PARROT CK5050NEW Users Manual
Memory (Flash/SDRAM)
Vertic
al Horizontal
Parrot CK5050NEW
All in one multimedia module
Bluetooth 2.0+EDR compliant
Bluetooth 2.1+EDR available in 09Q3
Version 2.00
March 2009
Application:
• Telephony
• Audio streaming
• USB
• Ipod management
• Internet access (through DUN)
The CK5050New integrates the latest
version of the Parrot Bluetooth stack
(Blues). Blues gives to the customer a
very high level of compatibility with most of
the phones available on the market and
provide phonebook and list
synchronization.
The CK5050New can also integrate a
version of the Parrot USB management
library (Disco). Disco manages the USB
devices, build database with metadata,
browses the compressed audio files by
artist/gender/title and play them. Disco
also supports the IPod chip through the
I²C interface.
FEATURES
Bluetooth 2.0 + EDR qualified module
Piconet and scatternet support
Standard single 3V3 supply
CAN, UART, I²C
2*USB 2.0 full speed Host
GPIO
Ipod chip management
Digital audio input and output
Analog audio input and output
Small size module (34,5 x 41,35 mm)
Automotive qualified
Description:
Parrot CK5050New is a low cost solution
for Bluetooth connectivity. It integrates a
large variety of interfaces for an easy
integration in most of the applications
Internal or external antenna
Parrot
P5+
BT 2.0+EDR RF chip
Flash
SDRAM
CAN
2*USB 2 Full speed Host
2*UART
I²C
I²S in*1/out*2
PCM in/out
2*GPIO
2*Analog microphone input
Analog line in
2*Analog output
DATASHEET Confidential Information 1/49
Internal
antenna
External
antenna
32Mbits/64Mbbits
64Mbits/128Mbbits
32Mbits/64Mbbits
64Mbits/128Mbbits
PF240023AA PF240024AA
PF240033AA
PF240036AA PF240037AA
PF240038AA
PF240034AA
PF240039AA
Table of contents
1 PRODUCT OVERVIEW ............................................................................................................................... 4
2 SOFTWARE SPECIFICATIONS .................................................................................................................... 6
2.1
B
LUETOOTH STACK
2.2
B
LUETOOTH PROFILE SUPPORTED
2.3
S
OFTWARE INTERFACE
2.4
M
EMORY CONFIGURATIONS
3 ELECTRICAL SPECIFICATIONS .................................................................................................................... 8
3.1
H
ARDWARE ARCHITECTURE
3.2
P
INOUT
.................................................................................................................................................... 8
3.2.1 40 pins diagram ................................................................................................................................. 8
3.2.2 Pinout table ....................................................................................................................................... 9
3.2.3 Unconnected pins advice ................................................................................................................. 10
3.3
M
AXIMUM RATINGS
3.4
P
OWER CONSUMPTION
3.5
E
LECTRICAL SPECIFICATIONS
3.5.1 Power pins ....................................................................................................................................... 11
3.5.2 Reset pin .......................................................................................................................................... 11
3.5.3 IO pins .............................................................................................................................................. 12
3.5.4 CAN .................................................................................................................................................. 12
3.5.5 I²C .................................................................................................................................................... 13
3.5.6 USB .................................................................................................................................................. 14
3.5.7 UART0/UART1 ................................................................................................................................. 14
3.5.8 PCM ................................................................................................................................................. 15
3.5.9 I²S .................................................................................................................................................... 16
3.5.10 Analog out ................................................................................................................................... 17
3.5.11 Line in .......................................................................................................................................... 17
3.5.12 Microphone input ........................................................................................................................ 17
3.5.13 Bluetooth radio link ..................................................................................................................... 18
3.6
R
ESET AND SUPPLY SEQUENCE DIAGRAM
3.6.1 Switching ON ................................................................................................................................... 19
3.6.2 Switching OFF .................................................................................................................................. 19
3.6.3 Diagram ........................................................................................................................................... 19
3.7
I
NTERNAL COMPONENTS SCHEMATICS
3.7.1 Audio I/O ......................................................................................................................................... 20
3.7.2 Boot/reset and Power supply .......................................................................................................... 20
3.7.3 Serial Link ........................................................................................................................................ 20
3.8
I
NTEGRATION RECOMMENDATIONS
3.8.1 Analog out ....................................................................................................................................... 21
3.8.2 Analog in ......................................................................................................................................... 21
3.8.3 Microphone input ............................................................................................................................ 22
3.8.4 I2S .................................................................................................................................................... 22
