Pantech GB100 Service Manual

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GB100 Service Manual GB100

GB100 Service Manual

(GSM Cellular Phone)

Pantech Co., Ltd., Korea

September 1, 2004

For Use by Authorized Service/Maintenance Personal Only

Documents to Receive This Addendum:

Edition

GB100 Maintenance/Repair/Operating Manual

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GB100 Service Manual

CONTENTS

SECTION 1 INTRODUCTION .............................................................................................................3

1.1 INTRODUCTION ..............................................................................................................................3

1.2 FREQUENCY ALLOCATION AND ITS USE ...........................................................................................3

1.3 ITEM NAME AND USE......................................................................................................................4

1.4 CHARACTERISTICS.........................................................................................................................4

SECTION 2 ELECTRICAL SPECIFICATIONS....................................................................................5

2.1 GENERAL ......................................................................................................................................5

2.2 TRANSMITTER…………………………………………………………………………………………….5

2.3 RECEIVER…………………………………………………………………………………………………5

SECTION 3 OPERATION....................................................................................................................6

3.1 NAME OF EACH PART…..……………………………….…………………………………………………6

3.2.DISPLAY ..………………….…………………………….………………………………………………..7

3.3 KEYPAD …………………………………….………….………………………………………………..7

SECTION 4 THEORY OF OPERATION..............................................................................................8

4.1 LOGIC SECTION........................................................................................................................8

4.1.1 DC DISTRIBUTION AND REGULATION PART…………………………………………………………….8

4.1.2 LOGIC PART…………………………………………………………………………………………….8

4.1.2.1 SUMMARY…………………………………………………………………………………………….8

4.1.2.2 BASEBAND DIGITAL SIGNAL PROCESSING…………………………………………………………..8

4.1.3 MEMORY PART………………………………………………………………………………………..10

4.1.4 NOTIFICATION PART .................................................................................................................. 11

4.1.5 KEY PAD PART.......................................................................................................................... 11

4.1.6 LCD MODULE(DISPLAY PART)................................................................................................... 11

4.2 RADIO TRANSCEIVER SECTION.....................................................................................................12

4.2.1 DC DISTRIBUTION AND REGULATION PART .................................................................................13

4.2.2 TRANSCEIVER PIN DESCRIPTION…………………………………………………….……….14

4.2.3 RECEIVE SECTION………………………………………………………………………………….…17

4.2.3.1 AN OVERVIEW OF RECEIVE SECTION.......................................................................................17

4.2.3.2 RECEIVER PART……………………………………………………………………………….……18

4.2.4 TRANSMIT SECTION ..................................................................................................................19

4.2.4.1 AN OVERVIEW OF TRANSMIT SECTION ....................................................................................19

4.2.4.2 TRANSMITTER PART...............................................................................................................20

4.2.5 OFFSET PLL……………………………………………………………………………….…………..21

4.2.5.1 AN OVERVIEW OF OFFSET PLL............................................................................................21

4.2.5.2 VCTCXO(VOLTAGE CONTROLLED TEMPERATURE COMPENSATED CRYSTAL OSCILLATOR):V801….22

SECTION 5 ALIGNMENT PROCEDURE..........................................................................................23

5.1 RECOMMENDED TEST EQUIPMENT................................................................................................23

5.2 CONNECTION OF TEST EQUIPMENT...............................................................................................23

SECTION 6 EQUIPMENT REPAIR PROCEDURE...........................................................................24

6.1 NO POWER ON WITH BATTERY APPLIED ..........................................................................................24

6.1.1 POWER CHECK.........................................................................................................................24

6.1.2 OSCILLATION CHECK ................................................................................................................30

6.1.3 KEYPAD LED NOT IN OPERATION(3-COLOR AND BLUE) ..............................................................31

6.1.4 LCD EL BACKLIGHT LED NOT IN OPERATION(WHITE)..………………………………………… …33

6.2 AUDIO PART(EARPIECE, HANDS FREE EARPHONE, MICROPHONE, HANDS FREE MIC) ..................35

6.2.1 NO RECEIVING TONE HEARD (EARPIECE) ..................................................................................35

6.2.2 NO RECEIVING TONE HEARD (HANDS FREE EARPHONE).............................................................35

6.2.3 SIDETONE NOT TRANSMITTED (EARPIECE)................................................................................38

6.2.4 SIDETONE NOT TRANSMITTED (HANDS FREE MIC) .....................................................................38

6.2.5 HOOK SWITCH NOT WORKING ..................................................................................................39

6.2.6 MELODY NOT RINGING.............................................................................................................40

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6.2.7 VIBRATOR NOT WORKING …………………………………………………………………...…41

6.3 SIM CARD PART ……………………………………...…………………………………………….42

6.3.1 SIM ERROR ………………………………………………………………………………………….42

6.4 CHARGER PART……………………………………………………………………………………..43

6.4.1 CHARGING ERROR ………………………………..…………………………………………………43

6.5 RF PART…………….………………………………………………………………………………… 45

6.5.1 TEST CONDITIONS………………………………………………………………… …………………45

6.5.2 POWER SUPPLY CHECK POINT……………………………………………………………………….46

6.5.3 POWER AMPLIFIER MODULE ………………………………………………………………………...48

6.5.4 VCTCXO...…………...………………………………………………………………………………..50

6.5.5 ANTENNA SWITCH MODULE……………………………………………………….…………………..51

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SECTION 1. Introduction

1.1 An Introduction of GSM Digital Cellular Mobile Communication System

GSM (Global System for Mobile communication) concluded that digital technology working in

the Time Division Multiple Access (TDMA) mode would provide the optimum solution for the

future system. Specifically , a TDMA system has the following advantage

► Offers a possibility of channel splitting and advanced speech coding ,resulting in improved

spectrum efficiency.

