Electrostatically Sensitive (ES) Devices
2 About lead free solder (PbF)
3 Conductor Views
3.1. HT-Board (TY-37/42TM5T)
4 Block and Schematic Diagrams
4.1. Schematic Diagram Notes
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4.2. HT-Board (TY-37/42TM5T) Block Diagrams
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4.3. HT-Board (1 of 2) (TY-37/42TM5T) Schematic Diagrams
4.4. HT-Board (2 of 2) (TY-37/42TM5T) Schematic Diagrams
5 Replacement Parts List
5.1. Replacement Parts List Notes
5.2. Replacement Parts List
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TY-42TM5T / TY-37TM5T
1Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
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TY-42TM5T / TY-37TM5T
2About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
Caution
·Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 ーF (30~40ーC) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 ーF (370 ± 10 ーC).
·Pb free solder will tend to splash when heated too high (about 1100 ーF or600ーC).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
Components identified by mark have special characteristics important for safety.
When replacing any of these components, use only manufacture's specified parts.
Notes:
1. Resistor
All resistors are cabon 1/4W resistor, unless marked as follows:
Unit of resistance is OHM [W] (K=1,000, M=1,000,000).
: Nonflammable: Metal Oxide
: Solid: Metal Film
: Wire Wound: Fuse:
2. Capacitor
All capacitors are ceramic 50V capacitor, unless marked as follows:
Unit of capacitance is mF, unless otherwise noted.
: Temperature Compensation: Electrolytic
: Polyester: Bipolar
3. Coil
Unit of inductance is mF, unless otherwise noted.
4. Test Point
: Test Point position
5. Earth Symbol
: Chassis Earth (Cold): Line Earth (Hot)
6. Voltage Measurement
Voltage is measured by a DC voltmeter.
Conditions of the measurement are the following:
Power Source ................................................... AC 120V, 50/60Hz
Receiving Signal ............................................... Colour Bar signal (RF)
All customer's controls ...................................... Maximum positions
7. Number in red circle indicates waveform nember.
(See waveform pattern table.)
8. When arrow mark ( ) is found, connection is easily found from the direction of arrow
NP
+
-
Z
(North America model)/AC220-240V,
50/60Hz (Except North America)
TY-42TM5T / TY-37TM5T
Remarks:
1. The Power Circuit contains a circuit area which uses a separate power supply to isolate the
earth connection.
The circuit is de fined by HOT and COLD indications in the schematic diagram. Take the
follwing precautions.
All circuits, except the Power Circuit, are cold.
Precautions
a. Do not touch the hot part or the hot and cold parts at the same time or you may
be shocked.
b. Do not short- circuit the hot and cold circuits or a fu se may blow and parts may
break.
c. Do not connect a n instrument, such as an oscilloscope, to th e hot and cold
circuits simulta neously or a fuse may blow.
Connect the earth of instruments to the earth connection of the circuit being
measured.
d. Make sure to disconnect the pow er plug before removing the chassis.
2. Following diodes are interchangeable.
MA150- MA162 (Replacement part)
9. Indicates the major signal flow.: VideoAudio
10. This schematic diagram is the latest at the time of printing and subject to change without
notice.