3.8.5 USB .................................................................................................................................................. 23
...................................................................................................................................... 6
................................................................................................................... 6
................................................................................................................................. 7
.......................................................................................................................... 7
........................................................................................................................... 8
.................................................................................................................................. 11
(T°=-40°C
TO
+85°C) .............................................................................................. 11
........................................................................................................................ 11
....................................................................................................... 19
.......................................................................................................... 20
.............................................................................................................. 21
4 MECHANICAL SPECIFICATIONS ............................................................................................................... 24
4.1
H
4.2
4.3
4.4
4.5
4.6
4.7
4.8
ORIZONTAL MODULE WITH INTERNAL ANTENNA
H
ORIZONTAL MODULE WITH EXTERNAL ANTENNA
V
ERTICAL MODULE WITH INTERNAL ANTENNA
V
ERTICAL MODULE WITH EXTERNAL ANTENNA
C
ONNECTOR OF HORIZONTAL VERSION
C
ONNECTOR OF VERTICAL VERSION
PCB
FOOTPRINT FOR HORIZONTAL MODULE
PCB
FOOTPRINT FOR VERTICAL MODULE
.......................................................................................................... 28
............................................................................................................... 29
............................................................................................ 24
............................................................................................ 25
................................................................................................. 26
................................................................................................ 27
................................................................................................... 30
........................................................................................................ 30
DATASHEET Confidential Information 2/49
4.9
C
ONNECTORS SPECIFICATIONS
..................................................................................................................... 30
5 AVAILABLE TOOLS .................................................................................................................................. 31
5.1
W
ORKBENCH
5.1.1 Diagram ........................................................................................................................................... 31
5.1.2 Schematics ....................................................................................................................................... 32
5.2
W
XSERIAL
6 APPROVAL / CERTIFICATIONS ................................................................................................................ 33
6.1
CE D
6.2
FCC
AND IC REQUIREMENTS FOR MODULE APPLICATION
6.3
ROHS
ANNEXE .......................................................................................................................................................... 35
A. B
LUETOOTH
a. Head Unit paired with Mobile phone ................................................................................................... 35
b. Head Unit connected to Mobile phone and headset device ................................................................ 37
c. Head Unit paired with two Mobile phones .......................................................................................... 38
d. Audio Streaming and Handsfree working together ............................................................................. 39
e. Head Unit paired with Mobile phone and Music Player with Bluetooth dongle: ................................. 41
f. Head Unit paired with a stereo Headphone ........................................................................................ 42
g. Head Unit paired with two stereo Headphones ................................................................................... 42
h. Head Unit paired with Mobile phone: Data transfer ........................................................................... 44
B. USB/IP
a. Head Unit with a iPod connected through the USB ............................................................................. 45
b. iPod & iPhones Use Cases .................................................................................................................... 46
c. Head Unit paired with a connected USB Mass storage device ............................................................ 47
C. H
EAD UNIT
........................................................................................................................................... 31
............................................................................................................................................... 32
ECLARATION
DECLARATION
OD USE CASES
BT/USB
..................................................................................................................................... 33
................................................................................... 34
................................................................................................................................. 34
HFP & A2DP/AVRCP
................................................................................................................................... 45
SOFTWARE UPDATE
USE CASES OVERVIEW
........................................................................................................... 48
: .................................................................................. 35
DATASHEET Confidential Information 3/49
1 Product overview
The CK5050New is a feature-rich Bluetooth/USB platform dedicated for the integration of
Bluetooth and multimedia applications in car audios, car telematic systems or any systems
requiring a complete embedded multimedia solution. CK5050New can integrate USB and
Ipod management.