► Offers much greater variety of service than the analog

► Allows considerable improvements to be made with regards to the protection of information.

The GSM system is basically designed as a combination of three major subsystem;

The network subsystem, the radio subsystem, and the operation support system.

The functional architecture of a GSM system can be divided into the Mobile Station (MS), the Base

Station (BS), and the Network Subsystem (NS). The MS is carried by the subscriber, the BS

subsystem controls the radio link with the MS and the NS performs the switching of calls between

the mobile and other fixed or mobile network users as well as mobility management. The MS and

the BS subsystem communicate across the Um interface also known as radio link

The specifications relating to MS are as follows:

z TS 100 607-1 : Digital cellular telecommunication system(Phase2+)Mobile Station (MS) con

Formance specification Part1:Conformance specification

1.2 Frequency Allocation and Its Use

z Transmit frequency band : 880 MHz ~ 915 MHz(For EGSM), 1710 MHz ~ 1785 MHz(For DCS)

1850 MHz ~ 1910 MHz(For PCS)

z Receive frequency band: 925 MHz ~ 960 MHz(For EGSM) , 1805 MHz ~ 1880 MHz(For DCS),

1930 MHz ~ 1990 MHz(For PCS)

z Channel spacing : 200 KHz z ARFCN(Absolute Radio Frequency Channel Number) : 1~124 and 975~1023 (For EGSM),

512~885 (For DCS), 512~810 (For PCS)

z Transmit·receive frequency spacing: 45 MHz(For EGSM),

z Frequency band and Channel Arrangement

For standard GSM Fl(n)=890+0.2*n 1 ≤n≤ 124 Fu(n)=Fl(n)+45

890 MHz ~915 MHz : Mobile Transmit,Base receive

935 MHz ~960 MHz : Base Transmit, Mobile receive

For Extended GSM Fl(n)=890+0.2*n 1 ≤n≤ 124 Fu(n)=Fl(n)+45

Fl(n)=890+0.2*(n-1024) 975 ≤n≤ 1023

880 MHz ~915 MHz : Mobile Transmit,Base receive

95MHz(For DCS), 80MHz(For PCS)

925 MHz ~960 MHz : Base Transmit, Mobile receive

For DCS Fl(n)=1710.2+0.2*(n-512) 512≤n≤885 Fu(n)=Fl(n)+95

1710 MHz ~ 1785 MHz : Mobile Transmit,Base receive

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1805 MHz ~ 1880 MHz : Base Transmit, Mobile receive

For PCS Fl(n)=1850.2+0.2*(n-512) 512 ≤n≤ 810 Fu(n)=Fl(n)+80

1850 MHz ~1910 MHz : Mobile Transmit,Base receive

1930 MHz ~1990 MHz : Base Transmit, Mobile receive

** Fl(n)= frequency value of the carrier , Fu(n)= corresponding frequency value in upper band

1.3 Item Name and Usage

GB100, GSM digital cell phone, is supercompact, superlight mobile communication terminal for

personal use. It has a 900MHz, 1800MHz and 1900MHz frequency band and adopts GSM and

PCS mode having excellent spectrum efficiency, economy, and portability.

This product is GSM Cellular type portable phone, adopting 1-cell Li-ion battery and power saving

circuit to maximize its operation time. Also, it is equipped with a fixed antenna (snap-in type) and its

color LCD with font built in enables both Chinese and English text service. And power control(basic

feature of GSM), security feature, voice symbol feature, and variable data rate feature are used

appropriately to ensure its best performance. This product consists of a handset, battery pack, and

Travel charger.

1.4 Characteristics

1) All the active devices of GB100 are made of semiconductors to ensure excellent performance

and semi-permanent use.

2) Surface mounting device (SMD) is used to ensure high reliability, compactness and lightness.

3) GB100 adopts the Skyworks’s RF transceiver, which is CMOS RF front-end for multi-band GSM

digital cellular handsets. The Skyworks’s RF transceiver highly-integrated architecture

eliminates the IF SAW filter, low noise amplifiers (LNAs) for three bands, transmit and RF

voltage-controlled oscillator (VCO) modules, and more than 60 other discrete components found

in conventional GSM handsets to deliver smaller, more cost effective GSM solutions that are

easier to design and manufacture.

