HardWare

SoC

System on Chip

AWG

American Wire Gauge

PVC

Polyvinylchloride

DSSS

Direct-Sequence Spread Spectrum

OFDM

Orthogonal Frequency Division Multiplexing

PSDU

Physical layer Service Data Unit

MCS

Modulation and Coding Scheme

LNA

Low-Noise Amplifier

PER

Packet Error Rate

STBC

Space-Time Block Codes

GI

Guard Interval

BLE

Bluetooth Low Energy

EMC

Electromagnetic Compatibility

ESF

European Safety Federation

WEP

Wired Equivalent Privacy

WPA

Wi-Fi Protected Access

AES

Advanced Encryption Standard

TKIP

Temporal Key Integrity Protocol

1.4 Open Points

Adding details on request of Philips Business units and manufacturer.

1.5 Definitions, Acronyms & Abbreviations

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CKIP

Cisco Key Integrity Protocol

WMM

Wi-Fi Multimedia

SRAM

Static Random-Access Memory

ROM

Read-Only Memory

TBC

To Be Confirmed

HVIN

Hardware Version Identification Number

2 Applications

The PInS Wi-Fi reference design / platform is intended to be used inside Philips to enable connected
propositions and maximize the re-use with Philips and CDPP connectivity platforms. The application
supported are all Philips products including medical class products. The module is designed to be non­blocking for medical product integration (all tests and documentation are available). The module itself is not a
medical device as such.

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Figure 4: Interface functions

3 Interface

The interfaces of the module are defined as below. The interfaces are considered part of the platform in
order to have a common base, to maximize re-use and to provide backward compatibility and future
extensions of the platform.

3.1 4 main interfaces

There are 4 main interface sections in the module design (see Figure 2):

- (3) Castellations. Main interface for SMT placement of the module on product specific PCB board
holding communication, programming, supply and test interfaces. (X101..X124)

- (4) 10 pin AWG24 Board to Wire connector (JST SM10B-ZPDSS-TF(LF)(SN)): Main interface for
product integration based on Wired connection. This connector having Supply, Main UART, SPI, I2C
and I/O. (X125)

- (2) RF external connector (Hirose U.FL-R-SMT-1(10)), interface to support external antenna and
antenna diversity. (X2)

- (5) Fast programming pads: The fast programming pads are intended for in production high speed
programming and testing. (I1…I9)

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TE

Manufacturer

TE connectivity

Part Number

2118309-2

Polarization

Linear

Gain

2.5 dBi (2.4GHz band)

Impedance

50 Ω

Size

40.0 x 8.0 x 1.0 mm

Connector

u.fl

Approval

FCC, IC and ETSI (SRCC TBC)

Description

Range

Temperature range

-20°C...+70°C

Atmospheric pressure range

60kPa...110kPa

Relative humidity range

5%...95%

4 Antennas

The design includes 3 antenna options, PCB trace antenna, external antenna and antenna diversity.
The PCB trace antenna is design to have a performance of > 30% efficiency and maximum gain of 3dBi.

4.1 External Antenna

 This chapter gives an overview of the external antenna that can be fitted to the WiFi module.

This radio transmitter IC has been approved by Industry Canada to operate with the antenna
type listed below with the maximum permissible gain and required antenna impedance for each
antenna type indicated. Antenna types not included in this list, having a gain greater than the
maximum gain indicated for that type, are strictly prohibited for use with this device.

 Le chapitre suivant donne un aperçu de l'antenne externe qui peut être installée sur le module

WiFi. Cet émetteur radio IC été approuvé par Industry Canada pour fonctionner avec

le type d’antenne énumérés ci-dessous avec le gain maximum autorisé et l’impédance

nécessaire pour chaque type d’antenne indiqué. Les types d’antenne ne figurant pas dans cette

liste et ayant un gain supérieur au gain maximum indiqué pour ce type-là sont strictement
interdits d’utilisation avec cet appareil.

For each antenna, the "Approvals" field defines in which test reports the antenna is included. Definitions
of the «Approvals» field are:

 FCC - The antenna is included in the FCC test reports and thus approved for use in

countries that accept the FCC radio approvals, primarily US.