CK5050New features are:
• Bluetooth connectivity
Bluetooth Power Class 2 Radio
Embedded Bluetooth v1.1, v1.2 & v2.0+EDR compliant (v2.1+EDR 09Q3)
Embedded profiles
Compatible with most of Bluetooth phones
Pairing and connection with all Bluetooth Devices: Phones, Smartphones,
PDA …
Multiple user support: Up to 10 paired phones
Multiple connection (up to 3 device connected at the same time)
Multiple profile
• Phone
Pick-up, Hang-up, Redial
Automatic answer (from host via pickup command)
Send DTMF during calls
Private Mode
3-way calling
• Phone Book
Automatic Phone book synchronization over Bluetooth (up to 5000 contacts)
Call history (dialed number, received calls, missed calls)
All Synchronization Methods
Full Unicode for compatibility with numerous characters sets (European,
Russian, Chinese, Japanese…)
• Digital Signal Processing and Acoustics
Acoustic Echo cancellation for Full Duplex operation
Noise reduction
Beam forming with 2 microphones inputs
Volume control
Speaker dependant voice recognition (trained names and keyword)
• Audio Streaming
Embedded SBC decoder
Embedded MP3 decoder from Thomson Licensing (optional)
Stereo audio output
• Miscellaneous
Provide Phone Battery Level and Network Level, Carrier Name (depends on
phones)
• Software Update
Full standard Software available (free upgrade from Parrot homepage)
Software update available through Bluetooth, USB, UART or DUN
Very large compatibility with Phones, Smartphones, PDAs, Music players
DATASHEET Confidential Information 4/49
• External Bluetooth Antenna diagnostic
• USB
Parrot CK5050New embeds USB 2.0 HOST Full speed transceivers
Compliant with USB devices supporting Mass Storage Class
Able to build a musical database from a Mass Storage Device conform to
VFAT specifications (including FAT 12/16/32)
Using a dedicated library called DISCO, the feature supported by Parrot is to
be able to retrieve the list of files and the metadata contained in the different
files.
• CAN bus connection
DATASHEET Confidential Information 5/49
2 Software specifications
2.1 Bluetooth stack
• HCI (Host Controller interface),
• L2CAP (Logical Link Control and Adaptation Protocol),
• RFCOMM
• SDP (Service Discovery Protocol),
• OBEX (IrDA Object Exchange).
2.2 Bluetooth profile supported
• Generic Access Profile
• Phone Management
HFP 0.96 - 1.0 - 1.5
HSP 1.0
SAP (SIM Access Profile)
• Message Management
MAP 1.0
• Phone Book
PBAP 1.0
SYNC 1.1 (IrMC SYNC over BT)
SYNCML
OPP 1.0 Server/Client (Vcard 2.1)
GSM 07.07 AT Commands
Nokia synchronization protocol
• Multimedia
A2DP (Audio)
SBC decoding
(optional MP3 decoding)
AVDTP
AVRCP1.2 / AVRCP1.3 / AVRCP1.4
• Others
SPP 1.1
BNEP, PAN
FTP 1.0
Image transfer over OPP
DUNP 1.1
Software update over SPP or DUN
Secure Simple Pairing 09Q3
DATASHEET Confidential Information 6/49
(4)
(2)
(3)
2.3 Software interface
The software interface provides a high level command set, hiding the complexity of the
Bluetooth.
This software is based on the well-known AT commands. Some of these commands are
directly derived from the GSM 07.07 recommendations and the appropriate Bluetooth
profiles.
Some supplementary commands are used to manage Bluetooth related functions like device
pairing and connection management as well as the acoustic and speech recognition
functions.
AT Command List and Bluetooth AT Command Software Specification are available on
demand.