4) GB100 is designed to perform excellently even in the worst environment

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Section 2. Electrical Specifications

2.1 General E-GSM / PCS Band

Mobile Transmit Frequency

Mobile Receive Frequency

The Number of Time Slot 8 The Number of Channels 174 / 374 / 299 Channel Spacing 200 kHz Power Supply Rechargeable Li-Ion Battery 3.7V/680mAh Operating Temperature

Dimension Weight 76 g

880 MHz ~ 915 MHz / 1710 MHz ~1785 MHz / 1850MHz ~ 1910MHz 925 MHz ~ 960 MHz / 1805 MHz ~ 1880 MHz / 1930MHz ~1990MHz

-10℃ ∼ +55℃ 76(H) ×40(W) ×23.5(D) mm (SLIM)

2.2 Transmitter E-GSM / PCS Band

Maximum Output Power Frequency Error Phase Error Minimum Output Power

Power Control

Output RF Spectrum TS 100 910V6.2.0 Switching Transient TS 100 910V6.2.0 Intermodulation attenuation

EGSM and DCS

Allocated a channel;

-36dBm 9kHz ~ 1GHz

-30dBm 1GHz ~ 12.75GHz

Idle mode;

-57dBm 9KHz ~ 1GHz

-47dBm 1GHz ~ 12.75GHz with the following excoptions

-59dBm 880MHz ~ 915MHz

Conducted Spurious Emissions

-53dBm 1.71GHz ~ 1.785GHz

-76dBm 1900 ~ 1920MHz, 1920 ~ 1980MHz, 2010 ~

PCS

Allocated Channel;

-36dBm 9KHz~ 1GHz

-30dBm 1GHz~ 12.75GHz

Idle mode;

-57dbm 9kHz ~ 1000MHz

-53dBm 1850MHz ~ 1910MHz

-47dBm 1GHz ~ 12.75GHz

33±2 / 30±2 / 30±2 dBm ±90Hz / ±180Hz / ±180Hz RMS < 5°, PEAK < 20° 5±5 / 0±5 dBm / 0±5 dBm 5~19(2 dB Step) ) / 0~15(2 dB Step) /

0~15(2 dB Step)

2025MHz, 2210 ~ 2170MHz

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2.3 Receiver

For GSM900 small MS :-102dBm Reference Sensitivity

For Adjacent interference

For Adjacent(200KHz) interference

For Adjacent(400KHz) interference

For Adjacent(600KHz) interference

Section 3 Operation

3.1 Name of each part

For DCS1800 / PCS1900 class3 MS : -102dBm

C/Ic

C/Ia1 -9 dB

C/Ia2 -41 dB

C/Ia3 -49 dB

9 dB

Antenna

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Two-mode Speaker

Display Screen

Mic

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3.2 Display(Single LCD)

Parameter Projected Actual (MAIN LCD)

Display Color STN LCD with white LED back lighting

65,000 colors European Character : (font size : 16×16) 7 lines x 8 characters Chinese Character

: (font size : 16×16) 7 lines × 8 characters Driver HCD667A66UBP Module Dimen. 34.8(W) x 41.61(H) x 4.94(D) Active Area 28.868(W) x 28.868(H) Dot pitch 0.07(W) x 0.21(H)

3.3 Keypad

Market Goal Projected Actual Comments English

Keypad

0-9, *,# Send (Color) End/Pwr (Color) Up (Melody), Down (Phonebook), Left (My menu), Right (SMS) Center (WAP) MENU, OK, CLR

* Key: Vib. Mode # Key: Auto Lock 0/+Key: International

0-9, *,# Send (Color) End/Pwr (Color) Up (Melody), Down (Phonebook), Left (My menu), Right (SMS) Center (WAP) MENU, OK, CLR

* Key: Vib. Mode # Key: Auto Lock 0/+Key: International 2 Volume Keys

Meets Goal. (Industrial design sample required) Meets Goal

Keys for VR and Lock International Volume up/down

2 Volume Keys

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Section 4. Theory of Operation

4.1 Logic Section

4.1.1 DC Distribution and Regulation Part

Applying battery voltage and pressing “END” key on the key pad short-circuits “Ground” and “ PowerON”. AD6535(U102) control that power manage regarding power on/off in handset Pressing POWERKEY on the key pad is active on the handset. This will turn on all the LDOs, when PowerON is held low. The power of RF Tx power amplifier is supplied directly by the battery.

4.1.2 Logic part

4.1.2.1 Summary

The logic part consists of AD6525 ARM7 microprocessor-combined DBB(Digital BaseBand)

GSM-ASIC, COMBO(flash ROM & SRAM), AD6535 ABB(Analog BaseBand) Chip. AD6525 is

GSM-ASIC chipset implemented for GSM terminal’s system control and baseband digital signal

processing.