 IC - The antenna is included in the IC (Industry Canada) test reports and thus approved for

use in countries that accept the IC radio approvals, primarily Canada.

 ETSI - The antenna is included in the ETSI test reports and thus approved for use in

countries that accept the ETSI radio approvals (EU).

 SRRC – TBC.

4.1.1 Approved antenna

5 Operation, storage and transport conditions

5.1 Operational conditions normal operation

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Description

Range

Temperature range

5°C...+50°C

Atmospheric pressure
range

60 ... 110 kPa

Relative humidity range

10 ... 95 % rH
non-condensing

Tested for time in storage

6 months.

Devices are stored in a
vacuum sealed barrier bag
and stored in a reel to
support SMT pick and
place mounting

MSL3

Description

Range

Temperature range

-30 ... 70 °C

Atmospheric pressure
range

60 ... 120 kPa

Relative humidity range

10 ... 95 % rH
non-condensing

Conform broadband
random vibrations
according to IEC 60068-2­64

Severity level IEC 60721-4­7, Class- 7M2
And in line with ISTA
standard

conform the shock test IEC
60068-2-27 mounting

Severity level IEC 60724-4­7 Class-7M3
And in line with ISTA
standard

The device packaging
complies with ISTA
standard 2A

ISTA standard 2A

5.2 Operational conditions storage

5.3 Operational conditions Transport

5.4 Additional conditional specifications

- Module is MSL 3 level, transport and storage in sealed packaging,
(limit open air “life out of the bag” to <168 hours: make use of sealed vacuum bag which will limit
exposure of the chip to moisture to less than 168 hours prior to the last reflow round (MSL3= 168
hours). in case the chips were exposed for more than 168 hours, IPC/JEDEC J-STD-020B defines a
“baking” process to get the parts fit for use again. (min 8 hours @125°C))

- Packaging supports SMT (Pick and Place) tape and reel.

- Module should be handle as component, handle with care, and ESD protection should be used.

- Supply should be within specifications and clean, injected noise can be amplified and cause the
module to fail and work out of specification.

- All modules are functional tested, Wi-Fi connection speed, Carrier Wave tests, I/O tests and UART
tests. The Wired interface connector is not tested, needs to be tested at product level when used.

- Maximum reflow processes allowed is 1. (Critical Murata 2.4 GHz filter).

5.5 Environmental

- Module complies to Philips Regulated Substances List PHGR-GS-BP01-012.

- CE compliance

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Image 1: Connector

6 Architectural Choices and Constraints

The PInS Wi-Fi reference design is based on an internal Philips study on common requirements and product
examples. Out of this study the below strategic interfaces, shape and dimensions are defined.
Strategic interfaces, shape and dimensions of the reference design are beneficial to leverage scale,
compatibility and future updates and extensions. Wi-Fi and BLE chip updates, combo solutions and other IoT
technologies are on the roadmap and planned to be compatible.

6.1 Strategic interfaces

1- PCB Trace antenna (Omnidirectional and optimized for easy integration, > 30% efficiency)
2- Connector for external antenna option (In combination with RF switch optional) (Diversity option)
3- Castellation’s, SMT solder mounting option, See specific interface functions in figure 4.
4- Connector (AWG 24 compatible wires connector), strategic, Main MCU interface, Supply, SPI, I2C and I/O
(see figure 2).
5- Direct High Speed Flash programming, production.

6.2 Strategic module size

Model strategic size is 40mm (+/- 0.25mm) * 22mm (+/- 0.25mm) * 9mm
The module can be mounted into a slotted sliding fixture. Mechanical castellations are added for locking in
place. See detailed mechanical drawings in chapter 8.1 for more information.

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Country/setting

XX/17

NL/1

US

Applicable

Not Applicable

Canada

Applicable

Not Applicable

Europe

Applicable

Applicable

China

TBC

TBC

7 General, Safety, Legal & Security Standards

See Philips Safety, Legal and security standards used, see specific documents available on request. Fully
compliant with Product and Services Security Office (PSSO) and fully compliant to Philips requirements.
On request detailed documentation can be provided on Production, Approbation and certification. For
specific requirements and tractability.
Contact PInS for re-use module level certification and referrals

7.1 General Standards

The PInS WiFi module complies to the Safety Standard EN 62368-1 and is manufactured following the
ROHS/REACH directives.