BLUES supports Unicode, which allows the management of accents and phonebook in any
language. The format of the exchange with the HOST is UTF8
2.4 Memory configurations
Flash/SDRAM
(Mbits)
32/64 Up to
64/128 Up to
(1)
Some codecs need specific fee to be paid directly to the right organization
(2)
An IPod chip must be externally connected to the module (I²C interface)
(3) D
atabase up to 10000 songs
(4)
Parrot USB management library
Paired
phones
10
10
Max.
contacts
Disco
Supported
codecs
(1)
1000 No SBC No
5000 Yes
SBC, MP3, WMA,
WAV, AAC
Ipod
Yes
DATASHEET Confidential Information 7/49
*
* : BT2.1 + EDR will be available in 09Q3
3 Electrical specifications
3.1 Hardware architecture
Internal
or
exter nal
antenna
RF Baseband
2*microphone input
Analog line in
2*Analog output
I²S out
I²S in/out
PCM in/out
3.2 Pinout
3.2.1 40 pins diagram
CAN_Tx
CAN_Rx
I/O1
USB0_D-
USB0_D+
Boots
Vcc
PCM_OUT
PCM_IN
PCM_SYNC
PCM_CLK
I2S_OUT1
I2S_SYNC
I2S_MCLK
Vss
SPK2P
MIC_PWR
MIC1P
MiC2N
Lin
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
Osc.
2.0+EDR
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
UART
PCM
CODEC
I2C_CLK
I2C_DA
I/O2
USB1_DUSB1_D+
NRESET
VSS
U1_OUT
U1_IN
U0_OUT
U0_IN
I2S_OUT2
I2S_IN
I2S_CLK
Vcc
SPK1P
HP_COM
MIC2P
MIC2N
Rin
SDRAM
I²S in
I²S out
Parrot
P5+
FLASH26MHz
Reset
Boots
Pin 1
Various
Voltages
(internal)
2*GPIO
2*UART
CAN
I²C
2*USB 2 Full speed Host
Supply
& reset
nReset
power
Boots
Pin 1
DATASHEET Confidential Information 8/49
Pin Function
Type
Description
01 CAN_TX
O
CAN interface
02 I2C_CLK
O
I²C clock
03 CAN_RX
I
CAN interface
04 I2C_DA
I/O I²C data
05 I/O_1
I/O General purpose IO
06 I/O_2
I/O General purpose IO
07 USB0_D
- I/O USB interface data
-
08 USB1_D
- I/O USB interface data
-
09 USB0_D+
I/O USB interface data +
10 USB1_D+
I/O USB interface data +
11 Boots
I
Command for software update
12 Nreset
I
Reset
13 Vcc Power
Power
14 Vss Power
Ground
15 PCM_OUT
O
PCM data out
16 U1_OUT
O
UART
out (debug)
17 PCM_IN
I
PCM data in
18 U1_IN
I
UART in (debug)
19 PCM_SYNC
I/O PCM synchronization
20 U0_OUT
O
UART out
21 PCM_CLK
I/O PCM clock
22 U0_IN
I
UART in
23 I2S_OUT1
O
I²S data out
24 I2S_OUT2
O
I²S data out
25 I2S_SYNC
I/O I²S synchronization
26 I2S_IN
I
I²S data in
27 I2S_MCLK
I/O I²S master clock
28 I2S_CLK
I/O I²S clock
29 Vss Power
Ground
30 Vcc Power
Power
31 SPK2P
O
Analog audio out
put (left)
32 SPK1P
O
Analog audio output (right)
33 MIC_PWR
O
Microphone power supply
34 HP_COM
I
Headphone ground common feedback input
35 MIC1P
I
Analog microphone differential input +
36 MIC2P
I
Analog microphone differential input +
37 MIC1N
I Analog microphone differential input
-
38 MIC2N
I
Analog microphone differential input
-
39 Lin I Analog audio line in (left)
40 Rin I Analog audio line in (right)
3.2.2 Pinout table
DATASHEET Confidential Information 9/49
Pin Function
Type
Comment
01 CAN_TX
O
02 I2C_CLK
O
Left ope
n
03 CAN_RX
I
04 I2C_DA
I/O Left open
05 I/O_1
I/O To be configured as
input
and
connected to
Vss
06 I/O_2
I/O To be configured as input and connected to
Vss
07 USB0_D
- I/O Left open
08 USB1_D
- I/O Left open
09 USB0_D+
I/O Left open
10 USB1_D+
I/O Left open
11 BOOTS
I
Left open
15 PCM_OUT
O
16 U1_OUT
O
Left open
17 PCM_IN
I
18 U1_IN
I
Pull Up 22KOmhs
19 PCM_SYNC
I/O
20 U0_OUT
O
Left open
21 PCM_CLK
I/O
22 U0_IN
I
Left open
23 I2S_OUT1
O
Left open
24 I2S_OUT2
O
Left open
25 I2S_SYNC
I/O Left open
26 I2S_IN
I
Pull Down 47KOmhs
27 I2S_MCLK
I/O Left open
28 I2S_CLK
I/O Left open
31 SPK2P
O
32 SPK1P
O
33 MIC_PWR
O
Left open
34 HP_COM
I
35 MIC1P
I
Connect directly to ground
36 MIC2P
I
Connect directly to ground
37 MIC1N
I
Conn
ect directly to ground
38 MIC2N
I
Connect directly to ground
39 Lin I Connect to ground through a capacitor (1nF)
40 Rin I Connect to ground through a capacitor (1nF)
3.2.3 Unconnected pins advice
DATASHEET Confidential Information 10/49
Parameter
Conditions
Min.