Major parts used in the logic part are as follows:

1) AD6525 : U101, [ARM7 Processor Core + DBB GSM Signal Processing] ASIC

2) AD6535 : U102, Analog Baseband Processor (Power management + Voice Codec)

3) COMBO MEMORY(Flash ROM : U1, 64Mbit Flash Memory + 16Mbit SRAM )

4.1.2.2 Baseband Digital Signal Processing

AD6525 is a GSM core device containing ARM7 CPU core. AD6525 is 160 pin LFBGA (mini-BGA)

package, consisting of terminal chips. The function and characteristics of clock are as follows:

1) Complete single chip GSM Processor

2) Channel codec sub-system

• Channel coder and decoder

• Interleaver and Deinterleaver

• Encryption and Decryption

3) Control Processor Subsystem including

• Parallel and serial Display interface

• Keypad Interface

• SIM Interface

• Control of RADIO subsystem

• Real Time Clock with Alarm

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☞ Configuration by Function of AD6525

1 Microprocessor Core

AD6525 has a built-in ARM7 microprocessor core, including microprocessor interrupt controller,

timer/counter, and DMA controller. And besides, 32bit data path is included, and up to 8Mbyte

addressing is enabled and can be extended up to 16Mbyte. Although external clock should be

provided to operate the microprocessor, this core uses 13MHz VCTCXO to provide clock.

2 Input Clock

1) Main Clock(13 MHz):

This is the clock needed for the microprocessor built in AD6525 to operate.

2) VC-TCXO(13 MHz) , 32.768KHz Clock:

This is the system reference clock to control SLEEP mode.

This is the clock derived from 13MHz VC-TCXO clock, provided by RF part. It is the timing

reference clock for GSM signal processing.

3 DSP Subsystem

This is a GSM signal processing part in GSM mode, consisting of speech transcoding and

Channel equalization as follows:

1) Speech transcoding

In full rate, the DSP receives the speech data stream from VBC and encodes data from 104kbps to

13kbps. Using algorithm is Regular Pulse Excitation with Long Term Prediction (RPE-LTP).

2) Equalization

The Equalizer recovers and demodulates the received signal

The Equalizer establishes local timing and frequency references for mobile terminal as well as

RSSI calculation.

The equlization algorithm is a version of Maximum Likelihood Sequency Estimation(MLSI)

using Viterbi Algorithm.

☞ GSM Core and RF Interface

1) Transmitter:

AD6535 ABB receive data at 270kbps and use an on chip lock-up table to perform GMSK modulation. A pair of 10bit matched differential DACs convert the modulated data and pass I and Q analog data to the transmit section of the radio system.

2) Receiver:

The receiver I and Q signals are sampled by a pair of ADCs at 270kbps.

The I and Q samples are transferred to the EGSMP through a dedicated receive path serial port.

4 RF Interface

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This interfaces the RF part to control power amplifier, Tx LO buffer amplifier, VC-TCXO, and

AGC-end on transmit/receive paths in the RF part.

1) Transmitter Interface:

This transmits TX_AGC signal to Tx AGC amplifier to adjust transmit power level and sends

Ramp_DAC signal to the RF part to control power amplifier.

2) Receiver Interface:

This transmits RX_AGC signal to Rx AGC amp. to adjust receive path gain.

5 General Purpose ADC Support

The AD6535 includes a general purpose 10bit auxiliary ADC with four multiplexed input channel

These are used for measurment of battery voltage ID , temperature and accessory ID.

6 USC(Universal System Connector) Interface

A Typical GSM handset requires serial connections to provide data during normal phone operation

manufacturing,testing and debugging.

7 General Purpose Interface

The AD6525 provides 32 interface pin for control of peripheral devices. All GPIO pins start up as inputs. Additional purpose inputs and outputs are available under SW control.

8 Speech Transcoding

In full rate mode, the DSP receive the speech data stream from the ABB and encodes data from 104kbps to 13kbps.Using algorithm is Regular Pulse Exitation with Long Term Prediction as specified GSM Recommandation

9 Power Down Control Section

1) Idle Mode Control:

If IDLE/ signal turns ‘Low’, transmitter section becomes disabled.

2) Sleep Mode Control:

If IDLE/ and SLEEP/ signals turn ‘Low’, all the sections except for VC-TCXO circuit become

disabled.

3) Receiver & Transmitter Mode Control:

If IDLE/ and SLEEP/ signals turn ‘High’, all the sections become enabled to perform

transmit/receive operation.

4.1.3 Memory Part

Memory consists of COMBO (flash ROM & SRAM).

1 Flash ROM

Flash ROM has a capacity of 64Mbit(8MByte). The main programs of the terminal(call processing, user interface, and diagnostic task) and supplemental programs (NAM program and test program) are stored in the flash ROM. Even if the program version may be changed in the future, customers can download the program.

2 Static RAM

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SRAM has a capacity of 16Mbit(2MByte) and stores system parameters, data buffer, and stack of each task in it.

3 Key Tone Generation

All alert signals are generated by melody IC output.

4.1.4 Notification Part

The notification of incoming call is given by melody, vibrator, and 7color-LED.

1) Melody:

This is a device sounding alert/melody tones.

The melody datas are stored in flash memory (U104) And generated by 6525 DBB internal DSP.

2) Vibrator:

This is a device enabling vibration. The vibrator data is stored in flash memory(U104)

And generated by C5(GPO_23)pin.

3) 7color-LED:

This is a device to indicate a notification mode using the lamp.

U101 Nos. H12, C9 and B8 signal drives the lamp to flash.