7.2 Contamination

The module is validated as Pollution degree 2 equipment, normally only nonconductive pollution occurs.
Temporary conductivity caused by condensation is to be expected.

7.3 FCC, IC, SRRC, ETSI Compliance

The following modes of operation is supported by the module with
WLAN Firmware : wl0: Dec 19 2016 19:29:37 version 7.15.168.78 (r663126) FWID 01-8ba7c839

The system is designed to comply with the standards as mentioned below as part of a complete assembly.
The unit is classified as a class B product.

The PInS WiFi module is IC and FCC certified for the radio aspects (in the USA and Canada) and complies
with radio tests ETSI EN 300 328 V2.1.1 for EU. In addition, the module is complies with the EMC standards
for USA (FCC 15.209), EU (ETSI EN 301 489-17) and Canada. The certification of China is to be confirmed.

7.3.1 IC compliance

This device complies with Industry Canada license-exempt RSS standard(s).
Operation is subject to the following two conditions:

1. This device may not cause interference, and

2. This device must accept any interference, including interference that may cause undesired operation

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and

of the device.

maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio
interference to other users, the antenna type and its gain should be chosen in such a way that the equivalent
isotropically radiated power (e.i.r.p.) is not more than that is necessary for successful communication.
This equipment complies with IC RSS-102 radiation exposure limits set forth for an uncontrolled
environment.

7.3.2 Conformité aux normes d’Industrie Canada

Cet appareil est conforme à la(aux) norme(s) RSS sans licence d’Industry Canada.
Son utilisation est soumise aux deux conditions suivantes :

1. Cet appareil ne doit pas causer d’interférences et

2. il doit accepter toutes interférences reçues, y compris celles susceptibles d’avoir des effets
indésirables sur son fonctionnement.

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Conformément aux réglementations d’Industry Canada, cet émetteur radio ne peut fonctionner qu’à l’aide
d’une antenne dont le type et le gain maximal (ou minimal) ont été approuvés pour cet émetteur par Industry

Canada. Pour réduire le risque d’interférences avec d’autres utilisateurs, il faut choisir le type d’antenne et

son gain de telle sorte que la puissance isotrope rayonnée équivalente (p.i.r.e) ne soit pas supérieure à celle
requise pour obtenir une communication satisfaisante. Cet équipement respecte les limites d’exposition aux
rayonnements IC CNR-102 définies pour un environnement non contrôlé.

7.3.3 FCC statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

1. This device may not cause harmful interference, and

2. This device must accept any interference received, including interference that may cause undesired
operation.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to
Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference to
radio communications. However, there is no guarantee that the interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try to correct the interference by
one or more of the following measures:

 Reorient or relocate the receiving antenna
 Increase the separation between the equipment and receiver
 Connect the equipment into an outlet on a circuit different from that to which the receiver is

connected.

The PInS WiFi module is for OEM integrations only. The end-user product will be professionally installed in
such a manner that only the authorized antennas are used.

7.4 Installation instruction

Changes or modifications made to the module not expressly approved by Philips Innovation Services may
void the FCC / IC authorization to operate this equipment.

The use of the transceiver module is authorized in mobile or fixed host devices taking into account the
conditions listed below:

 Philips Business Units (integrator) must ensure that the end user manual may not contain any

information about the way to install or remove the module from the final product.

 Depending on the final host device additional authorization requirements for the non-transmitter

functions of the transmitter module may be required (i.e., Verification, or Declaration of Conformity)
Philips Business Units (integrator) are responsible for ensuring that after the module is installed and
operational the host continues to be compliant with the Part 15B unintentional radiator requirements.

 The information on the label and in the user manual is required to be incorporated in the user

manual of the final host. see 47 CFR15 requirements for more details (e.g. 15.19 / 15.21 / 15.101 /

15.105 / RSS-GEN / ICES)

 The module must be installed and used in strict accordance with Philips Innovation Services

instructions as described in the user documentation that comes with the module.

 The end user manual for the final host product operating with this transmitter must include operating

instructions to satisfy RF exposure compliance requirements.