Typ.
Max.
Unit
Paramet
er Conditions
Min.
Typ.
Max.
Unit
3.3 Maximum ratings
Operating temperature range ........................................................................... -40°C to +85°C
Storage temperature range ............................................................................ -40°C to +125°C
Voltage on Vcc with respect to Vss.................................................................... -0.3V to +3.7V
ESD sensitivity according ES-XW7T-1A278-AC ............................................................... ±4kV
3.4 Power consumption
Stop mode ..................................................................................................................... <20µA
Idle mode (waiting for commands) .............................................................................. <150mA
Hands free and audio streaming mode ....................................................................... <300mA
(T°=-40°C to +85°C)
3.5 Electrical specifications
3.5.1 Power pins
Conditions unless noted, otherwise : Tamb.=25°C
Normal supply 3.2 - 3.6 V
3.5.2 Reset pin
Conditions unless noted, otherwise : T=-40°C to +85°C; Vcc=3V2 to 3V6
Reset time 50 - - µs
Active reset voltage level - - 0.4 V
Non active reset voltage level 2.5 - - V
DATASHEET Confidential Information 11/49
Parameter
Conditions
Min.
Typ.
Max.
Unit
Parameter
Conditions
Min.
Typ.
Max.
Unit
3.5.3 IO pins
Electrical parameters of the GPIO pins (5 and 6)
Conditions unless noted, otherwise : T=-40°C to +85°C; Vcc=3V2 to 3V6
Input voltage 0 - Vcc V
Output voltage 0 - Vcc V
High level input voltage (
Low level input voltage (
Low level input current Vi=0V;
High level input current Vi=Vcc;
Hysteresis voltage 0.5 0.62 V
High level output voltage (
Low level output voltage (
Level output current Vout= n V - - 2 mA
Vih min
Vil max
) 0.7*
Vcc
- - V
) - - 0.2*Vcc V
Voh min
Vol max
pull up
) Iout= n mA Vcc-0.4 3.3 - V
) Iout= n mA - - 0.4 V
- - 100 µA
pull down
- - 92 µA
3.5.4 CAN
Conditions unless noted, otherwise : Tamb.=25°C; Vcc=3V3
Input high level voltage (Vih min) 0.7*
Input low level voltage (Vil max) - - 0.2*Vcc V
Output high level voltage (Voh
Vcc-0.4 - - V
min)
Output low level voltage (Vol
- - 0.4 V
max)
Vcc
- Vcc V
DATASHEET Confidential Information 12/49
Parameter
Conditions
Unit
Min.
Max.
Min.
Max.