4.1.5 Key Pad Part

To enable key operation to input information, the key matrix is configured using strobe signal of

KEYPADROW(0-4) and 5 input ports of KEYPADCOL(0-4). Also, to use the key even at light, the

backlight circuit is provided for LED 6s.

4.1.6 LCD Module(Display Part)

LCD module consists of LCD, controller, LED-Backlight,

LCD: 1S/W Icon x 1 lines[(128x3)x128] can be displayed on the LCD panel. 6 icons could be

provided by S/W. Controller with English font built in has been used.

LED-backlight Using illuminates the LCD panel, and LCD reflector enhances LCD display effect.

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4.2 Radio Transceiver Section

Fig.4-1. RF Transceiver block diagram

Fig.4-2. Top view of RF Transceiver PCB Layout

The RF Transceiver of GB100, which is AERO I , consists of the GSM transimitter, the GSM

Receiver, and the RF synthesizer. The highly integrated solution eliminates the IF SAW filter,

external low noise amplifiers (LNAs) for three bands,

transmit and RF voltage controlled oscillator

(VCO) modules, and more than 60 other discrete components found in conventional designs.

The receive section uses a digital low-IF architecture that avoids the difficulties associated with

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GB100 Service Manual

direct conversion while delivering lower solution cost and reduced complexity. The transmit section

is a complete up-conversion path from the baseband subsystem to the power amplifer (U701) and

uses an offset phase locked loop (PLL) with a fully integrated transmit VCO.

The frequency synthesizer includes integrated RF and IF VCO’s, Varactors, and Loop filters. The

unique integer-N PLL architecture produces a transient response that is superior in speed to

fractional architectures without suffering the high phase noise or spurious modulation effects often

associated with those designs.

4.2.1 DC Distribution and Regulation Part

The battery voltage, in return, is applied to the logic part and RF part via LDO(Low Drop-Out) regulator.

As several LDO regulators are used, power can be supplied for each necessary part efficiently.

Audio/Logic parts use +2.8V. SI4205 RF Transceiver(U501) and RF3133 Power Amplifer(U701) also

use +2.8V DC voltage.

4.2.2 Transciever pin description

Fig.4-3. Top View of Si4205

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Table 4-1. Pin Description of Si4205-BM

4.2.3 Receiver Section

4.2.3.1 An Overview of Receive section

Fig.4-6. Receiver block diagram

The GB100 model’s Aero transceiver uses a low-IF receiver architecture that follows for the

on-chip integration of the channel selection filters, eliminating the external RF image reject filters

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and the IF SAW filter required in conventional superheterodyne architectures. Compared to a direct

conversion architecture, the low-IF architecture has a much greater degree of immunity to dc

offsets that can arise from RF local oscillator (RFLO) self-mixing, 2

order distortion of blockers,

and device 1/f noise. This relaxes the common-mode balance requirements on the input SAW filters

and simplifies PC board design and manufacturing.

Three differential-input LNAs are integrated on the Aero I transceiver. The GSM input supports

EGSM 900 (925– 960 MHz) band. The DCS input supports the DCS 1800 (1805 – 1880 MHz).

A quadrature image-reject mixer downconverts the RF signal to a 100 kHz intermediate frequency

(IF) with the RFLO from the Si4133T frequency synthesizer. The RFLO frequency is between

1737.8 and 1989.9 MHz, and is divided by two in the Si4200 for GSM 850 and EGSM 900 modes.

The mixer output is amplified with an analog programmable gain amplifer (PGA), which is controlled

with the AGAIN[2:0] bits in register 05h. The quadrature IF signal is digitized with high resolution

A/D converters (ADCs).

ADC output is downconverted to baseband with a digital 100 kHz quadrature LO signal. Digital

decimation and IIR filters perform channel selection to remove blocking and reference interference

signals. After channel selection, the digital output is scaled with a digital PGA, which is controlled

with the DGAIN[5:0] bits in register 05h.

These analog and digital gain resigters must be set to provide a constant amplitude signal to the

baseband receive inputs.

DACs drive a differential analog signal onto the RXIP,RXIN,RXQP and RXQN pins to interface to

standard analog-input baseband Ics

4.2.3.2 Receiver Part

A. Diplexer: Z702

Diplexer consists of Tx filter, having an antenna port, and dual configuration with the transmitting path isolated from the receiving path. A signal receives from the antenna of frequency band which is 942.5±17.5MHz for EGSM bands, 1842.5±37.5 MHz for DCS bands and transmits it to dual saw

filter. The Tx filter passes through the output signals of frequency band that is 897.5MHz ±17.5MHz

for EGSM bands, 1747.5 ±37.5 MHz for DCS bands from the power amplifier and transmits it to the

antenna. The maximum insertion loss is about 0.8 dB for the receiving bands at 25

1.35 dB for the transmitting bands at 25

B. SAW filter (BPF / Band select filter): U502, U503,U504

The U502 filter is for the EGSM band signals which range 942.5±17.5MHz with low insertion loss.

C and about

And the U503 filter passes the DCS bands that cover 1842.5 ±37.5MHz, the U504 filter passes the

PCS bands that cover 1960±30MHz.