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This device contains
FCC ID: 2AALC0031357
IC ID: 22799-0031357
CMIIT ID: TBC

e.g

Radiofrequency radiation exposure Information:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance of 20
cm between the radiator and your body.
This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.

Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un
environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de
20 cm de distance entre la source de rayonnement et votre corps.

 The antenna of the module may not be removed, replaced nor modified. The

antenna must not be co-located or operating in conjunction with any other antenna
or transmitter. No additional antenna must be used.

 When the final host product operating with this transmitter deviate from above,

installation of this module into specific final hosts may require the submission of a
Class II permissive change application containing data pertinent to RF Exposure,
spurious emissions, ERP/EIRP, and host/module authentication, or new application
if appropriate.

7.5 Label requirements for end product

For an end product using the PInS WiFI module there must be a label containing, at least, the following
information:

The label must be affixed on an exterior surface of the end product such that it will be visible upon inspection
in compliance with the modular approval guidelines developed by the FCC.

In accordance with 47 CFR § 15.19, the end product shall bear the following statement in a conspicuous
location on the device:
"This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions;
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause undesired
operation."

7.6 UL compliance

UL94V-0 compliance on PCB level.

8 Specifications

8.1 Mechanical

The dimensions and footprint are part of the platform and are considered strategic to have a common base.
Supporting backwards compatibility and future extensions of the platform proposition.
The main dimensions are 40mm * 22mm (+/- 0.250mm) and a maximum height of <9mm.
Refer to the latest sheet 110 [3] of the PCB for more information about the mechanical drawings.

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Figure 9: Mechanical drawing

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Description

Value

Supply voltage

3.3V

I/O input high voltage

3.3V

I/O input low voltage i

0V

I/O output high voltage
equal or larger than

2.4V

I/O output low voltage
equal or less than

0.4V

Supply voltage

Vpp <5mV recommended,
use correct decoupling and
filters if needed

Description

Typical

Main product UART
interface that operates at
3V3 TTL levels.

115200
Debug UART interface that
operates at 3V3 TTL levels

115200

SPI 4-wire master interface
bit-bang driver

1Mbps

SPI 4-wire master interface
hardware driver

20Mbps

I2C master interface
operating at a frequency

100kHz and 400kHz
JTAG interface

8.2 Electrical

General electrical specifications as tested on module level, for detailed specifications see datasheet of
CYW43903 WICED™™ IEEE 802.11 a/b/g/n SoC with an Embedded Applications Processor.

8.3 Typical Values

8.4 Communication

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Parameter

Symbol

Value

Unit

3.3V DC supply voltage

VDD_3P3

-0.5 to 3.9

V

Maximum undershoot voltage for I/O

V

undershoot

-0.5

V

Maximum overshoot voltage for I/O

V

overshoot

VDD_3P3 + 0.5

V

Maximum junction temperature

TJ

-0.5 to 3.9

°C

Description

Range

Supply voltage in the range

3.13V…3.6V

I/O input high voltage in the range

2.0 V…3.8V

I/O input low voltage in the range

-0.5V…0.8V

I/O output high voltage equal or larger than

2.4V

I/O output low voltage equal or less than

0.4V

Supply voltage

Vpp <5mV recommended, use correct decoupling
and filters if needed

8.5 Absolute Maximum Ratings

Caution! The absolute maximum ratings indicate levels where permanent damage to the device can occur,
even if these limits are exceeded for only a brief duration. Functional operation is not guaranteed under
these conditions. Operation at absolute maximum conditions for extended periods can adversely affect long­term reliability of the device. Information out of CYW43903 datasheet core SoC.

8.6 Module level recommended Maximum ratings

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8.7 Electrostatic Discharge Specifications

Extreme caution must be exercised to prevent electrostatic discharge (ESD) damage. Proper use of wrist
and heel grounding straps to discharge static electricity is required when handling these devices. Always
store unused material in its antistatic packaging. ESD specifications are based directly on the core
components specifications. No additional protection added on module level.

ESD specifications

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Description

Range

Closed-loop TX power variation at highest power

level stetting.

Across full temperature and voltage range.