3.5.5 I²C
Timing parameters of the I²C bus (pins 2 and 4)
SDA
Tbus
Tclk(h)
SCL
Tf
Tclk(l)
Tr
Tdat(h)
Tdat(s)
Conditions unless noted, otherwise : Tamb.=25°C; Vcc=3V3
I²C 100kHz I²C 400kHz
SCL clock frequency 0 100 0 400 kHz
Bus free between start and
6 - 1.5 - µs
stop (Tbus)
Low period of SCL (Tclk(l)) 6 - 1.5 - µs
High period of SCL (Tclk(h)) 4.0 - 0.6 - µs
Data hold time (Tdat(h)) 50 50 ns
Data setup time (Tdat(s)) 50 - 50 - ns
Rise time of both SDA &
- 50 - 50 ns
SCL (Tr)
Fall time of both SDA &
- 50 - 50 ns
SCL (Tf)
Max. capacity load for each
- 400 - 400 pF
bus line
Input high level voltage (Vih
0.7*
Vcc
- 0.7*
Vcc
- V
min)
Input low level voltage (Vil
- 0.2*Vcc - 0.66 V
max)
Output high level voltage
Vcc-0.4 - Vcc-0.4 - V
(Voh min)
Output low level voltage
- 0.4 - 0.4 V
(Vol max)
DATASHEET Confidential Information 13/49
Parameter
Conditions
Min.
Typ.
Max.
Unit
Paramete
r Conditions
Min.
Typ.
Max.
Unit
(1)
3.5.6 USB
Conditions unless noted, otherwise : Tamb.=25°C; Vcc=3V3; Cload=50pF
Differential input sensitivity |(D+)-(D-)| TBD - - V
Differential common mode voltage
range
Single ended receiver switching
threshold voltage
Low level output voltage for low and
full speed
High level output voltage for low and
full speed
Transceiver capacitance Pin to Vss - - TBD pF
Rise time 10% to 90% 4 - 20 ns
Fall time 10% to 90% 4 - 20 ns
Output signal crossover voltage 1.3 - 2 V
Input high level voltage (Vih min) TBD - - V
Input low level voltage (Vil max) - - TBD V
Output high level voltage (Voh min) TBD - - V
Output low level voltage (Vol max) - - TBD V
Include differential
input sensitivity
TBD - TBD V
Rload=1.5kΩ to 3V3 - - TBD V
Rload=1.5kΩ to Vss TBD - TBD V
TBD - TBD V
3.5.7 UART0/UART1
Conditions unless noted, otherwise : Tamb.=25°C; Vcc=3V3
Input high level voltage (Vih min) 0.7*Vcc - - V
Input low level voltage (Vil max) - - 0.2*Vcc V
Output high level voltage (Voh min) 0.4*Vcc - - V
Output low level voltage (Vol max) - - 0.4 V
Rise time Cload=10pf - - 170 ns
Fall time Cload=10pf - - 160 ns
Baud rate - - 650 kbps
Emission Baud rate precision - 0.25 - %
Reception Baud rate tolerance - 4 - %
DATASHEET Confidential Information 14/49
Parameter
Conditions
Min.
Typ.
Max.
Unit
3.5.8 PCM
Timing parameters of PCM interface (pins 15, 17, 19 & 21)
TI frame sync
Tfs.ti(h)
Tclk(h)
Tdat.in(h)Tdat.out(v)
OKI frame sync
Clock
Tfs.oki(s)
Tfs.ti(s )
Tfs.oki(h)
Tclk(l)
Data OUT
Data IN
MSB LSB MSB
Tdat.in(s)
MSB LSB MSB
LSB
LSB
Conditions unless noted, otherwise : Tamb.=25°C; Vcc=3V3
Frame sync TI to clock falling setup time
10 - - ns
(Tfs.ti(s))
Frame sync TI to clock falling hold time
10 - - ns
(Tfs.ti(h))
Frame sync Oki to clock falling setup time
10 - - ns
(Tfs.oki(s))
Frame sync Oki to clock falling hold time
10 - - ns
(Tfs.oki(h))
PCM clock high time (Tclk(h)) 100 - - ns
PCM clock low time (Tclk(l)) 100 - - ns
PCM data in hold time (Tdat.in(h)) 10 - - ns
PCM data in setup time (Tdat.in(s)) 10 - - ns
PCM data out volid time (Tdat.out(v)) - - 25 ns
Input high level voltage (Vih min) 0.7*Vcc - - V
Input low level voltage (Vil max) - - 0.2*Vcc V
Output high level voltage (Voh min) 0.4*Vcc - - V
Output low level voltage (Vol max) - - 0.4 V
DATASHEET Confidential Information 15/49
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