These filters degrade other band signals with high passing loss of 30~60 dB. The EGSM and DCSand PCS’s maximum insertion loss is 3.5 dB.

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Fig.4-7. Receiver part PCB Layout

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4.2.4 Transmit Section

4.2.4.1 An Overview of Transmit Section

Fig.4-8. Transmitter block diagram The transmit (TX) section consists of an I/Q baseband upconverter, an offset phase-locked loop (OPLL) and two 50 ohms output buffers that can drive external power amplifiers (PA), one for the EGSM 900 (880 – 915 MHz) bands and others for the DCS 1800 (1710 – 1785 MHz) bands and PCS1900(1850 – 1910MHz). The OPLL requires no external duplexer to attenuate transmitter noise and spurious signals in the receive band, saving both cost and power. Additionally, the output of the transmit VCO (TXVCO) is a constant-envelope signal which reduces the problem of spectral spreading caused by nonlinearity in the PA. A quadrature mixer upconverts the differential in-phase (TXIP,TXIN) and quadrature(TXQP,TXQN) signals with the IFLO to generate a SSB IF signal which is fitered and usesd as the reference input to the OPLL. The Si4133T generates the IFLO frequency between 766 and 896 MHz. The IFLO is divided by two to generate the quadrature LO signals for the quadrature modulator, resulting in an IF between 383 and 448 MHz. The OPLL consists of a feedback mixer, a phase detector, a loop filter, and a fully integrated TXVCO. The TXVCO is centered between the DCS 1800 and PCS 1900 bands, and its output is divided by two for the generate the RFLO frequency between 1272 and 1483 MHz. To allow a single VCO to be used for the RFLO, high-side injection is used for the EGSM 900 bands, and low-side injection is used for the DCS 1800 and PCS 1900 bands. The I and Q signals are automatically swapped when switching bands.

Low-pass fitlers before the OPLL phase detector reduce the harmonic content of the quadrature

modulator and feedback mixer outputs. The cutoff frequency of the filters is programmable.

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4.2.4.2 Transmitter Part

A. 6 dB attenuator : Z705, Z706

These passive components are used for PAM to operate in a stable output power.

B. ASM(Antenna Switch Module / built in LPF): Z702

These filters pass through the signals of which frequency band of 880~915MHz, 1710MHz~1785MHz,1930MHz~1990MHz which is the transmit frequency of GSM, DCS, PCS system terminal, and it suppresses other images and spurious frequencies when the terminal transmits GMSK modulated frequencies.

C. Power AMP Module(PAM): U701

This device amplifies signals ahead of transmiting them through the antenna to provide a

sufficient RF power. It has amplification factor of 28dB and efficiency of about 55% typically in GSM

band and amplification of 27dB and efficiency of about 52% typically DCS and PCS band,

D. RF Switch connector: J701

RF Swithc connector used to test Mainboard’s RF characteristics.

E. Antenna: Antenna Contact Plate ; J702

This device enables signals to be transmitted and received from BTS by Um interface.

External Antenna can be contacted with Mainboard through Antenna Contact Plate.

Fig.4-9. Transmit part PCB Layout

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4.2.5 Offset PLL

4.2.5.1 An Overview of Synthesizer

Fig.4-10. Si4133T Frequency Synthesizer Block Diagram

The Aero I transceiver integrates two complete PLLs including VCOs, varactors, resonators, loop

filters, reference and VCO dividers, and phase detectors. The RF PLL uses two multiplexed VCOs.

The RF1 VCO is used for receive mode, and the RF2 VCO is used for transmit mode. The IF PLL is

used only during transmit mode. All VCO tuning inductors are also integrated.

The IF and RF output frequencies are set by programming the N-Divider registers, NRF1, NRF2

and NIF. Programming the N-Divider register for either RF1 or RF2 automatically selects the proper

VCO. The output frequency of each PLL is as follows:

fOUT= N×fφ

The DIV2 bit in register 31h controls a programmable divider at the XIN pin to allow either a 13 or 26

MHz reference frequency. For receive mode, the RF1 PLL phase detector update rate (fφ ) should be

programmed fφ = 100 kHz for DCS 1800 and PCS 1900 bands, and fφ = 200 kHz for GSM 850 and

E-GSM 900 bands. For transmit mode, the RF2 and IF PLL phase detector update rates are always f

φ =200 kHz.

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4.2.5.2 VC-TCXO(Voltage Controlled Temperature Compensated Crystal Oscillator): V801

This is the mobile station’s reference frequency source. Its frequency is 13MHz, this signal is applied to Si4205(U501)_ pin8 and AD6525(U101).