Applies to 10dBm to 20dB output power range

Max +/- 1.5dB

See [1] for actual value

9 RF characteristics

Also see datasheet of CYW43903 WICED™™ IEEE 802.11 a/b/g/n SoC with an Embedded Applications
Processor.

See datasheet CYW43903 WICED™ IEEE 802.11 a/b/g/n SoC with an Embedded Applications Processor

[1] for additional information.

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10 Reliability

Lifetime target of 7 years,
Field failure rate target equal to or less than 0.5%
Target warranty period of 2 years

11 Reflow profile

11.1 Typical profile

Figure 11: Reflow profile

11.2 Measured reflow profile during test runs

Figure 12: Reflow profile during test runs

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12 Footprint details

TOP view

 Handle it as a module, black box to solder it on a PCB
 Module length 40 mm
 Module width 22 mm
 Module PCB thickness = 0.8±0.1 mm
 Module max height 10 mm (connector)
 Solder method is reflow
 Number of SMD pins are 23.
 Pad – edge shape from the module are castellation shapes.
 Use Partly metallized mounting base terminal
 Implement PCB edge indication = top of metal screening box (28 mm from the bottom)
 Place route keep out under the component (no via’s and prevent interference)
 There are 2 position non plated 1.3 mm castellation shapes at the side, needed for its own PCB

assembly.

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Figure 13: Layout

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Figure 14: Layout detail

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Hardware Version
Identification Number
(12NC-PCBA)

0 ohms
resistor

X125

Antenna setup

3000 003 13592

Mounted

Mounted

Switch

PCB-Antenna

RF-Signal

EXT

Ant

3000 003 13682

Mounted

3000 003 13612

Mounted

3000 003 13722

3000 003 13742

Mounted

Mounted

PCB-Antenna

RF-Signal

3000 003 13762

Mounted

3000 003 13782

Mounted

3000 003 13802

3000 003 13822

Mounted

Mounted

PCB-Antenna

RF-Signal

EXT

Ant

3000 003 13842

Mounted

3000 003 13862

Mounted

3000 003 13882

13 Ordering information

13.1 Ordering variant of module, product specific

1. Business needs to supply specific module FW 12NC (product specific, including MAC,
Security ICP KEYS and Cloud ID)

2. Select common PInS HW variant 12NC, see below

3. Business needs to create and supply new module 12NC (product specific)

13.2 Common PInS HW variant, PCBA 12NC ordering information

There will be 12 different variants.

- In case the 0 ohms resistors mounted GPIO (X103 and X109), I2C (X107 and X108) and SPI bus
(X110, X112, X115 and X116) are available on the castelations.

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3000 003 135 62

FCC ID: 2AALC0031357

IC: 22799-00 31357

HVIN:

3000 00 3

13592

3

4

5

10

9
8

6

7

1

2

7

Number

Description

Label

3

12NC-PCBA

Hardware version identification number (HVIN)

4

Model 12NC

Identification of specific product code including
end-application

5

QR code

Traceability information of the single module.
See content below.

Silkscreen

1

PHILIPS

Manufacturer name

2

POS UL code

Needs to be added by the PCB supplier.
Identification of the bare-board materials.

6

Cavity number

Needs to be added by the PCB supplier or End
supplier.
Added for traceability purpose.

7

CMIIT
Identification

China
(Position for the china ID)

8

IC
Identification

Canada

9

FCC
Identification

United States

10

12NC-PCB

Identification of the bare-board.

13.3 Module Labeling

Image2: Module labeling

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CODE

INFORMATION

YY

YEAR

WW

WEEK

D

(PRODUCTION DAY)

H: MONDAY

I: TUESDAY

J: WEDNESDAY

K: THURSDAY

L: FRIDAY

M: SATURDAY

N: SUNDAY

MAC Address (12 digit)

XXXXXXXXXXXX

Model 12NC (12 digit)

XXXXXXXXXXXX

Ref.#

Document Title

Document ID

[1]

CYW43903 WICED™™ IEEE 802.11 a/b/g/n SoC with an
Embedded Applications Processor Datasheet

002-14826 Rev. *C

[2]

Integration manual PInS Wi-Fi module V0.1

N/A

[3]

3000_003_13xxx_110_2017xxxx_WIFI_MECH

N/A

QR CODE LABEL INFORMATION

14 References