• Repair service shall be provided in accordance with repair technology information such as service manual so as to prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2Warning
2.1.Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacture’s Instructions.
2.2.About Lead Free Solder (Pbf: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50 °F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer’s
specific instructions for the melting points of their products and any precautions for using their product with other materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.3.Discarding of P.C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
The power is supplied to the DECT BBIC, RF Module, EEPROM and Charge Contact from AC Adaptor (+6.5 V) as shown in
Fig.101. The power supply is as follows;
• DECT BBIC (IC7):
DC Jack (+6.5 V) →D1→ IC1 → IC7
DC Jack (+6.5 V) →D1→ IC1 → Q9 → IC7
DC Jack (+6.5 V) →D1→ IC1 → Q8 → IC7
• RF Power Amp. (IC801):
DC Jack (+6.5 V) →D1→ IC1 → IC801 (Power AMP)
• EEPROM (IC401):
DC Jack (+6.5 V) →D1→ IC1 → IC7→ IC401
• Charge Contact (TP16):
DC Jack (+6.5 V) →D1→ R56 → R55 → D22→ TP16
Bell & Clip (: Calling Line Identification Presentation: Caller ID) signal detection:
In the standby mode, Q3 is open to cut the DC loop current and decrease the ring load.
When ring voltage appears at the L1T (A) and L1R (B) leads (when the telephone rings), the AC ring voltage is transferred as
follows;
•B → L2 → C4 → R6 → R33 → IC7 Pin 21 (CID INp)
•A → L1 → C3 → R4 → R35 → IC7 Pin 20 (CID INn)
ON/OFF hook circuit:
In the standby mode, Q3 is open, and connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an on-hook condition.
When IC7 detects a ring signal or press the TALK Key onto the handset, Q4 turns on and then Q3 turns on, thus providing an
off-hook condition (DC current flows through the circuit) and the following signal flow makes the loop current.
• Audio Circuits and DTMF tone signal circuits.
Base Unit and Handset mainly consist of RF Module and DECT BBIC.
Base Unit and Handset transmit/receive voice signal and data signal through the antenna on carrier frequency.
Signal Path:
*Refer to Signal Route (P.14).
4.2.4.1.Transmitter Block
The voice signal input from the TEL LINE interface goes to RF Power Amp. (IC801) through DECT BBIC (IC7) as shown in
Block Diagram (Base Unit) (P.7)
The voice signal passes through the analog part of IC7 where it is amplified and converted to a digital audio stream signal. The
burst switch controller processes this stream performing encryption and scrambling, adding the various other fields to produce
the GAP (Generic Access Profile) standard DECT frame, assigning to a time slot and channel etc.
In IC7, the carrier frequency is changing, and frequency modulated RF signal is generated.In IC801,RF signal is amplified, and
radiated from antenna. Handset detects the voice signal or data signal in the circuit same as the following explanation of
Receiver Block.
4.2.4.2.Receiver Block
The signal of 1900 MHz band (1881.792 MHz ~ 1897.344 MHz) which is input from antenna is input to IC7 as shown in Block
Diagram (Base Unit) (P.7).
In IC7, the signal of 1900 MHz band is downconverted to 864 kHz signal and demodulated, as GAP (Generic Access Profile)
standard DECT frames. It passes through the decoding section burst switch controller where it separates out the frame information and performs de-encryption and de-scrambling as required. It then goes to the DSP section where it is turned back into ana-
log audio. This is amplified by the analog front end, and goes to the TEL LINE Interface.
4.2.4.3.Pulse Dialling
During pulse dialing the hookswitch (Q3, Q4) is used to generate the pulses using the HOOK control signal, which is set high
during pulses. To force the line impedance low during the “pause” intervals between dial pulses, the PULSE_DIAL signal turns
Handset consists of the following ICs as shown in Block Diagram (Handset) (P.11).
• DECT BBIC (Base Band IC): IC1
- All data signals (forming/analyzing ACK or CMD signal)
- All interfaces (ex: Key, Detector Circuit, Charge, DC/DC Converter, EEPROM, LCD, RF Power Amp.)
- PLL Oscillator
- Detector
- Compress/Expander
- Reception
• RF Power Amp: IC801
- Amplifier for transmission
• EEPROM: IC3
- Temporary operating parameters (for RF, etc.)
4.4.2.Power Supply Circuit/Reset Circuit
Circuit Operation:
When power on the Handset, the voltage is as follows;
BATTERY(2.2 V ~ 2.6 V: BATT+) → F1 → Q2 (1.8 V), IC1-43pin (2.5V)
The Reset signal generates IC1 (61 pin) and 1.8 V.
4.4.3.Charge Circuit
Circuit Operation:
When charging the handset on the Base Unit, the charge current is as follows;
DC+(6.5 V) → D1 → R56 → R55 → D22 → CHARGE+(Base) → CHARGE+(Handset) → Q4 → D7→ F1 → BATTERY+... Battery...
BATTERY- → R45 → GND → CHARGE-(Handset)→ CHARGE-(Base) → GND → DC-(GND)
In this way, the BBIC on Handset detects the fact that the battery is charged.
The charge current is controlled by switching Q9 of Handset.
Refer to Fig.101 in Power Supply Circuit (P.9).
4.4.4.Battery Low/Power Down Detector
Circuit Operation:
“Battery Low” and “Power Down” are detected by BBIC which check the voltage from battery.
The detected voltage is as follows;
• Battery Low
Battery voltage: V(Batt) 2.25 V ± 50 mV
The BBIC detects this level and "" starts flashing.
• Power Down
Battery voltage: V(Batt) 2.0 V ± 50 mV
The BBIC detects this level and power down.
4.4.5.Speakerphone
The hands-free loudspeaker at SP+ and SP- is used to generate the ring alarm.
The battery strength may not be indicated correctly if the
battery is disconnected and connected again, even after it is
fully charged. In that case, by recharging the battery as
mentioned above, you will get a correct indication of the
battery strength.