Fig.4-11. Top view of VCTCXO part on the PCB artwork

Fig.4-12. VCTCXO schematic circuit

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Section 5. Alignment Procedure

5.1 Recommended Test Equipment

Model No. Description Maker Remark

8960

8593E Spectrum Analyzer Hewlett Packard TDS 340A Oscilloscope Tektronix FLUKE 87 Digital Multimeter Fluke E3630A DC Power Supply Hewlett Packard

Others Accessory

GSM Mobile Station Test Set

Agilent Technologies

5.2 Connection of Test Equipment

Interface Connectors RF Connectors

Fig.5-1. Test Set Configuration

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SECTION 6. Equipment Repair Procedure

6.1 No Power On with battery Applied.

6.1.1 Power CHECK

1. Check battery power : 3.5V~4.2V.

VBATT GND

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2. Check to see if C114.1 or C149.1 or C115.1 pin voltage is same with battery power : CP100

CP100

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3. Check to see if Q101.5,6 and R135.1 pin is same with battery power : CP101

CP101

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4. Check to see if U102 and C167, C168, C170, C171, C172, C173, C174 pin is 2.8V_EXT,

2.8V_M, 1.8V_D, VMIC, VTCXO, VSIM, 1.95V_RTC : CP102

CP102

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6. Check to see if U102.R7 or D101, D102, C144.1, R137.2 pin becomes to 0V : CP103

Pressing “END” key to turn on equipment.

7. Check to see if C100 and C101 is 1.8V_D : CP104

CP103

CP104

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8. Check to see if U1.K5,J5 pin and C123.1 is 2.8V_M : CP105

CP105

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9. Check to see if U107.2 pin and C230.1 pin is 2.8V_EXT : CP106

CP106

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6.1.2 Oscillation CHECK

1. Check to see if U101 No. A3 and B3 pin is oscillated(32.768KHz) : CP107

NO Æ Check R118 and then replace X101

CP107

2. Check to see if U107.4 pin Master Clock(13MHz). : CP108

NO Æ Check U107 No. 1.2 pin and then check the PCB pattern, soldering

CP107

CP108

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6.1.3 KEYPAD LED Not in Operation

1. Check to see if R171 ~ R175, R180 are same with battery voltage : CP110

NO Æ Replace the resistors.

2. Check R170.2 signal (control PWM) : CP112

3. Check Q102

CP110

CP111

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6.1.4 LCD Backlight Not in Operation (White)

1. Check to see if R40.2, R41.2 pins are controlled GPIO (2.8V): CP112

CP112

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6.2 Audio Part ( Earpiece, Hands-free Earphone, Microphone, Hands-free Mic )

6.2.1 No receiving tone heard ( Ear-piece )

1. Check U102.J15 and K15(R12,R19) pins (Ear Signal) for waveform : CP113

NO Æ Replace U102.

2. Check R6.2, C28.1 pins are same battery voltage. : CP114

CP113

CP114

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6.2.2 No Receivng tone heard ( Hands-free Earphone )

1. Check to see if U101.B11 (V1) is around 0V: CP116

NO Æ Check to see J106 : CP115

Set to HP8922M to connect a call and then set to 1kHz.

2. Check C133.1 pin for waveform : CP116

3. Check Hands-free Earphone

CP115

CP116

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6.2.3 Side Tone Not transmitted ( Ear-piece )

Repeat 6-2-1 No receiving tone heard.( Ear-piece )

1. Check to see if Mic + pin is around 2.4V : CP117

NO Æ Check that R153, C184, C155 and R154 is cold solder, broken, short to the other

PCB pattern or not

If you find out any defective part, you replace it.

Set to HP8922M to connect a call and then set to 1kHz with Echo audio mode.

2. Check R153.1 pins for wave form : CP118

NOÆ Replace MIC

CP117

CP118

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6.2.4 Side Tone Not transmitted ( Hands-free Mic. )

Repeat 6-2-2 No receiving tone heard.( Hands-free Earphone ).

1. Check to see if R20.1 pin is 2.5V : CP119

NO Æ Check that C160 is cold solder,broken,short to the other

PCB pattern or not.

If you find out any defective part, you replace it.

Set to HP8922M to connect a call and then set to 1kHz with Echo audio mode.

3. Check C160.1 pins for wave form : CP119

NO Æ Replace Handsfree Mic.

CP119

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6.2.5 Hook Switch not working

1. Check to see if Q1.2 pin is 2.4V : CP120

2. Check to see if Q1.1 pin is 0V during pressing Hook Switch : CP120

NO Æ Check that R16 and R21 cold solder, broken, short to the other PCB pattern or not

If you find out any defect, you replace it

3. Check to see if Q1.1 pin is around 0V, when you press Hook Switch : CP120

NOÆ Check that Q1 cold solder, broken, short to the other PCB pattern or not

If you find out any defect, you replace it

CP120

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6.2.6 Melody not ringing

1. Check to see if U104.32, 7 is 2.8V : CP121

2. Check to see if U104.15 is Vbat : CP121

3. Check U104.12, 13, and 14 pin for waveform : CP122

NO Æ Check that C181, R167, C182, R168 cold solder, broken, short to the other

PCB pattern or not

If you find out any defect, you replace it

4. Check SPK. SPOUT1 and SPOUT2 for waveform : CP123

NO Æ Replacd SPK

CP121

CP122

CP123

CP121

CP122

CP123

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6.2.7 Vibrator not working

1. Check to see if Q103.1 pin is 2.8V (duty : 60%, 70Hz) : CP124

NO Æ Check to see Q103 cold solder, broken, short to the other PCB pattern or not

If you find out any defect, you replace it

2. Check to see R131 is same with battery power : CP125

NO Æ Check to see Q103 and R10 cold solder, broken, short to the other PCB pattern or not

If you find out any defect, you replace it

3.Check to see Vibrator

If you find out any defect, you replace it

CP124

CP125

CP124

CP125

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6.3 SIM card part

6.3.1 SIM error

1. Check to see if J103.1 pin is around 2.85V : CP126

NO Æ Check to see C146.1 pin cold solder, broken, short to the other PCB pattern or not :

CP141

If you find out any defect, you replace it

2.Check to see J103.2, 3, 6 for wave form : CP127

NO Æ Check to see J103, R133 and C136 cold solder, broken, short to the other PCB pattern

or not

If you find out any defect, you replace it

CP126

CP127

CP126

CP127

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6.4 Charger part

6.4.1 Charging error

Insert adaptor into I/O jack.

1. Check to see if F100, D104.1 pin is 5.2V : CP128

NO Æ Check to see J101.23, 24(I/O connector) pin and F100, D104.1 cold solder, broken,

short to the other PCB pattern or not :

If you find out any defect, you replace it

2. Check to see Q101 No.2 pin is 5.2V : CP129

NO Æ Check to see Q101, R135, R133, R134 cold solder, broken, short to the other PCB

pattern or not

If you find out any defect, you replace it

3. Check to see R135.1 and R135.2 between voltage is about 135Mv : CP130

CP128

CP129

CP130

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CP128

6.5 RF Part

CP128

6.5.1 Test conditions

1. Test condition 1 : VBAT = 3.8V during all tests

2. Test condition 2 : Traffic channel :EGSM Band

Tx mode

Ch62

Power Level : 13

2. Test condition 3: Traffic channel :DCS Band

Tx mode

Ch698

Power Level : 10

3. Test condition 4 : Traffic channel : PCS Band

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Tx mode

Ch661

Power Level : 10

4. Test condition 5 : Traffic channel :GSM Band

Rx mode

Ch62

Input power : -70dBm

2. Test condition 6: Traffic channel :DCS Band

Rx mode

Ch698

Power Level : -70dBm

5. Test condition 7 : Traffic channel : PCS Band

Rx mode

Ch661

Input power : -70dBm

6. RF power values are measured using 50Ωcoaxial cable.

6.5.2 Power Supply Check Point

Step

2-1

2-2

2-3

2-4

Te st

point

U505 Pin#1

U505 Pin#5

U505 Pin#4

U505 Pin#5

Typical Value Condition Checking Point

3.8V 2, 3, 4, 5 Check route connection : VBAT

2.8V 2, 3, 4, 5 Check route connection : VBAT

3.8V 2, 3, 4, 5 Check route connection : VBAT

2.8V 2, 3, 4, 5 Check route connection : VCC_RFCHIP

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Fig.6-1 U505 Regulator Power Supply PCB Layout

Fig.6-2 U505 Regulator Power Supply Schematic

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6.5.3 Power Amplifier Module

- First check the Power Supply Check point following 6.5.2. Then you can trace the guideline of PAM as

follows .

Step

3-1

3-2

Te st

point U701 Pin#3

U701 Pin#2

STEP 3-2

Typical Value Condition Checking Point

Logic High 2, 3 Check route connection : TXEN

Logic High 3, 5

Check this pin 2, When Logic High, then DCS/PCS Mode. While Logic

Logic Low 2, 4

Low , GSM mode is operating.

STEP 3-1

Fig.6-5. PAM TXONPA Test Point Circuit

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STEP3-1

STEP3-2

6.5.4 VCTCXO

Step

4-1

4-2

Te st

point V801 Pin#1 V801 Pin#4

Fig.6-7. PAM TXONPA and BSSEL Test Point on the PCB Layout

Typical Value Condition Reaction to Abnormality

0.5V ~ 2.5V 2, 3, 4, 5 Check route connection : AFC

2.8V 2, 3, 4, 5 Check route connection : VTCXO

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STEP4-2

STEP 4-1

Fig.6-8. VCTCXO Check Point Circuit

STEP 4-1

STEP4-2

Fig.6-9. VCTCXO Check Point on the PCB Layout

6.5.5 Antenna Switch Module

Step Test point Typical Value Condition Check point

When Pin#11 is Logic High and Pin#2 Pin#3 is Logic Low the mode is EGSM band. While Pin#2 is Logic High and Pin#11and Pin#3 is Logic Low the operating mode is DCS band. While Pin#3 is Logic High and Pin#11and Pin#2 is Logic Low the operating mode is PCS band

5-1

5-2

5-3

Z702 Pin#1

Z702 Pin#2

Z702 Pin#3

2.8V 2

2.8V 3

2.8V 4

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STEP 5-3

STEP 5-2

STEP 5-1

Fig. 6-10 Antenna Switch Module Circuit

STEP 5-1

STEP 5-2

Fig. 6-11 Antenna Switch Module PCB Layout

STEP 5 -3

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